Patents by Inventor TSMC Solid State Lighting Ltd.

TSMC Solid State Lighting Ltd. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130314915
    Abstract: A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.
    Type: Application
    Filed: April 8, 2013
    Publication date: November 28, 2013
    Inventor: TSMC Solid State Lighting Ltd.
  • Publication number: 20130224892
    Abstract: A system and method for manufacturing an LED is provided. A preferred embodiment includes a substrate with a distributed Bragg reflector formed over the substrate. A photonic crystal layer is formed over the distributed Bragg reflector to collimate the light that impinges upon the distributed Bragg reflector, thereby increasing the efficiency of the distributed Bragg reflector. A first contact layer, an active layer, and a second contact layer are preferably either formed over the photonic crystal layer or alternatively attached to the photonic crystal layer.
    Type: Application
    Filed: April 5, 2013
    Publication date: August 29, 2013
    Inventor: TSMC Solid State Lighting Ltd.
  • Publication number: 20130157395
    Abstract: A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.
    Type: Application
    Filed: February 15, 2013
    Publication date: June 20, 2013
    Applicant: TSMC Solid State Lighting Ltd.
    Inventor: TSMC Solid State Lighting Ltd.
  • Publication number: 20130045556
    Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.
    Type: Application
    Filed: October 1, 2012
    Publication date: February 21, 2013
    Applicant: TSMC Solid State Lighting Ltd.
    Inventor: TSMC Solid State Lighting Ltd.