Abstract: A carrier for supporting workpieces to be polished is composed of an integrated mica laminated sheet. The mica laminated sheet is impregnated with a thermo-setting resin. The carrier has a low warp ratio and can be made thin with a sufficient mechanical strength and accuracy of thickness.

Abstract: A process and product by process of making a polishing sheet material especially useful in the polishing of silicon wafer is disclosed. There is known a process of producing a poromeric suede-like polyurethane layer which comprises applying a solution of polyurethane on an impermeable synthetic resin film, subjecting the polyurethane layer to wet coagulation to form a honeycomb-like cellular structure of polyurethane on the synthetic resin film, removing the synthetic resin film from the cellular polyurethane layer, and abrading a thin surface skin of the cellular layer to form the poromeric suede-like polyurethane layer. In the present invention, a supporting layer made of a non-poromeric, soft synthetic resin sheet having good flatness is joined to a reverse side of the suede-like polyurethane layer to form a polishing sheet material.