Abstract: A method of manufacturing a semiconductor device including mounting semiconductor chips, each chip having pads, on respective areas of a front surface of an assembly substrate, electrically connecting corresponding terminals on a rear surface of the assembly substrate through wirings of the assembly substrate to the pads of the semiconductor chips, respective terminals and wirings electrically connected to a semiconductor chip being confined within the corresponding area of the assembly substrate on which the semiconductor chip is mounted, inputting test waveforms to the pads of the plurality of semiconductor chips through the corresponding terminals and wirings and testing the semiconductor chips, and, after the testing the semiconductor chips, cutting the assembly substrate with a rotating blade into pieces corresponding to the respective areas. The terminals and wirings connecting the terminals to the semiconductor chips are not cut by the rotating blade.

Abstract: An assembly substrate, on which semiconductor chips, each having a terminal receiving a burn-in test waveform, are arranged, is detachably attached to a burn-in test adapter. The burn-in test adapter has wiring for, when an assembly substrate is attached to the burn-in test adapter, making an electrical contact with the terminal of each of the semiconductor chips on the assembly substrate. Moreover, the burn-in test adapter has a burn-in test terminal that is electrically connected to the wiring and that receives the burn-in test waveform.

Abstract: A block, which is an object to be scanned, of a semiconductor integrated circuit includes a scan flip-flop and a combinational circuit. A serial-parallel conversion unit receives serial scan output data output from the scan flip-flop of the block and converts the serial scan output data into parallel scan output data. A scan output storage stores the parallel scan output data output from the serial-parallel conversion unit, and outputs the parallel scan output data stored to outside of the semiconductor integrated circuit.

Abstract: A semiconductor integrated circuit including circuit groups and driving the circuit groups with respective power supply voltages, digital-to-analog converters that supply the power supply voltages to the circuit groups, and delay measurement circuits that measure delays of circuit element of the circuit groups. This semiconductor integrated circuit includes a central processing unit that establishes settings of registers based on measurements by the delay measurement circuits to control each of the power supply voltages.

Abstract: An address detection circuit is formed in a pod so that the circuit generates a detection signal DET when an address signal specifying an address in the address area assigned to a newly-added circuit section is outputted from an evaluation MCU, and a disabling circuit 313 is formed in a port emulation circuit 31a so that the circuit 313 disables an input/output circuit 312 from being set to the input state by responding to the detection signal DET.