Patents by Inventor Tsugunori Masuda
Tsugunori Masuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040238602Abstract: Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.Type: ApplicationFiled: February 3, 2004Publication date: December 2, 2004Applicants: Kabushiki Kaisha Tamura Seisakusho, Kabushiki Kaisha ToshibaInventors: Masahiko Furuno, Tsugunori Masuda, Hideo Aoki, Kazuhide Doi
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Patent number: 6742701Abstract: Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.Type: GrantFiled: May 30, 2002Date of Patent: June 1, 2004Assignees: Kabushiki Kaisha Tamura Seisakusho, Kabushiki Kaisha ToshibaInventors: Masahiko Furuno, Tsugunori Masuda, Hideo Aoki, Kazuhide Doi
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Publication number: 20030019917Abstract: Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.Type: ApplicationFiled: May 30, 2002Publication date: January 30, 2003Applicant: KABUSHIKI KAISHA TAMURA SEISAKUSHOInventors: Masahiko Furuno, Tsugunori Masuda, Hideo Aoki, Kazuhide Doi
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Patent number: 6364195Abstract: A first electromagnetic induction pump is disposed in a first reservoir, and a second electromagnetic induction pump is disposed in a second, independent, reservoir. Each reservoir is adapted to contain molten brazing filler metal. The electromagnetic induction pumps are effective to eject the brazing filler metal upward through wave forming portions into contact with an underside of a workpiece being conveyed along a workpiece conveyance path. The second reservoir is disposed downstream of the first reservoir in the direction of conveyance. At least one of the first and second reservoirs include a height adjusting device which permits adjusting the relative heights of the wave forming portions to adapt to the needs of the workpiece. The apparatus may be adapted to contain an intermediate space and an intermediate processing device between the reservoirs.Type: GrantFiled: May 1, 2000Date of Patent: April 2, 2002Assignee: Kabushiki Kaisha Tamura SeisakushoInventors: Tsugunori Masuda, Junichi Onozaki, Hiroshi Saito
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Patent number: 6050473Abstract: A first electromagnetic induction pump system includes a first plurality of electromagnetic induction pumps, arranged in the direction parallel to the width of workpiece. The first plurality of electromagnetic induction pumps extend vertically along a first vertical plate portion at a workpiece inlet side of a single reservoir. A second electromagnetic induction pump system includes a second plurality of electromagnetic induction pumps, arranged in the direction parallel to the width of workpiece. The second plurality of electromagnetic induction pumps extend vertically extends along a second vertical plate portion at the workpiece outlet side of the reservoir. Brazing filler metal is ejected upward in waves by the electromagnetic induction pump systems to braze workpieces carried by the ejected waves into and out of the device.Type: GrantFiled: August 10, 1998Date of Patent: April 18, 2000Assignee: Kabushiki Kaisha Tamura Seisa KushoInventors: Tsugunori Masuda, Junichi Onozaki, Hiroshi Saito
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Patent number: 5981922Abstract: A single reservoir contains brazing filler metal. A first electromagnetic induction pump extends vertically along a vertical plate portion at a workpiece inlet side. A second electromagnetic induction pump extends vertically along a vertical plate portion at the workpiece outlet side. Heaters for melting the brazing filler metal are disposed between the first electromagnetic induction pump and the second electromagnetic induction pump. Each electromagnetic induction pump has a first iron core having an induction coil wound therearound disposed at the outer side of a vertical plate portion at the workpiece inlet side or the workpiece outlet side respectively. A second iron core is disposed at the inner side of the respective vertical plate portion. A brazing filler metal rising gap is disposed between the second iron cores.Type: GrantFiled: June 11, 1998Date of Patent: November 9, 1999Assignee: Kabushiki Kaisha Tamura SeisakushoInventors: Tsugunori Masuda, Junichi Onozaki, Hiroshi Saito
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Patent number: 4846390Abstract: An automatic soldering apparatus wherein a fixture is conveyed sequentially and endlessly by an elevation mechanism of a loading unit, soldering conveyors of a plurality of units that relate to the soldering operation, an elevation mechanism of an unloading unit, and return conveyors of units relating to the soldering operation; works are automatically fitted to the fixture by the loading unit, and while the fixture is being conveyed by the soldering conveyor of each of the units which relate to the soldering operation and are combined with one another suitably, whenever necessary, the soldering operation of the works and other operations associated therewith are carried out; and the unloading unit automatically recovers the works from the fixture and the empty fixture is returned to the loading unit by the return conveyors of the units relating to the soldering operation so that the works are again fitted to the fixture by the loading unit.Type: GrantFiled: June 3, 1988Date of Patent: July 11, 1989Assignee: Kabushiki Kaisha Tamura SeisakushoInventors: Tsugunori Masuda, Shinsaku Kuranari, Yu Fukuhara
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Patent number: 4787550Abstract: An automatic soldering apparatus wherein a fixture is conveyed sequentially and endlessly by an elevation mechanism of a loading unit, soldering conveyors of a plurality of units that relate to the soldering operation, an elevation mechanism of an unloading unit, and return conveyors of units relating to the soldering operation; works are automatically fitted to the fixture by the loading unit, and while the fixture is being conveyed by the soldering conveyor of each of the units which relate to the soldering operation and are combined with one another suitably, whenever necessary, the soldering operation of the works and other operations associated therewith are carried out; and the unloading unit automatically recovers the works from the fixture and the empty fixture is returned to the loading unit by the return conveyors of the units relating to the soldering operation so that the works are again fitted to the fixture by the loading unit.Type: GrantFiled: August 20, 1987Date of Patent: November 29, 1988Assignee: Kabushiki Kaisha Tamura SeisakushoInventors: Tsugunori Masuda, Shinsaku Kuranari, Yu Fukuhara
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Patent number: 4682563Abstract: A jig for arraying and supporting a multiplicity of articles to be soldered wherein pairs of lower supporting wires are extended for supporting the lower side of respective articles between frame members adapted to be secured to a conveyor holder of a soldering line, pairs of upper supporting wires are arranged above the lower supporting wires in parallel with the latter along both side surfaces of respective articles, one end of each of the upper supporting wires being passed loosely through a hole formed on the frame member, and a gate member supporting the other ends of said upper supporting wires is provided movably up and down with respect to the frame member.Type: GrantFiled: October 11, 1985Date of Patent: July 28, 1987Assignee: Kabushiki Kaisha Tamura SeisakushoInventors: Tsugunori Masuda, Shoji Muto
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Patent number: 4603804Abstract: An automatic soldering apparatus which makes it possible to automate the whole steps, from the step of feeding the work to the step of collecting the same, as well as simultaneously enhance the reliability in transportation and the economy in soldering operation. The automatic soldering apparatus has a track type transportation mechanism for slidably transporting the body of the work having lead portions to be soldered, through a track constituted by a plurality of long guide members; a fluxing unit and a soldering unit provided with respect to the track of the track type transportation mechanism and adapted to flux and solder the lead portions, respectively; a work feed unit provided at the starting end of the track type transportation mechanism and adapted to feed the work to the track type transportation mechanism; and a work collecting unit provided at the terminating end of the track type transportation mechanism and adapted to collect the work from the track type transportation mechanism.Type: GrantFiled: April 25, 1984Date of Patent: August 5, 1986Assignee: Kabushiki Kaisha Tamura SeisakushoInventors: Kota Takeda, Tsugunori Masuda