Abstract: Metals to be bonded are drawn from pay-off reels and passed around holding rollers which are grounded cathodes, each roller being partially exposed in an etching chamber having an anode area at least three times the exposed area of the cathode. Each chamber has an inert gas at from 10.sup.-4 to 10.sup.-1 Torr and is subjected to RF power with a frequency from 1 to 50 MHz, which by a magnetic field produced by fixed magnets in the holding roller produces a glow discharge plasma which etches the metal in the chamber. Etched surfaces of the strips are then rolled together in a vacuum of from 10.sup.-6 to 10.sup.-3 Torr and a temperature to 300.degree. C. at a rolling pressure sufficient to effect a thickness reduction from 0.1 to 30%.