Abstract: A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface which are in a front and back relationship, a first protective film formation step of forming a first protective film in a second groove formation region when a region of the quartz crystal substrate where the vibrator is formed is referred to as an element formation region, a region where the first groove is formed is referred to as a first groove formation region, and a region where the second groove is formed is referred to as the second groove formation region, a second protective film formation step of forming, in the first groove formation region, a second protective film having a lower etching rate than the first protective film, a third protective film formation step of forming a third protective film in a region of the element formation region other than the first groove formation region and the second groove formation region, and a first dry etching st

Abstract: A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface which are in a front and back relationship, a first film formation step of forming a first stacked body by sequentially stacking a first underlying film, a second underlying film, and a first protective film at the first surface, a first patterning step of patterning the first stacked body in a manner in which the first underlying film, the second underlying film, and the first protective film remain in a region of an element formation region other than a first groove formation region and a second groove formation region, the first underlying film and the second underlying film remain in the first groove formation region, and the first underlying film remains in the second groove formation region, and a first dry etching step of dry etching the quartz crystal substrate from the first surface through the first stacked body.

Abstract: A method for manufacturing a vibrator includes a preparation step of preparing a quartz crystal substrate having a first surface and a second surface which are in a front and back relationship, a first protective film formation step of forming a first protective film in a region of an element formation region other than a first groove formation region and a second groove formation region when a region of the quartz crystal substrate where the vibrator is formed is referred to as the element formation region, a region where the first groove is formed is referred to as the first groove formation region, and a region where the second groove is formed is referred to as the second groove formation region, a first dry etching step of dry etching the quartz crystal substrate from the first surface through the first protective film, a second protective film formation step of forming a second protective film in the first groove formation region, and a second dry etching step of dry etching the quartz crystal substrate

Abstract: A semiconductor device (1) includes: a semiconductor chip (2) having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate (3) opposed to the first main surface; a first electrode (5) disposed between the first main surface and the heat dissipating plate (3) so as to be electrically connected to the semiconductor chip (2); a pressure contact member (4) opposed to the second main surface; a second electrode (6) disposed between the second main surface and the pressure contact member (4) so as to be electrically connected to the semiconductor chip (2); and a pressure generating mechanism that generates a pressure for pressing the first electrode (5) into contact with the heat dissipating plate (3) and the semiconductor chip (2) and pressing the second electrode (6) into contact with the pressure contact member (4) and the semiconductor chip (2).

Abstract: An absorbent article that enables the presence of moisture, for example, derived from urination to be easily recognized. The absorbent article includes an outer sheet provided on a side that faces a wearer's skin, i.e., on its side facing a liquid-absorbent structure with moisture visualizing elements. The moisture visualizing elements are formed by coating the outer sheet with hot melt composition comprising pH indicator mixed with pressure-sensitive adhesive ingredient. Two or more stripes of the hot melt composition forming the moisture visualizing elements extend in a longitudinal direction at least across a crotch region. Between the moisture visualizing elements and the liquid-absorbent structure, there is provided a barrier sheet or barrier sheets extending in a transverse direction so as to intersect the moisture visualizing elements comprising two or more stripes of the hot melt composition.

Abstract: A semiconductor device (1) includes: a semiconductor chip (2) having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate (3) opposed to the first main surface; a first electrode (5) disposed between the first main surface and the heat dissipating plate (3) so as to be electrically connected to the semiconductor chip (2); a pressure contact member (4) opposed to the second main surface; a second electrode (6) disposed between the second main surface and the pressure contact member (4) so as to be electrically connected to the semiconductor chip (2); and a pressure generating mechanism that generates a pressure for pressing the first electrode (5) into contact with the heat dissipating plate (3) and the semiconductor chip (2) and pressing the second electrode (6) into contact with the pressure contact member (4) and the semiconductor chip (2).

Abstract: A wiring board connection method comprising: arranging a continuous conductive joint body on adjacent connection terminals of one of the wiring boards in a space between the adjacent connection terminals on one of the wiring boards; aligning the wiring boards so that the connection terminals face each other with the conductive joint body interposed therebetween; and bonding the connection terminals with each other by heating and then cooling the conductive joint body, wherein: the conductive joint body is a material that generates air bubbles upon being heated; and a recessed portion is formed on a surface of at least one of the connection terminals, the surface being opposite to the connection terminal of another wiring board. When the connection terminals are bonded with each other, the conductive joint body is allowed to move so as to gather on the surfaces of the connection terminals where no recessed portions are formed.

Abstract: In an absorbent article 1, an absorber 30 is arranged between a liquid-permeable topsheet 10 and a liquid-impermeable backsheet 20, and the absorber 30 includes electrolyte particles as a hygroscopic material 70. This enables exhibition of a sufficient hygroscopicity during wearing and more surely suppress a discomfort of a wearer due to sweatiness or tackiness.

Abstract: A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the electrode 11, with the adhesive strength between the electrode 11 and the easy peeling portion 12 being less than the adhesive strength between the electrode 11 and the base material 10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.

Abstract: A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

Abstract: An absorbent article that enables the presence of moisture, for example, derived from urination to be easily recognized. The absorbent article includes an outer sheet provided on a side that faces a wearer's skin, i.e., on its side facing a liquid-absorbent structure with moisture visualizing elements. The moisture visualizing elements are formed by coating the outer sheet with hot melt composition comprising pH indicator mixed with pressure-sensitive adhesive ingredient. Two or more stripes of the hot melt composition forming the moisture visualizing elements extend in a longitudinal direction at least across a crotch region. Between the moisture visualizing elements and the liquid-absorbent structure, there is provided a barrier sheet or barrier sheets extending in a transverse direction so as to intersect the moisture visualizing elements comprising two or more stripes of the hot melt composition.

Abstract: A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

Abstract: According to an absorptive article (disposable diaper) 10 of the present invention, an absorber (absorptive structure) 12 is provided with a first region 55 disposed on an internal surface sheet 41 side and having a higher content ratio of the superabsorptive polymer than a content ratio of the hydrophilic fiber, a second region 56 disposed on an external surface sheet 42 side and having a lower content ratio of the superabsorptive polymer than the content ratio of the superabsorptive polymer in the first region and a higher content ratio of the hydrophilic fiber than the content ratio of the hydrophilic fiber in the first region, and a space that penetrates from the external surface sheet 42 side of the second region 56 to the first region 55, and that can be entered by the superabsorptive polymer that is swollen by absorbing a body fluid in the first region 55.

Abstract: A liquid resin in which conductive particles are dispersed is supplied to between a circuit substrate and a semiconductor chip disposed so as to face each other and an ultrasonic wave having an amplitude in a perpendicular direction to a surface of the circuit substrate to generate a standing wave in a resin. Then, the conductive particles dispersed in the resin are captured at nodes of the standing wave to form connection bodies of aggregation of the conductive particles between connection terminals of the semiconductor chip and terminals of the circuit substrate. Thus, the semiconductor chip is mounted on the circuit substrate via the connection bodies. The terminals are arrayed so as to be spaced apart from one another by half a wavelength of the standing wave and each of the nodes of the standing wave are generated at a position between the terminals in the resin.

Abstract: One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XY? direction.

Abstract: A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package (100) comprising a semiconductor chip (10) and a mounting substrate (30), a plurality of electrode terminals (12) are formed on the surface (10a) of the semiconductor chip (10) opposing the mounting substrate side, connection terminals (32) respectively corresponding to the plurality of electrode terminals (12), are formed on the mounting substrate (30), the connection terminals (32) on the mounting substrate (30) and the electrode terminals (12) are electrically connected collectively by solder bumps (17) formed in self-assembly, an electrode pattern (20) not connected with the electrode terminals (12) and the connection terminals (32) is formed on the chip surface (10a) or the surface (35) of the mounting substrate (30) corresponding to the chip surface (10a), and solder (19) is accumulated on the electrode pattern (20).

Abstract: A flip chip mounting body in which a circuit substrate having a plurality of connection terminals and an electronic part (semiconductor chip) having a plurality of electrode terminals are aligned face to face with each other, with a resin composition composed of solder powder, a resin and a convection additive being sandwiched in between, while a means such as spacers is interposed in between so as to provide a uniform gap between the two parts, or the electronic part (semiconductor chip) is placed inside a plate-shaped member having two or more protruding portions, so that the solder powder is allowed to move through boiling of the convection additive and to be self-aggregated to form a solder layer, thereby electrically connecting the connection terminals and the electrode terminals; and a mounting method for such a mounting body.

Abstract: [Problem] To improve productivity and reliability in mounting an electronic component. [Means for Solving Problems] At least one of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal of the electronic component and the connecting terminal of the wiring substrate are made to abut each other in a state where one of the wiring substrate and the electronic component, whichever is not secured, is held. Then, the electronic component is heated so that the solder is melted, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by means of the solder.

Abstract: On a first component built-in substrate having built-in electronic components, a second component built-in substrate having built-in electronic components is stacked, and further on the second component built-in substrate, a radiator is attached. The second component built-in substrate includes a wiring layer with electronic components mounted on a main surface thereof, and an insulating layer which is mainly composed of a mixture containing an inorganic filler and a thermosetting resin and in which the electronic components mounted on the wiring layer are embedded. The insulating layer of the second component built-in substrate conducts heat generated from the electronic components and the wiring layer to the radiator.

Abstract: An electronic component-containing module includes an electrically insulating substrate; and a first electronic component and second electronic component embedded in the electrically insulating substrate, wherein the first electronic component protrudes partially from at least one surface of the electrically insulating substrate, and the second electronic component is contained in the electrically insulating substrate.