Patents by Inventor Tsukasa TAKAIWA

Tsukasa TAKAIWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor devices including conductive structure and shielding layer and methods of manufacturing semiconductor devices
    Patent number: 11967565
    Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: April 23, 2024
    Assignee: Amkor Technology Japan, Inc.
    Inventors: Takahiro Yada, Tsukasa Takaiwa
  • SEMICONDUCTOR DEVICES INCLUDING SHIELDING LAYER AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
    Publication number: 20220375873
    Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: June 13, 2022
    Publication date: November 24, 2022
    Applicant: Amkor Technology Japan, Inc.
    Inventors: Takahiro YADA, Tsukasa TAKAIWA
  • Semiconductor devices including shielding layer and methods of manufacturing semiconductor devices
    Patent number: 11362041
    Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: June 14, 2022
    Assignee: Amkor Technology Japan, Inc.
    Inventors: Takahiro Yada, Tsukasa Takaiwa
  • SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
    Publication number: 20210193587
    Abstract: In one example, a semiconductor structure or device comprises a substrate comprising a conductive structure having a top side and a first shielding terminal on the top side of the conductive structure, an electronic component on the top side of the conductive structure, a package body on the top side of the conductive structure and contacting a side of the electronic component, a shield on a top side of the package body and a lateral side of the package body, and a shield interconnect coupling the shield to the first shielding terminal of the conductive structure. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: December 19, 2019
    Publication date: June 24, 2021
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Takahiro YADA, Tsukasa TAKAIWA