Patents by Inventor Tsukimi Endo

Tsukimi Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7106356
    Abstract: A method of producing a wear-resistant protective film for a thermal head comprises depositing a wear-resistant protective film by sputtering on a thermal head which includes a substrate, and a heat-developing layer and a pair of electrodes formed on either the substrate or a heat-regenerative layer formed thereon. A layer of the wear resistant protective film is formed under a RF larger bias and another layer without a bias or with a smaller bias. Good step coverage is obtained by the RF sputter layer of the wear-resistant and the protective film prevents the intrusion of water that can cause cracking, and the layer formed under no or smaller bias reduces internal stresses and inhibits the development of cracks due to internal stresses as well as the cracking by RF sputtering.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: September 12, 2006
    Assignee: TDK Corporation
    Inventors: Masatoshi Nakayama, Masahiro Nakano, Tsukimi Endo
  • Publication number: 20030035044
    Abstract: A method of producing a wear-resistant protective film for a thermal head comprises depositing a wear-resistant protective film by sputtering on a thermal head which includes a substrate, and a heat-developing layer and a pair of electrodes formed on either the substrate or a heat-regenerative layer formed thereon. A layer of the wear resistant protective film is formed under a RF larger bias and another layer without a bias or with a smaller bias. Good step coverage is obtained by the RF sputter layer of the wear-resistant and the protective film prevents the intrusion of water that can cause cracking, and the layer formed under no or smaller bias reduces internal stresses and inhibits the development of cracks due to internal stresses as well as the cracking by RF sputtering.
    Type: Application
    Filed: September 30, 2002
    Publication date: February 20, 2003
    Applicant: TDK Corporation
    Inventors: Masatoshi Nakayama, Masahiro Nakano, Tsukimi Endo
  • Patent number: 6471832
    Abstract: A method of producing a wear-resistant protective film for a thermal head comprises depositing a wear-resistant protective film by sputtering on a thermal head which includes a substrate, and a heat-developing layer and a pair of electrodes formed on either the substrate or a heat-regenerative layer formed thereon. A layer of the wear resistant protective film is formed under a RF larger bias and another layer without a bias or with a smaller bias. Good step coverage is obtained by the RF sputter layer of the wear-resistant and the protective film prevents the intrusion of water that can cause cracking, and the layer formed under no or smaller bias reduces internal stresses and inhibits the development of cracks due to internal stresses as well as the cracking by RF sputtering.
    Type: Grant
    Filed: May 2, 1996
    Date of Patent: October 29, 2002
    Assignee: TDK Corporation
    Inventors: Masatoshi Nakayama, Masahiro Nakano, Tsukimi Endo
  • Patent number: 5590969
    Abstract: A wear-resistant protective film for thermal printing heads comprising Si, O, and N as principal constituent elements, contains additionally at least one alkaline earth metal selected from the group consisting of Be, Mg, Ca, Sr, Ba, and Ra. Preferably, the film has a composition SiM.sub.x O.sub.y N.sub.z in which M stands for an alkaline earth metal, x is 0.01-0.5, y is 0.1-2.0, and z is 0.2-1.8.
    Type: Grant
    Filed: January 13, 1995
    Date of Patent: January 7, 1997
    Assignee: TDK Corporation
    Inventors: Masatoshi Nakayama, Masahiro Nakano, Tsukimi Endo
  • Patent number: 5557313
    Abstract: A method of producing a wear-resistant protective film for a thermal head comprises depositing a wear-resistant protective film by sputtering on a thermal head which includes a substrate, and a heat-developing layer and a pair of electrodes formed on either the substrate or a heat-regenerative layer formed thereon. A layer of the wear resistant protective film is formed under a RF larger bias and another layer without a bias or with a smaller bias. Good step coverage is obtained by the RF sputter layer of the wear-resistant and the protective film prevents the intrusion of water that can cause cracking, and the layer formed under no or smaller bias reduces internal stresses and inhibits the development of cracks due to internal stresses as well as the cracking by RF sputtering.
    Type: Grant
    Filed: November 9, 1993
    Date of Patent: September 17, 1996
    Assignee: TDK Corporation
    Inventors: Masatoshi Nakayama, Masahiro Nakano, Tsukimi Endo