Patents by Inventor Tsun-Wu Liu

Tsun-Wu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7846538
    Abstract: A connection structure includes a workpiece, and a coating layer disposed above the workpiece. A groove is formed on a surface of the coating layer. The connection structure further includes an object installed inside the groove and adhered to the workpiece.
    Type: Grant
    Filed: November 14, 2006
    Date of Patent: December 7, 2010
    Assignee: Micro-Star Int'l Co. Ltd.
    Inventors: Hun-Jen Chen, Li-Yen Liu, Hsiu-Yu Fan, Tsun-Wu Liu
  • Publication number: 20080041101
    Abstract: A connection structure includes a workpiece, and a coating layer disposed above the workpiece. A groove is formed on a surface of the coating layer. The connection structure further includes an object installed inside the groove and adhered to the workpiece.
    Type: Application
    Filed: November 14, 2006
    Publication date: February 21, 2008
    Inventors: Hun-Jen Chen, Li-Yen Liu, Hsiu-Yu Fan, Tsun-Wu Liu
  • Patent number: D627342
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: November 16, 2010
    Assignee: Micro-Star Internationa'l Co., Ltd.
    Inventors: Chien-Chuan Lin, Meng-Yu Tsai, Tsun-Wu Liu
  • Patent number: D656137
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: March 20, 2012
    Assignee: Micro-Star Int'l Co., Ltd.
    Inventors: Meng-Hsuan Chung, Chin-Wei Chou, Tsun-Wu Liu