Patents by Inventor Tsuneo Endo

Tsuneo Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240127717
    Abstract: An additive manufacturing model assembly includes: an additive manufacturing model formed by additive manufacturing in which laminated metal powder is melted; and a metal non-additive manufacturing model formed by a method different from the additive manufacturing, the additive manufacturing model assembly is configured by assembling the additive manufacturing model and the non-additive manufacturing model, the additive manufacturing model assembly has: a contact portion at which the additive manufacturing model and the non-additive manufacturing model are in contact with each other; and a fixing portion by which the additive manufacturing model and the non-additive manufacturing model are fixed to each other, the fixing portion being located at a same position as the contact portion or a position different from the contact portion, and a thickness of the additive manufacturing model is thinner than a thickness of the non-additive manufacturing model at the contact portion.
    Type: Application
    Filed: September 12, 2023
    Publication date: April 18, 2024
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Tsuneo ENDO, Yuta KUROSAWA
  • Patent number: 11874075
    Abstract: A heat exchanger includes a main body provided with first flow paths through which a first fluid flows and second flow paths through which a second fluid flows. Each first flow path includes an integrated part, a buffer part, and a divided part arranged in this order from an inlet of the main body. The integrated part includes a first flow path space defined by a peripheral wall including a pair of mutually facing partition walls. The buffer part includes a deformed flow path space formed by deforming the first flow path space such that first displacement parts or each of multiple pairs of first displacement parts provided at intervals on the pair of partition walls approach each other. The divided part includes multiple divided flow path spaces formed by dividing the first flow path space by connecting the first displacement parts of each pair to each other.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: January 16, 2024
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Tsuneo Endo, Katsutoshi Tada, Hitomi Ito, Yuta Kurosawa
  • Patent number: 11801647
    Abstract: A modeling method for a workpiece and the workpiece are provided. When the workpiece, at least a part of the workpiece has a hollow region and two or more openings linking an inside and the outside of the hollow region, is additively manufactured, a temporary closure to block at least one of the two or more openings of the hollow region is manufactured at a same time as laminating of a wall section of the hollow region. A peripheral edge of the temporary closure joined to the wall section, and the temporary closure has a flow hole allowing a fluid to flow in or out of the hollow region, then the temporary closure is removed after the fluid has flowed in or out.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: October 31, 2023
    Assignee: SOLIZE CORPORATION
    Inventors: Jun Mitake, Tsuneo Endo, Yuta Kurosawa
  • Publication number: 20230318404
    Abstract: A rotary electric machine includes a rotor, a stator which is disposed at a predetermined interval in a radial direction from an outer circumferential surface of the rotor, a housing which accommodates the rotor and the stator, and an inflow passage through which a gas is supplied to a gap between the rotor and the stator.
    Type: Application
    Filed: March 20, 2023
    Publication date: October 5, 2023
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Yasunari KIMURA, Yuta KUROSAWA, Tsuneo ENDO
  • Publication number: 20230314084
    Abstract: A heat exchanger includes a partition wall that separates two fluids having different temperatures. The partition wall includes a side circumferential portion, and a bottom portion configured to close an opening on one side of the side circumferential portion. Fins are formed on an outer surface of the partition wall, and arranged side by side in a circumferential direction around a center of a cylinder of the side circumferential portion. Each of the fins includes a base portion connected to an outer surface of the bottom portion. Plate-shaped members are provided between the base portions of the fins adjacent in the circumferential direction, and fixed to the outer surface of the bottom portion. The partition wall and the plurality of fins are integrally molded of a same material. The plate-shaped members are formed of a different material of higher emissivity or heat resistance than the material of the fins.
    Type: Application
    Filed: March 30, 2023
    Publication date: October 5, 2023
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Tsuneo ENDO, Yuta KUROSAWA
  • Publication number: 20230314089
    Abstract: A heat pipe including: a heat receiving chamber; a heat dissipation chamber; a tubular connecting pipe; and wicks. Each of the heat receiving chamber and the heat dissipation chamber has, when viewed from a first direction, a greater width in a second direction than a width of the connecting pipe in the second direction. The wicks are formed side by side at least in the second direction. The wicks are formed in a groove shape on inner wall surfaces of the heat receiving chamber, the heat dissipation chamber, and the connecting pipe. At least one of the wicks has a bent portion on the heat receiving chamber side, which is bent in the second direction in the heat receiving chamber and the heat dissipation chamber. The heat receiving chamber, the heat dissipation chamber, the connecting pipe. The wicks are integrally formed by laminating and shaping using a metal powder.
    Type: Application
    Filed: March 30, 2023
    Publication date: October 5, 2023
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Tsuneo ENDO, Yuta KUROSAWA
  • Publication number: 20230314087
    Abstract: A heat exchanger including: a first flow path configured to allow a first fluid to flow therethrough; a second flow path adjacent to the first flow path and configured to allow a second fluid to flow therethrough; and a housing accommodating the first flow path and the second flow path. The heat exchanger performs heat exchange inside the housing between the first fluid flowing through the first flow path and the second fluid flowing through the second flow path. Inside the housing, the first flow path and the second flow path are partitioned by a partition wall and form flow paths independent of each other, the partition wall has a three-dimensional curved surface shape, and the first flow path and the second flow path extend three-dimensionally.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 5, 2023
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Yuta KUROSAWA, Tsuneo ENDO
  • Publication number: 20230314082
    Abstract: A heat exchanger including: a first flow path surrounded by a first flow path wall; a second flow path surrounded by a second flow path wall formed separately from the first flow path wall; and a third flow path formed by a space between the first flow path wall and the second flow path wall. The first flow path is configured to allow a first fluid to flow therethrough, the second flow path is configured to allow a second fluid to flow therethrough, and the third flow path is configured to allow a third fluid to flow therethrough. The heat exchanger performs heat exchange between the first fluid and the third fluid, and between the second fluid and the third fluid. The first flow path wall and the second flow path wall are formed such that the first flow path and the second flow path are three-dimensionally intertwined.
    Type: Application
    Filed: March 30, 2023
    Publication date: October 5, 2023
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Yuta KUROSAWA, Tsuneo ENDO
  • Publication number: 20230314083
    Abstract: A heat exchanger includes a partition wall that separates two fluids having different temperatures. A plurality of grooves having a depth of 100 ?m to 400 ?m are formed in a thickness direction of the partition wall on a first wall surface of the partition wall which is a surface on a side in contact with a fluid of the two fluids that has a lower heat transfer coefficient.
    Type: Application
    Filed: March 30, 2023
    Publication date: October 5, 2023
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Tsuneo ENDO, Yuta KUROSAWA
  • Publication number: 20230314081
    Abstract: A heat exchanger, includes: a core portion: a first flow path which is provided in the core portion and through which a first fluid flows; and a second flow path which is provided in the core portion and through which a second fluid flows. The first fluid flowing through the first flow path and the second fluid flowing through the second flow path exchange heat through a partition in the core portion. The first flow path includes: a plurality of main flow paths: an introducing chamber; and a discharge chamber. The main flow path includes: an introducing side shape changing section in which a certain flow path is connected in a straight shape to the main flow path adjacent thereto; and a discharge side shape changing section in which the certain flow path is connected in a straight shape to the main flow path adjacent thereto.
    Type: Application
    Filed: March 30, 2023
    Publication date: October 5, 2023
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Tsuneo ENDO, Yuta KUROSAWA
  • Patent number: 11774188
    Abstract: A heat exchanger includes: a partition wall that separates two fluids of different temperature; and multiple plate-shaped fins formed on at least one surface of the partition wall and each having a pair of heat transfer surfaces. The partition wall and the multiple fins are made of a same metal material to constitute an integrally molded product. The multiple fins each have a curved part and are arranged to be spaced from one another in a direction intersecting with the pair of heat transfer surfaces. Each heat transfer surface of the pair of heat transfer surfaces is formed with multiple grooves having a depth of 100 ?m to 400 ?m in a thickness direction of each fin.
    Type: Grant
    Filed: February 17, 2022
    Date of Patent: October 3, 2023
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Tsuneo Endo, Yuta Kurosawa
  • Publication number: 20220316819
    Abstract: A heat exchanger includes a main body provided with first flow paths through which a first fluid flows and second flow paths through which a second fluid flows. Each first flow path includes an integrated part, a buffer part, and a divided part arranged in this order from an inlet of the main body. The integrated part includes a first flow path space defined by a peripheral wall including a pair of mutually facing partition walls. The buffer part includes a deformed flow path space formed by deforming the first flow path space such that first displacement parts or each of multiple pairs of first displacement parts provided at intervals on the pair of partition walls approach each other. The divided part includes multiple divided flow path spaces formed by dividing the first flow path space by connecting the first displacement parts of each pair to each other.
    Type: Application
    Filed: February 22, 2022
    Publication date: October 6, 2022
    Inventors: Tsuneo ENDO, Katsutoshi TADA, Hitomi ITO, Yuta KUROSAWA
  • Publication number: 20220307775
    Abstract: A heat exchanger includes: a partition wall that separates two fluids of different temperature; and multiple plate-shaped fins formed on at least one surface of the partition wall and each having a pair of heat transfer surfaces. The partition wall and the multiple fins are made of a same metal material to constitute an integrally molded product. The multiple fins each have a curved part and are arranged to be spaced from one another in a direction intersecting with the pair of heat transfer surfaces. Each heat transfer surface of the pair of heat transfer surfaces is formed with multiple grooves having a depth of 100 ?m to 400 ?m in a thickness direction of each fin.
    Type: Application
    Filed: February 17, 2022
    Publication date: September 29, 2022
    Inventors: Tsuneo ENDO, Yuta KUROSAWA
  • Publication number: 20220305737
    Abstract: A modeling method for a workpiece and the workpiece are provided. When the workpiece, at least a part of the workpiece has a hollow region and two or more openings linking an inside and the outside of the hollow region, is additively manufactured, a temporary closure to block at least one of the two or more openings of the hollow region is manufactured at a same time as laminating of a wall section of the hollow region. A peripheral edge of the temporary closure joined to the wall section, and the temporary closure has a flow hole allowing a fluid to flow in or out of the hollow region, then the temporary closure is removed after the fluid has flowed in or out.
    Type: Application
    Filed: March 23, 2022
    Publication date: September 29, 2022
    Applicants: SOLIZE Corporation, Honda Motor Co., Ltd
    Inventors: Jun MITAKE, Tsuneo ENDO, Yuta KUROSAWA
  • Patent number: 9150091
    Abstract: A liquid pressure circuit is provided in which connecting an accumulator (22) to a high pressure liquid path (Lh) by opening a cut-off valve (24a) and connecting a intake liquid path (Li) to the high pressure liquid path (Lh) by means of a switch valve (24b) enables a pump/motor (M) to be operated as a motor by liquid stored under pressure in the accumulator (22), connecting the accumulator (22) to the high pressure liquid path (Lh) by opening the cut-off valve (24a) and connecting the intake liquid path (Li) to a low pressure liquid path (Ll) by means of the switch valve (24b) enables the pump/motor (M) to be operated as a pump to thus store liquid of a tank (21) under pressure in the accumulator (22), and closing the cut-off valve (24a) and connecting the intake liquid path (Li) to the high pressure liquid path (Lh) by means of the switch valve (24b) enables the pump/motor (M) to rotate without load; it is therefore possible to switch between three circuits, that is, drive (motor operation), regeneration (p
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: October 6, 2015
    Assignee: Honda Motor Co., Ltd.
    Inventors: Tsuneo Endo, Shigeru Ibaraki, Kazutaka Takahashi, Daiki Sato, Seiichiro Ishikawa
  • Patent number: 8931514
    Abstract: A liquid flow rate control valve is provided in which since a total area of overlapping sections of a communication hole group (38c, 38d) of a distributor (38) and an outlet opening (37a, 37b) of a sleeve (37) changes when the distributor (38) is rotated by a first electric motor (46), if a rotor (42) is rotated by means of a second electric motor (47), an input port (31e) communicates with an output port (31f) through an inlet opening (42c, 42d) of the rotor (42), the communication hole group (38c, 38d) of the distributor (38), and the outlet opening (37a, 37b) of the sleeve (37) when the inlet opening (42c, 42d) of the rotor (42) passes through the overlapping sections, thereby making it possible to carry out PWM control of a flow rate of liquid. Since a thrust load in an axis (L) direction does not act on the distributor (38) and the rotor (42), supporting the distributor (38) and the rotor (42) becomes easy, thereby enabling the cost and weight to be cut.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: January 13, 2015
    Assignee: Honda Motor Co., Ltd.
    Inventors: Tsuneo Endo, Seiichiro Ishikawa, Hidemi Arai, Yuki Shibahata, Mitsuo Kadota, Hiroshi Hanabusa, Daiki Sato, Kensaku Yamamoto
  • Publication number: 20120234417
    Abstract: A liquid flow rate control valve is provided in which since a total area of overlapping sections of a communication hole group (38c, 38d) of a distributor (38) and an outlet opening (37a, 37b) of a sleeve (37) changes when the distributor (38) is rotated by a first electric motor (46), if a rotor (42) is rotated by means of a second electric motor (47), an input port (31e) communicates with an output port (31f) through an inlet opening (42c, 42d) of the rotor (42), the communication hole group (38c, 38d) of the distributor (38), and the outlet opening (37a, 37b) of the sleeve (37) when the inlet opening (42c, 42d) of the rotor (42) passes through the overlapping sections, thereby making it possible to carry out PWM control of a flow rate of liquid. Since a thrust load in an axis (L) direction does not act on the distributor (38) and the rotor (42), supporting the distributor (38) and the rotor (42) becomes easy, thereby enabling the cost and weight to be cut.
    Type: Application
    Filed: September 30, 2010
    Publication date: September 20, 2012
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Tsuneo Endo, Seiichiro Ishikawa, Hidemi Arai, Yuki Shibahata, Mitsuo Kadota, Hiroshi Hanabusa, Daiki Sato, Kensaku Yamamoto
  • Publication number: 20120237362
    Abstract: A liquid pressure circuit is provided in which connecting an accumulator (22) to a high pressure liquid path (Lh) by opening a cut-off valve (24a) and connecting a intake liquid path (Li) to the high pressure liquid path (Lh) by means of a switch valve (24b) enables a pump/motor (M) to be operated as a motor by liquid stored under pressure in the accumulator (22), connecting the accumulator (22) to the high pressure liquid path (Lh) by opening the cut-off valve (24a) and connecting the intake liquid path (Li) to a low pressure liquid path (Ll) by means of the switch valve (24b) enables the pump/motor (M) to be operated as a pump to thus store liquid of a tank (21) under pressure in the accumulator (22), and closing the cut-off valve (24a) and connecting the intake liquid path (Li) to the high pressure liquid path (Lh) by means of the switch valve (24b) enables the pump/motor (M) to rotate without load; it is therefore possible to switch between three circuits, that is, drive (motor operation), regeneration (p
    Type: Application
    Filed: September 30, 2010
    Publication date: September 20, 2012
    Applicant: HONDA MOTOR CO., LTD.
    Inventors: Tsuneo Endo, Shigeru Ibaraki, Kazutaka Takahashi, Daiki Sato, Seiichiro Ishikawa
  • Publication number: 20090194792
    Abstract: A semiconductor device has an external wiring for GND formed over an underside surface of a wiring substrate. A plurality of via holes connecting to the external wiring for GND are formed to penetrate the wiring substrate. A first semiconductor chip of high power consumption, including HBTs, is mounted over a principal surface of the wiring substrate. The emitter bump electrode of the first semiconductor chip is connected in common with emitter electrodes of a plurality of HBTs formed in the first semiconductor chip. The emitter bump electrode is extended in a direction in which the HBTs line up. The first semiconductor chip is mounted over the wiring substrate so that a plurality of the via holes are connected with the emitter bump electrode. A second semiconductor chip lower in heat dissipation value than the first semiconductor chip is mounted over the first semiconductor chip.
    Type: Application
    Filed: March 27, 2009
    Publication date: August 6, 2009
    Applicant: RENESAS TECHNOLOGY CORP.
    Inventors: Satoru Konishi, Tsuneo Endo, Hirokazu Nakajima, Yasunari Umemoto, Satoshi Sasaki, Chushiro Kusano, Yoshinori Imamura, Atsushi Kurokawa
  • Patent number: 7511315
    Abstract: A semiconductor device has an external wiring for GND formed over an underside surface of a wiring substrate. A plurality of via holes connecting to the external wiring for GND are formed to penetrate the wiring substrate. A first semiconductor chip of high power consumption, including HBTs, is mounted over a principal surface of the wiring substrate. The emitter bump electrode of the first semiconductor chip is connected in common with emitter electrodes of a plurality of HBTs formed in the first semiconductor chip. The emitter bump electrode is extended in a direction in which the HBTs line up. The first semiconductor chip is mounted over the wiring substrate so that a plurality of the via holes are connected with the emitter bump electrode. A second semiconductor chip lower in heat dissipation value than the first semiconductor chip is mounted over the first semiconductor chip.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: March 31, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Satoru Konishi, Tsuneo Endo, Hirokazu Nakajima, Yasunari Umemoto, Satoshi Sasaki, Chushiro Kusano, Yoshinori Imamura, Atsushi Kurokawa