Patents by Inventor Tsuneo Endoh

Tsuneo Endoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8266445
    Abstract: To allow viewers to view a plain document depending on levels of the authorized powers of the viewers without inserting identifiers into the plain document. An encrypting device includes devices for: storing encrypting role information which includes encrypting keys and key IDs of the encrypting keys; grasping the encrypting range of the plain document, and creating an encrypted part by encrypting the encrypting range using the encrypting key in the encrypting role information; creating the encrypting information configured with one, two, or more record(s) containing the front position and rear position of the encrypted part, the key ID corresponding to the encrypting key that is applied for the encrypted part, and the processing order of the encrypted part; creating the encrypted document by combining an encrypted document main body configured with a document containing the encrypted part with the encrypting information; and storing the encrypted document to a prescribed medium.
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: September 11, 2012
    Assignee: NEC Corporation
    Inventor: Tsuneo Endoh
  • Patent number: 8022551
    Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
    Type: Grant
    Filed: April 7, 2006
    Date of Patent: September 20, 2011
    Assignee: Renesas Electronics Corporation
    Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh
  • Patent number: 7779807
    Abstract: An intake/exhaust valve seal structure for an internal combustion engine is disclosed. A sealing surface is formed by a valve seat surface in a ceiling of a combustion chamber and a valve face surface provided on an intake/exhaust valve. The sealing surface lies on a first conical surface having an axis of the intake/exhaust valve as its rotation axis and includes a line of intersection of the first conical surface with an inner wall face of the ceiling of the combustion chamber. A method for manufacturing the intake/exhaust valve is also disclosed.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: August 24, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: Hisato Tanaka, Tsuneo Endoh, Yasuhisa Tateoka, Hiroaki Hara
  • Patent number: 7739989
    Abstract: A valve-operating mechanism for an internal combustion engine having intake and exhaust valves and valve control members for controlling the intake and exhaust valves. The intake and exhaust valves are configured as dual valves having an outer valve and an inner valve. The valve control members, at least during scavenging, simultaneously close the outer valves of the intake and exhaust valves, producing a non-overlapping state, and simultaneously open the inner valves of the intake and exhaust valves, producing an overlapping state.
    Type: Grant
    Filed: February 7, 2007
    Date of Patent: June 22, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yasunari Kimura, Tsuneo Endoh, Makoto Uda, Atsushi Baba
  • Patent number: 7717075
    Abstract: No-load valve lift correction curves of opening and closing cams are set by offsetting no-load curve sections of basic valve lift curves of the cams in such directions as to increase a clearance between the curves, and they are connected with remaining sections of the curves to provide normal valve lift curves of the cams. Cam profiles of the cams are set on the basis of such normal valve lift curves. The cam profiles are set so that an ultimate speed difference between jumping and landing speeds of a follower on an ultimate valve speed curve determined from ultimate valve lift curves, having first and second shift sections where the follower shifts from the opening cam to the closing cam and from the closing cam to the opening cam, is smaller than a basic speed difference between jumping and landing speeds on a basic valve speed curve.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: May 18, 2010
    Assignee: Honda Motor Co., Ltd.
    Inventors: Tsuneo Endoh, Makoto Uda, Hiroshi Hanabusa
  • Patent number: 7594871
    Abstract: A variable flywheel mechanism is capable of varying the moment of inertia is disclosed. The wheel mechanism includes a sun gear, planetary gears, pivotable arms swung by the planetary gears, and weights mounted on the pivotable arms. The positions of the weights are controlled by rotation of the sun gear.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: September 29, 2009
    Assignee: Honda Motor Co., Ltd.
    Inventors: Yasunari Kimura, Takao Tsuboi, Tsuneo Endoh
  • Patent number: 7475541
    Abstract: A hybrid vehicle is equipped with an internal combustion engine, a motor/generator, and a Rankine cycle system for recovering thermal energy of exhaust gas. The output of the Rankine cycle system is input into a transmission or, alternatively, converted into electric power and used for charging a battery. The Rankine cycle system has temperature setter that sets the temperature of steam at the outlet of an evaporator. A pressure setter is provided for setting steam pressure at the inlet of an expander. A pressure controller is provided for controlling the steam pressure at the inlet of the expander. The evaporator generates steam to be supplied at a pressure that is optimum for the expansion ratio of the expander. The Rankine cycle system is operated when the vehicle is accelerating or cruising and efficiently recovers thermal energy of the exhaust gas and reduces the fuel consumption of the internal combustion engine.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: January 13, 2009
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Shigeru Ibaraki, Takeo Kiuchi, Tsuneo Endoh, Akihisa Sato
  • Patent number: 7468294
    Abstract: A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: December 23, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Masashi Yamaura, Hirokazu Nakajima, Nobuyoshi Maejima, Mikio Negishi, Tomio Yamada, Tomomichi Koizumi, Tsuneo Endoh
  • Publication number: 20080310626
    Abstract: To allow viewers to view a plain document depending on levels of the authorized powers of the viewers without inserting identifiers into the plain document. An encrypting device includes devices for: storing encrypting role information which includes encrypting keys and key IDs of the encrypting keys; grasping the encrypting range of the plain document, and creating an encrypted part by encrypting the encrypting range using the encrypting key in the encrypting role information; creating the encrypting information configured with one, two, or more record(s) containing the front position and rear position of the encrypted part, the key ID corresponding to the encrypting key that is applied for the encrypted part, and the processing order of the encrypted part; creating the encrypted document by combining an encrypted document main body configured with a document containing the encrypted part with the encrypting information; and storing the encrypted document to a prescribed medium.
    Type: Application
    Filed: March 26, 2008
    Publication date: December 18, 2008
    Inventor: TSUNEO ENDOH
  • Publication number: 20080110425
    Abstract: No-load valve lift correction curves of opening and closing cams are set by offsetting no-load curve sections of basic valve lift curves of the cams in such directions as to increase a clearance between the curves, and they are connected with remaining sections of the curves to provide normal valve lift curves of the cams. Cam profiles of the cams are set on the basis of such normal valve lift curves. The cam profiles are set so that an ultimate speed difference between jumping and landing speeds of a follower on an ultimate valve speed curve determined from ultimate valve lift curves, having first and second shift sections where the follower shifts from the opening cam to the closing cam and from the closing cam to the opening cam, is smaller than a basic speed difference between jumping and landing speeds on a basic valve speed curve.
    Type: Application
    Filed: October 30, 2007
    Publication date: May 15, 2008
    Inventors: Tsuneo Endoh, Makoto Uda, Hiroshi Hanabusa
  • Patent number: 7367305
    Abstract: A connecting rod of an internal combustion engine, and an internal combustion engine including the connecting rod, a piston, a crankshaft and a float bearing as main moving parts. A piston is connected to a connecting rod by a spherical joint and has radial ribs on a rear face of a crown part; a connecting rod is of an integrated, one-piece type having integrally a spherical small end part to be connected to the piston and an annular big end part; the crankshaft is of an assembly type, and a float bearing is interposed between the big end part and a crank pin.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: May 6, 2008
    Assignee: Honda Motor Co., Ltd.
    Inventors: Tsuneo Endoh, Kengo Ishimitsu, Tsutomu Inoue, Takao Tsuboi
  • Patent number: 7301781
    Abstract: The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor chips are mounted in a stacked manner. A lower semiconductor chip is fixed to a bottom of a recess formed in an upper surface of a module board, and an upper semiconductor chip is fixed to an upper surface of a support body made of conductor which is formed over the upper surface of the module board around the recess. External electrode terminals and a heat radiation pad are formed over a lower surface of the module board.
    Type: Grant
    Filed: October 24, 2006
    Date of Patent: November 27, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Satoru Konishi, Tsuneo Endoh, Masaaki Tsuchiya, Hirokazu Nakajima
  • Patent number: 7281380
    Abstract: A heat exchange system is provided that includes an evaporator (11) that carries out heat exchange between exhaust gas discharged from an exhaust port (16B) and water, exhaust gas passages (87, 88) on the upstream side in the direction of flow of the exhaust gas being disposed on the radially inner side, an exhaust gas passage (89) on the downstream side being disposed on the radially outer side, and an oxygen concentration sensor cooling portion (92) for cooling a mounting section of an oxygen concentration sensor (91) facing the exhaust gas passage (87) on the most upstream side being positioned on the radially outer side of the exhaust gas passage (87). Water is supplied separately to a water passage (W3) of the evaporator (11) and a water passage (W4) of the oxygen concentration sensor cooling portion (92), and the water passage (W3) of the evaporator (11) is arranged so that the direction of flow of the water is opposite to the direction of flow of the exhaust gas.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: October 16, 2007
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Masashi Shinohara, Tsuneo Endoh, Atsushi Baba
  • Patent number: 7259465
    Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, etc., and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: August 21, 2007
    Assignee: Hitachi, Ltd.
    Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh
  • Publication number: 20070181112
    Abstract: A valve-operating mechanism for an internal combustion engine having intake and exhaust valves and valve control members for controlling the intake and exhaust valves. The intake and exhaust valves are configured as dual valves having an outer valve and an inner valve. The valve control members, at least during scavenging, simultaneously close the outer valves of the intake and exhaust valves, producing a non-overlapping state, and simultaneously open the inner valves of the intake and exhaust valves, producing an overlapping state.
    Type: Application
    Filed: February 7, 2007
    Publication date: August 9, 2007
    Inventors: Yasunari Kimura, Tsuneo Endoh, Makoto Uda, Atsushi Baba
  • Publication number: 20070179012
    Abstract: A variable flywheel mechanism is capable of varying the moment of inertia is disclosed. The wheel mechanism includes a sun gear, planetary gears, pivotable arms swung by the planetary gears, and weights mounted on the pivotable arms. The positions of the weights are controlled by rotation of the sun gear.
    Type: Application
    Filed: January 30, 2007
    Publication date: August 2, 2007
    Inventors: Yasunari Kimura, Takao Tsuboi, Tsuneo Endoh
  • Patent number: 7191740
    Abstract: A cooling block forming a top wall of a combustion chamber of an internal combustion engine is formed by layering, from the outside to the inside, a casing, an upper layer block, a middle layer block, and a lower layer block. Labyrinth-shaped cooling water passages are formed on upper side faces of the three layers of blocks, and cooling water supplied from a cooling water supply passage flows from the cooling water passage on the side far from the combustion chamber to the cooling water passage on the side close to the combustion chamber, and is discharged from a cooling water discharge passage. Since the cooling water flows in a direction opposite to the direction of emission of heat of combustion from the combustion chamber, it is possible to ensure that there is sufficient difference in temperature between a cylinder head and the cooling water throughout the cooling water passages.
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: March 20, 2007
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Atsushi Baba, Tsuneo Endoh, Masashi Shinohara
  • Publication number: 20070035004
    Abstract: The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor chips are mounted in a stacked manner. A lower semiconductor chip is fixed to a bottom of a recess formed in an upper surface of a module board, and an upper semiconductor chip is fixed to an upper surface of a support body made of conductor which is formed over the upper surface of the module board around the recess. External electrode terminals and a heat radiation pad are formed over a lower surface of the module board.
    Type: Application
    Filed: October 24, 2006
    Publication date: February 15, 2007
    Inventors: Satoru Konishi, Tsuneo Endoh, Masaaki Tsuchiya, Hirokazu Nakajima
  • Patent number: 7176579
    Abstract: The present invention realizes the miniaturization of a semiconductor module. The semiconductor module includes a module board having external electrode terminals and a heat radiation pad over a lower surface thereof, a first semiconductor chip incorporating an initial-stage transistor of a high frequency power amplifying device therein, a second semiconductor chip incorporating a next-stage transistor and a final-stage transistor therein, and an integrated passive device which constitutes a matching circuit. At least one of the first semiconductor chip and the second semiconductor chip and the integrated passive device are mounted over an upper surface of the module board in an overlapped manner.
    Type: Grant
    Filed: December 12, 2003
    Date of Patent: February 13, 2007
    Assignee: Renesas Technology Corp.
    Inventors: Satoru Konishi, Tsuneo Endoh, Hirokazu Nakajima, Masaaki Tsuchiya
  • Publication number: 20070031279
    Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.
    Type: Application
    Filed: April 7, 2006
    Publication date: February 8, 2007
    Applicant: Renesas Technology Corporation
    Inventors: Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Kazuma Miura, Mikio Negishi, Hirokazu Nakajima, Tsuneo Endoh