Abstract: The exposure apparatus comprises a projection optical system that has an image field capable of exposing a shot area in a scanning exposure apparatus in one shot. This allows a 1 in 1 exposure, with the shot area being the maximum exposable range of the scanning exposure apparatus. In addition, the main control unit changes the control factor of the exposure system contributing to the throughput, in accordance with the minimum line width of the pattern. The control factor is changed so that the state (or the value) moves into a state where more priority is put on throughput, only when reduction in exposure accuracy is allowed. This makes it possible to improve the throughput while maintaining the exposure accuracy, compared with the case when the exposure system is controlled based on the same value at all times.

Abstract: The exposure apparatus comprises a projection optical system that has an image field capable of exposing a shot area in a scanning exposure apparatus in one shot. This allows a 1 in 1 exposure, with the shot area being the maximum exposable range of the scanning exposure apparatus. In addition, the main control unit changes the control factor of the exposure system contributing to the throughput, in accordance with the minimum line width of the pattern. The control factor is changed so that the state (or the value) moves into a state where more priority is put on throughput, only when reduction in exposure accuracy is allowed. This makes it possible to improve the throughput while maintaining the exposure accuracy, compared with the case when the exposure system is controlled based on the same value at all times.

Abstract: The exposure apparatus comprises a projection optical system that has an image field capable of exposing a shot area in a scanning exposure apparatus in one shot. This allows a 1 in 1 exposure, with the shot area being the maximum exposable range of the scanning exposure apparatus. In addition, the main control unit changes the control factor of the exposure system contributing to the throughput, in accordance with the minimum line width of the pattern. The control factor is changed so that the state (or the value) moves into a state where more priority is put on throughput, only when reduction in exposure accuracy is allowed. This makes it possible to improve the throughput while maintaining the exposure accuracy, compared with the case when the exposure system is controlled based on the same value at all times.

Abstract: A focusing operation is performed so that the center of an exposure region on a photosensitive substrate coincides with a focal point of a projection optical system, based on setting information of a variable field stop, which sets the exposure region. Even in a case where only a portion of an exposable region of the projection optical system PL is set as the exposure region using the variable field stop, and only the set portion is subjected to exposure, exposure is performed while the set exposure region is brought into accurate focus, thereby improving resolution. Accordingly, an appropriate focusing operation can be always performed so as to achieve high accuracy exposure, irrespective of variations in the shape of the exposure region.

Abstract: Disclosed is an exposure apparatus comprising a substrate holder washing unit and a substrate holder storing unit. While a substrate holder exported from an exposure stage is washed in the washing unit, a clean holder previously stored in the storing unit is transported to an X stage by using a robot hand and a transport arm, and it is installed to the X stage by using an attaching/detaching mechanism. The holder can be always maintained in a clean state without stopping the apparatus for a long period of time, resulting in improvement in throughput. Also disclosed is an exposure apparatus comprising a mechanism for cleaning a substrate holder by transporting a whetstone onto the holder, engaging the whetstone with an engaging member, and rotating the whetstone by using a rotary driving unit. The exposure apparatus is provided with a unit for drawing dust emerged upon cleaning with the whetstone.

Abstract: A projection exposure apparatus has a light source for emitting illumination light, an illumination optical system for illuminating a mask, on which a predetermined pattern is formed, with the illumination light, and a projection optical system for forming an image of the pattern on a photosensitive substrate, and images the image of the pattern on the photosensitive substrate in a predetermined imaging state. The apparatus also includes a temperature measurement sensor for measuring a change in temperature of the mask, a control system for calculating the change amount of the imaging state caused by the change in temperature, and a correction system for correcting the change in imaging state.