Patents by Inventor Tsuneyuki Adachi

Tsuneyuki Adachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition of polyarylenesulfide, bisphenol epoxy resin and oxazoline-containing amorphous polymer
    Patent number: 7601782
    Abstract: Polyarylenesulfide resin compositions are provided having a dramatically improved adhesiveness with regard to the cured epoxy resin, while maintaining characteristics of polyarylenesulfide resins such as a heat resistivity and a chemical resistivity. The above described polyarylenesulfide resin compositions are obtained by comprising as essential components the allylenesulfide resin (A), bisphenol-type epoxy resin (B), and an oxazoline-group-containing amorphous polymer (C). The thus obtained polyarylenesulfide resin compositions can be used as superior engineering plastics in wide application fields such as electronic and other devices.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: October 13, 2009
    Assignee: Dainippon Ink & Chemicals, Inc.
    Inventors: Kiyotaka Kawashima, Tsuneyuki Adachi
  • Polyarylenesulfide resin composition
    Publication number: 20030212204
    Abstract: Polyarylenesulfide resin compositions are provided having a dramatically improved adhesiveness with regard to the cured epoxy resin, while maintaining characteristics of polyarylenesulfide resins such as a heat resistivity and a chemical resistivity. The above described polyarylenesulfide resin compositions are obtained by comprising as essential components the allylenesulfide resin (A), bisphenol-type epoxy resin (B), and an oxazoline-group-containing amorphous polymer (C). The thus obtained polyarylenesulfide resin compositions can be used as superior engineering plastics in wide application fields such as electronic and other devices.
    Type: Application
    Filed: May 7, 2003
    Publication date: November 13, 2003
    Applicant: DAINIPPON INK AND CHEMICALS, INC., Tokyo, Japan
    Inventors: Kiyotaka Kawashima, Tsuneyuki Adachi
  • Composition of polyarylenesulfide, epoxy resin and oxazoline polymer
    Patent number: 6579936
    Abstract: A resin composition applicable to semiconductor or electric devices comprises (A) a polyarylenesulfide resin, (B) a bisphenol epoxy resin, (C) an oxazoline group-containing amorphous polymer, and (D) an impact resistance-improving resin which is either (d1) an acid or epoxy groups-containing vinyl polymer, or (d2) an acid or epoxy groups-containing gum polymer.
    Type: Grant
    Filed: July 28, 1999
    Date of Patent: June 17, 2003
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Kiyotaka Kawashima, Tsuneyuki Adachi
  • Polyphenylene sulfide resin composition
    Patent number: 5177137
    Abstract: A polyphenylene sulfide resin composition comprising(1) a polyphenylene resin, and(2) at least one compound selected from the group consisting of(a) zinc carbonate,(b) manganese carbonate, and(c) zinc hydroxide.
    Type: Grant
    Filed: January 19, 1990
    Date of Patent: January 5, 1993
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Kiyotaka Kawashima, Tsuneyuki Adachi, Matsuo Suzuki, Shigeaki Nagano, Morikuni Yamamoto
  • Glass fiber-reinforced resin composition
    Patent number: 4254010
    Abstract: A glass fiber-reinforced thermoplastic resin composition comprising (I) a thermoplastic polyurethane derived from polybutylene terephthalate and a polyfunctional isocyanate and (II) glass fibers surface-coated with 0.05 to 3% by weight of an aminosilane or epoxy silane and having a length of 0.01 to 0.2 mm and a length-to-diameter ratio of 1.5 to 20. The composition can give molded articles having high mechanical strength and thermal stability and being free from warpage.
    Type: Grant
    Filed: April 2, 1979
    Date of Patent: March 3, 1981
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Shioji Mizuno, Tsuneyuki Adachi