Abstract: A reticle holder 18 has; a first suction section 63 facing a precision warrantable area AR1 having a predetermined surface precision, of a lower face Ra of a reticle R; a second suction section 64 facing a precision unwarrantable area AR2 outside of the precision warrantable area AR1; a pore 70a connected to a suction apparatus which draws out gas in a space between the lower face Ra of the reticle R and the first suction section 63, and a pore 70b connected to the suction apparatus 72 which draws out gas in the space between the lower face Ra of the reticle R and the second suction section 64. As a result, the reticle can be held stably, without deteriorating the surface precision of the precision warrantable area.

Abstract: A method for performing optical adjustments of an exposure apparatus is based on an exposure apparatus having a light source for generating illumination light for exposure, and illumination optics for irradiating a mask with the illumination light generated from the exposure light source so as to imprint a mask pattern on a substrate base.

Abstract: A scanning exposure apparatus which promptly analyzes a cause for a variation in exposure line width. The scanning exposure apparatus includes a mask stage on which a mask is placed, a wafer stage on which a wafer is placed, a focusing mechanism which detects surface position information of the wafer and adjustment means which adjusts the surface position of the wafer. Control means acquires pose information of the wafer adjusted by the adjustment means at the time of exposure and stores the pose information in a memory in association with preacquired surface shape information of an exposure area. A state in which the exposed surface of the wafer has been exposed with respect to exposure light is known from the pose information and the surface shape information.

Abstract: A scanning exposure apparatus which promptly analyzes a cause for a variation in exposure line width. The scanning exposure apparatus includes a mask stage on which a mask is placed, a wafer stage on which a wafer is placed, a focusing mechanism which detects surface position information of the wafer and adjustment means which adjusts the surface position of the wafer. Control means acquires pose information of the wafer adjusted by the adjustment means at the time of exposure and stores the pose information in a memory in association with preacquired surface shape information of an exposure area. A state in which the exposed surface of the wafer has been exposed with respect to exposure light is known from the pose information and the surface shape information.

Abstract: A scanning exposure apparatus which promptly analyzes a cause for a variation in exposure line width. The scanning exposure apparatus includes a mask stage on which a mask is placed, a wafer stage on which a wafer is placed, a focusing mechanism which detects surface position information of the water and adjustment means which adjusts the surface position of the wafer. Control means acquires pose information of the wafer adjusted by the adjustment means at the time of exposure and stores the pose information in a memory in association with preacquired surface shape information of an exposure area. A state in which the exposed surface of the wafer has been exposed with respect to exposure light is known from the pose information and the surface shape information.

Abstract: In the case the first selection criteria is set, a plurality of detection points are selected to control the pitching and rolling of the wafer, whereas in the case the second selection criteria is set, priority is put to control the rolling on the wafer. The exposure apparatus has a selection unit to choose between these criteria, and on scanning exposure the controller adjusts the wafer position in the optical axis direction, pitching, rolling or the wafer position in the optical axis direction and rolling according to the selection criteria. Accordingly, by precisely adjusting the wafer surface position in the optical axis direction and rolling that greatly affects defocus, the critical dimension variation by a macroscopic observation, which is caused by defocus, can be prevented. Moreover, by performing an alternate scanning on the entire shot area including shot areas to be exposed on the circumferential portion, throughput can be maintained extremely high.

Abstract: The exposure apparatus comprises a mark plate on which a plurality of types of measurement marks each used for self-measurement are formed, a reticle stage on which the mark plate is mounted, and an aerial image measurement unit. On a slit plate of the aerial image measurement unit, a slit is formed extending in the non-scanning direction which width in the measurement direction is equal to and under (wavelength &lgr;/numerical aperture N.A of the projection optical system). Therefore, in a state where a predetermined pattern is illuminated with the illumination light to form an aerial image of the pattern via the projection optical system, and when the slit plate is scanned in the measurement direction with respect to the aerial image, the light having passed through the slit during the scanning is photo-electrically converted with the photoelectric conversion element.

Abstract: A method for performing optical adjustments of an exposure apparatus is based on an exposure apparatus having a light source for generating illumination light for exposure, and illumination optics for irradiating a mask with the illumination light generated from the exposure light source so as to imprint a mask pattern on a substrate base.

Abstract: A scanning exposure apparatus which promptly analyzes a cause for a variation in exposure line width. The scanning exposure apparatus includes a mask stage on which a mask is placed, a wafer stage on which a wafer is placed, a focusing mechanism which detects surface position information of the wafer and adjustment means which adjusts the surface position of the wafer. Control means acquires pose information of the wafer adjusted by the adjustment means at the time of exposure and stores the pose information in a memory in association with preacquired surface shape information of an exposure area. A state in which the exposed surface of the wafer has been exposed with respect to exposure light is known from the pose information and the surface shape information.

Abstract: An optical detection system capable of detecting even small particles or defects on a specimen such as a mask with high sensitivity and being unaffected by diffracted light from the edges of the pattern even when inspecting a thick specimen. The optical detection system includes a light emission means for illuminating a pattern surface on the specimen with light, a first light reception optical system placed on the pattern surface side of the specimen for receiving scattered light emanating from the pattern surface, a second light reception optical system placed on the glass side of the specimen in symmetry with the first light reception optical system relative to the pattern surface for receiving scattered light emanating from the pattern surface through the specimen and a corrective optical element for correcting for differences in the aberration states of the first and second light reception optical systems.

Abstract: The present invention discloses a mask defect inspection apparatus for optically detecting a defect on a mask having a circuit pattern, which comprises an illumination system for illuminating the mask with inspection light; a first light receiving optical system for receiving the inspection light reflected by the mask; a second light receiving optical system for receiving the inspection light transmitted by the mask; a first spatial filter for shielding the inspection light passing through a central region including the optical axis of the first light receiving optical system in an optical Fourier transform plane for the circuit pattern in the first light receiving optical system; a second spatial filter for shielding the inspection light passing through a central region including the optical axis of the second light receiving optical system in an optical Fourier transform plane for the circuit pattern in the second light receiving optical system; a first detector for photoelectrically converting the inspecti

Abstract: A defect inspecting apparatus and a defect inspecting method are provided to conduct discriminating detection of minute circuit patterns and foreign particles as well as to detect defectives on the surface of a substrate with a high precision. The beams from a laser light source are converged by a lens to be incident upon an inspecting point. The light emitted from the inspecting point by the incident beam is detected by a photoreceiver. On the light receiving surface of the photoreceiver, a plurality of light receiving areas are provided. Each of the light receiving areas has longitudinal direction and shorter direction on its positively projected view. The arrangement of the light receiving areas is selected in accordance with the arrangement information of the patterns formed on the substrate. The foreign particles and the patterns are distinguished by obtaining the logical product of the output signals from the selected light receiving area.

Abstract: A defect inspecting apparatus for detecting a defect on a mask formed with a predetermined pattern comprises a first illumination system for transmission-illuminating the mask with light beams, a second illumination system for vertically illuminating the mask with the light beams, a first light receiving optical system for receiving illumination light beams emitted from the first illumination system and penetrating the mask and for forming an image, a second light receiving optical system for receiving illumination light beams emitted from the second illumination system and reflected by the mask and for forming an image, a first photoelectric converting element for detecting the image formed by the first light receiving optical system, a second photoelectric converting element for detecting the image formed by the second light receiving optical system and a signal processing circuit for detecting the defect on the basis of signals from the first and second photoelectric converting elements.

Abstract: An observation apparatus of the present comprises (i) a light source for generating light; (ii) a separating optical system which splits the light from the light source into two different polarized light beams; (iii) a condenser optical system which converges the two polarized light beams from the separating optical system so as to respectively form light spots on two different positions on a sample object; (iv) a polarization selecting means which has a predetermined analyzer angle and selects a specific polarized light component from composite light made of the two polarized light beams by way of the sample object; (v) light detecting means which detects the polarized light component selected by the polarization selecting means; and (vi) phase difference adjustment means which adjusts a phase difference between the two polarized light beams by way of the sample object and guides composite light composed of the two polarized light beams as circularly polarized light to the polarization selecting means, when

Abstract: An optical scanning device includes a light deflection unit for deflecting a light beam emitted by a light source to be incident on an object to be irradiated, a polarization state adjusting unit for adjusting the polarization state of the light beam, so that the light beam to be incident on the object to be irradiated has a predetermined polarization state with respect to the object to be irradiated, and a rotary driving unit for rotating the light deflection unit and the polarization state adjusting unit together so that the light beam deflected by the light deflection unit scans the object to be irradiated.

Abstract: A light source apparatus for emitting rectilinear polarized light beams includes a light source unit, a polarizing filter unit for transmitting a first rectilinear polarized component among the light beams emitted from the light source unit but reflecting a second rectilinear polarized component and a light reflecting member for reflecting the second rectilinear polarized component in a direction of the polarizing filter unit and converting a direction of a polarization plane of the reflected second rectilinear polarized component into a direction of a polarization plane of the first rectilinear polarized component.

Abstract: A defect inspecting apparatus and a defect inspecting method are provided to conduct discriminating detection of minute circuit patterns and foreign particles as well as to detect defectives on the surface of a substrate with a high precision. The beams from a laser light source are converged by a lens to be incident upon an inspecting point. The light emitted from the inspecting point by the incident beam is detected by a photoreceiver. On the light receiving surface of the photoreceiver, a plurality of light receiving areas are provided. Each of the light receiving areas has longitudinal direction and shorter direction on its positively projected view. The arrangement of the light receiving areas is selected in accordance with the arrangement information of the patterns formed on the substrate. The foreign particles and the patterns are distinguished by obtaining the logical product of the output signals from the selected light receiving area.

Abstract: An apparatus for optically inspecting foreign matter attached to a surface of a substrate on which a pattern is formed, includes an optical scan device for forming an arcuated optical scan line by scanning illumination light on the surface of the substrate, a moving device for moving the substrate relative to the optical scan line in a predetermined direction, a light-receiving device for receiving scattered light from the foreign matter attached to the surface of the substrate, and outputting an electrical signal corresponding to the intensity of the scattered light, and a signal processing device for detecting the foreign matter on the basis of the electrical signal from the light-receiving device.

Abstract: The defect inspecting apparatus of this invention is provided with a light source for applying illuminating light, illuminating means for applying the illuminating light from the light source onto the surface of a substrate to be inspected, a lens system for condensing the beam of light from the surface to be inspected and creating a spatial frequency spectrum on a Fourier transform plane to the surface to be inspected or a plane conjugate therewith, a light intercepting member for setting a spectrum-free area in the spatial frequency spectrum of the light from a pattern, the light intercepting member being disposed between the light source and the substrate and being effective to intercept part of the illuminating light, a space filter disposed on the Fourier transform plane or the plane conjugate therewith for passing therethrough the light in the spectrum-free area, light receiving means for receiving the beam of light passed through the space filter and outputting a photoelectric signal, the beam of light

Abstract: A foreign particle inspection apparatus, for detecting a foreign particle on a reticle or the like includes an illumination system for irradiating an inspection area on a specimen with inspecting light, and plural light-receiving systems adapted to condense the scattered light from a foreign particle in the inspection area and having respective light-receiving areas on the specimen, each smaller than the inspection area. Each of the light-receiving areas of the plural light-receiving systems overlaps partially with at least one of the other light-receiving areas. The plural light-receiving systems are so arranged that any point in the inspection area is covered by the light-receiving areas of at least two of the plural light-receiving systems. A foreign particle in the inspection area is detected by a detection system, based on the lights condensed by the plural light receiving systems.