Patents by Inventor Tsung-Chun Liu

Tsung-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935871
    Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang, Ming-Hung Tseng, Kris Lipu Chuang, Chung-Ming Weng, Tsung-Yuan Yu, Tzuan-Horng Liu
  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 7496497
    Abstract: A method and system provide for selecting a web site home page in a desired language. The method comprises identifying within a web address request a directional information item by extracting from the request a site language cookie stored in a user's access device, providing a web page associated with the web address to a second web site corresponding to the directional information item wherein the second web site includes a language translator, translating the web page textual information in accordance with the language translator and returning the translated web page to the user. The method further provides for accessing a control table to determine a status of the web page and obtaining a version of the web page stored locally on the second site or otherwise obtaining a current version of the web page; and translating the obtained web page.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: February 24, 2009
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Tsung-Chun Liu
  • Publication number: 20050137873
    Abstract: A method and system to allow a user to select a web site home page in a desired language is disclosed. The method comprises the steps of identifying within a web address request a directional information item, providing a web page associated with the web address to a second web site corresponding to said directional information item, wherein the second web site includes a language translator, translating the web page textual information in accordance with the language translator and returning the translated web page to the user. The method further comprises the steps of accessing a control table to determine a status of the web page and obtaining a version of the web page stored locally on the second site, when said status indicates said web page is locally stored and valid, otherwise obtaining a current version of the web page; and translating the obtained web page.
    Type: Application
    Filed: December 18, 2003
    Publication date: June 23, 2005
    Inventor: Tsung-Chun Liu