Patents by Inventor Tsung-Han LI
Tsung-Han LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147059Abstract: A doorbell system includes a chime device, a network communication device and a doorbell body. The chime device is disposed within a first space. The network communication device has a Power over Ethernet function. The network communication device issues an Ethernet network power signal and provides a remote network communication service. The doorbell body includes a doorbell button. The doorbell body is electrically connected with the network communication device through a Power-over-Ethernet power supply and data bus. The doorbell body receives the Ethernet network power signal from the network communication device through the Power-over-Ethernet power supply and data bus. The doorbell body is powered by the Ethernet network power signal only. In response to a pressing and activating action on the doorbell button, the doorbell body issues a doorbell enabling control signal. The chime device generates a chime sound effect in response to the doorbell enabling control signal.Type: ApplicationFiled: January 18, 2023Publication date: May 2, 2024Inventor: Tsung-Han Li
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Patent number: 11955245Abstract: A method and a system for mental index prediction are provided. The method includes the following steps. A plurality of images of a subject person are obtained. A plurality of emotion tags of the subject person in the images are analyzed. A plurality of integrated emotion tags in a plurality of predetermined time periods are calculated according to the emotion tags respectively corresponding to the images. A plurality of preferred features are determined according to the integrated emotion tags. A mental index prediction model is established according to the preferred features to predict a mental index according to the emotional index prediction model.Type: GrantFiled: July 2, 2021Date of Patent: April 9, 2024Assignees: Acer Incorporated, National Yang Ming Chiao Tung UniversityInventors: Chun-Hsien Li, Szu-Chieh Wang, Andy Ho, Liang-Kung Chen, Jun-Hong Chen, Li-Ning Peng, Tsung-Han Yang, Yun-Hsuan Chan, Tsung-Hsien Tsai
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Publication number: 20240114207Abstract: A media docking device includes an input module, an output module and a processing module. The input module is electrically connected to a media source device for receiving media data. The output module is electrically connected to a media play device. The processing module determines if an instruction is received from the media source device or a remote device. If the instruction is not received, the processing module transfers the media data to the output module to transmit to the media play device. If the instruction is received, the processing module limits a transmission of the media data according to the instruction, such that the media data will not be completely played by the media play device.Type: ApplicationFiled: October 4, 2023Publication date: April 4, 2024Inventors: Chien-Wei CHEN, Tsung-Han LI, You-Wen CHIOU, Kuan-Chi CHOU, Bo Yu LAI
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Publication number: 20240111849Abstract: A media docking device includes an input circuit, an output circuit and a processing circuit. The input circuit is electrically connected to a media source device for receiving media data. The output circuit is electrically connected to a media play device. The processing circuit is electrically connected to the input circuit and the output circuit. The processing circuit determines if a verification procedure is passed. If the verification procedure is passed, the processing circuit transfers the media data to the media play device. If the verification procedure is not passed, the processing circuit limits a transmission of the media data, such that the media data will not be completely played by the media play device.Type: ApplicationFiled: October 4, 2023Publication date: April 4, 2024Inventors: Chien-Wei CHEN, Tsung-Han LI, You-Wen CHIOU, Kuan-Chi CHOU, Bo Yu LAI
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Publication number: 20240097444Abstract: Embodiments of the present invention provide a hybrid system and method for distributed virtual power plants integrated intelligent net zero. In this method, a cyber physical agent (CPA) is utilized to collect a carbon emission information and an energy management information, and then an artificial intelligence (AI) optimization model of an intelligent central dispatch platform is utilized to obtain a power dispatch manner of the distributed virtual power plants based on the carbon emission information and the energy management information, such that the power dispatch manner of the distributed virtual power plants meets the requirements of enterprise economic benefits and net zero carbon emissions at the same time.Type: ApplicationFiled: November 1, 2022Publication date: March 21, 2024Inventors: Ting-Chia OU, Hao TIENG, Fan-Tien CHENG, Tsung-Han TSAI, Yu-Yong LI
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Publication number: 20240095755Abstract: A hybrid method for green intelligent manufacturing (GiM) combines the carbon reduction and the energy saving into the intelligent manufacturing based Industry 4.1 cloud platform. GiM assists companies to achieve the goal of net zero transition and help them advance to Industry 4.2 as soon as possible by simultaneously taking carbon footprint and energy issues into account. GiM collects large volumes of essential data (including carbon footprint) via cyber physical agents (CPAs), and sends them to two critical services of carbon management and intelligent energy management system (iEMS) deployed on the cloud platform. The two critical services optimize the energy dispatch schedule by strictly following the requirements of energy saving, carbon reduction, and net zero. Then, the state of zero defects of intelligent manufacturing achieved in Industry 4.1 can be upgraded to net zero of GiM in Industry 4.2.Type: ApplicationFiled: November 1, 2022Publication date: March 21, 2024Inventors: Hao TIENG, Fan-Tien CHENG, Ting-Chia OU, Tsung-Han TSAI, Yu-Yong LI
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Publication number: 20240081077Abstract: A transistor includes a first semiconductor layer, a second semiconductor layer, a semiconductor nanosheet, a gate electrode and source and drain electrodes. The semiconductor nanosheet is physically connected to the first semiconductor layer and the second semiconductor layer. The gate electrode wraps around the semiconductor nanosheet. The source and drain electrodes are disposed at opposite sides of the gate electrode. The first semiconductor layer surrounds the source electrode, the second semiconductor layer surrounds the drain electrode, and the semiconductor nanosheet is disposed between the source and drain electrodes.Type: ApplicationFiled: September 1, 2022Publication date: March 7, 2024Applicants: Taiwan Semiconductor Manufacturing Company, Ltd., National Yang Ming Chiao Tung UniversityInventors: Po-Tsun Liu, Meng-Han Lin, Zhen-Hao Li, Tsung-Che Chiang, Bo-Feng Young, Hsin-Yi Huang, Sai-Hooi Yeong, Yu-Ming Lin
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Publication number: 20240064937Abstract: An immersion cooling system includes a work tank, a chip device, a microchannel device, a first communication pipeline, and a first heat exchange device. The work tank includes a fluid section. The chip device is in the fluid section and has an inlet and an outlet. The chip device includes a motherboard, a chip, and a cover. The motherboard has a main surface substantially parallel to a vertical line. The cover is on the motherboard. The chip is between the cover and the motherboard. The microchannel device is in the chip device. Two ends of the microchannel device are respectively in communication with the inlet and the outlet. The first communication pipeline and the first heat exchange device are in the fluid section. Two ends of the first communication pipeline are respectively in communication with the outlet and the first heat exchange device.Type: ApplicationFiled: August 7, 2023Publication date: February 22, 2024Inventors: Chia-Yi WU, Tsung-Han LI, Tai-Ying TU, Ting-Yu PAI
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Publication number: 20240057291Abstract: A piece of immersion liquid cooling equipment, which is adapted for an electronic device, includes a tank, a condenser, a cold plate, and a first pipe. The tank accommodates a first fluid, and the electronic device is immersed in the first fluid in the form of a liquid. The condenser is disposed in the tank and located above the first fluid in the form of a liquid. The cold plate is disposed in the tank and is in thermal contact with at least one high power commodity of the electronic device. The first pipe is disposed and extends between an exterior and an interior of the tank. The first pipe communicates with the condenser and the cold plate. The first pipe is configured to receive a second fluid to flow through the condenser and the cold plate. A heat dissipation method for an electronic device.Type: ApplicationFiled: August 9, 2023Publication date: February 15, 2024Applicant: Wiwynn CorporationInventors: Tai-Ying Tu, Chia-Yi Wu, Tsung-Han Li, Ting-Yu Pai
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Publication number: 20230320033Abstract: A separate immersion cooling system includes a separate immersion cooling device. The separate immersion cooling device includes a condensing device, a plurality of cooling tanks, a plurality of outflow pipes and a plurality of return pipes. The separate immersion cooling device is adapted to cooling a heat-generating device immersed in the cooling tank.Type: ApplicationFiled: June 22, 2022Publication date: October 5, 2023Inventors: Yi Cheng, Tsung-Han Li, Chin-Han Chan, Ting-Yu Pai
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Patent number: 11740669Abstract: An electronic apparatus including at least one heat generating component and an immersion cooling system is provided. The immersion cooling system includes a box body and a condensation module. The box body is adapted to accommodate a coolant, and the heat generating component is disposed in the box body to be immersed in the coolant in a liquid state. The condensation module includes a pipeline and a condensate, and the pipeline passes through the box body and is adapted for the condensate to flow. At least one parameter of the condensate may be changed to lower a boiling point of the coolant to a predetermined value by lowering the temperature in the box body with the condensate. In addition, an operating method of the electronic apparatus is also provided.Type: GrantFiled: August 3, 2021Date of Patent: August 29, 2023Assignee: Wiwynn CorporationInventors: Yi Cheng, Chun-Wei Lin, Tsung-Han Li, Ting-Yu Pai
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Patent number: 11665864Abstract: An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.Type: GrantFiled: August 9, 2021Date of Patent: May 30, 2023Assignee: Wiwynn CorporationInventors: Yu-Cheng Chu, Chin-Hao Hsu, Tsung-Han Li, Ting-Yu Pai
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Publication number: 20220361357Abstract: An electronic apparatus including at least one heat generating component and an immersion cooling system is provided. The immersion cooling system includes a box body and a condensation module. The box body is adapted to accommodate a coolant, and the heat generating component is disposed in the box body to be immersed in the coolant in a liquid state. The condensation module includes a pipeline and a condensate, and the pipeline passes through the box body and is adapted for the condensate to flow. At least one parameter of the condensate may be changed to lower a boiling point of the coolant to a predetermined value by lowering the temperature in the box body with the condensate. In addition, an operating method of the electronic apparatus is also provided.Type: ApplicationFiled: August 3, 2021Publication date: November 10, 2022Applicant: Wiwynn CorporationInventors: Yi Cheng, Chun-Wei Lin, Tsung-Han Li, Ting-Yu Pai
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Publication number: 20220361377Abstract: An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.Type: ApplicationFiled: August 9, 2021Publication date: November 10, 2022Applicant: Wiwynn CorporationInventors: Yu-Cheng Chu, Chin-Hao Hsu, Tsung-Han Li, Ting-Yu Pai
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Publication number: 20220361358Abstract: An immersion cooling system includes a box body, a condensing structure and a pressure adjusting module. The box body has a first containing space, the first containing space is adapted to contain a heat dissipation medium, and at least one heat generating component is disposed in the first containing space to be immersed in the heat dissipation medium which is in liquid state. The condensing structure is disposed in the first containing space and above the heat dissipation medium which is in liquid state. The pressure adjusting module is adapted to actively drive a liquid in the first containing space to flow into the second containing space, such that a pressure in the first containing space is reduced to be less than an external pressure. In addition, an electronic apparatus having the immersion cooling system and a pressure adjusting module are also provided.Type: ApplicationFiled: August 4, 2021Publication date: November 10, 2022Applicant: Wiwynn CorporationInventors: Tsung-Han Li, Chin-Han Chan, Yi Cheng, Ting-Yu Pai
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Patent number: 10398022Abstract: An adjustable fixing device applied to a heat dissipating component is used in an electronic apparatus. The adjustable fixing device includes a first connecting component, a second connecting component and a fixing component. The first connecting component has a first stopper portion. The second connecting component has a first screwing portion and is detachably connected to the first connecting component. The fixing component includes a main body, a second stopper portion and a second screwing portion. The main body has a first part and a second part. The second stopper portion is disposed on the first part to move relative to the first stopper portion according to rotation of the main body. The second screwing portion is disposed on the second part and used to engage with the first screwing portion.Type: GrantFiled: February 10, 2019Date of Patent: August 27, 2019Assignee: Wiwynn CorporationInventors: Tsung-Han Li, Tzu-Ting Wang, Ting-Yu Pai
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Patent number: 9887357Abstract: The primary objective of the present invention is to provide a method for manufacturing organic layers of organic light-emitting device by using deposition machine, which mainly uses the way of premixing organic materials to dissolving and mixing multi kinds of organic materials; moreover, after completing the vacuum drying process to the mixed organic materials, the method is then proceeded for depositing the mixed organic materials on a substrate in single vapor deposition process; after then, the method is proceeded for ended the deposition process to the material carrier and repeatedly operating deposition process to another material container, so as to produce multi-layers structure on the substrate; wherein method proposed by the present invention can replace the conventional manufacturing process and can avoid the disadvantages thereof.Type: GrantFiled: January 18, 2017Date of Patent: February 6, 2018Assignee: National Tsing Hua UniversityInventors: Jwo-Huei Jou, Tsung-Han Li, Saulius Grigalevi{hacek over (c)}ius, Gintare Kru{hacek over (c)}aite
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Publication number: 20170213962Abstract: The primary objective of the present invention is to provide a method for manufacturing an organic element, which majorly uses the way of premixing organic materials to dissolving and mixing multi kinds of organic materials; moreover, after completing the vacuum drying process to the mixed organic materials, the method is then proceeded for depositing the mixed organic materials on a substrate in single vapor deposition process; after then, the method is proceeded for ended the deposition process to the material carrier and repeatedly operating deposition process to another deposition material carrier, so as to produce multi-layers structure on the substrate; wherein method proposed by the present invention can replace the conventional manufacturing process and can avoid the disadvantages thereof.Type: ApplicationFiled: January 18, 2017Publication date: July 27, 2017Inventors: JWO-HUEI JOU, TSUNG-HAN LI, SAULIUS GRIGALEVICIUS, GINTARE KRUCAITE
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Patent number: 9266833Abstract: The present invention provides a carrier transport material formed by completing a reaction process of at least one aromatic compound and at least one polycyclic aromatic hydrocarbons (PAHs), wherein a cross linking reaction can be activated in the molecular compound through heating or ultraviolet irradiation because the molecular compound has at least one cross-linkable functional group. Therefore, when the carrier transport material is applied in an OLED, the carrier transport material would not be dissolved by the solvent included in the next coated material because the carrier transport material has been cured after the cross linking reaction is carried out. Moreover, because the carrier transport material would simultaneously perform an electron confining functionality when being used as a hole transport layer, the device efficiency of the OLED having the carrier transport material is obviously enhanced during the high-brightness operation especially.Type: GrantFiled: July 25, 2014Date of Patent: February 23, 2016Assignee: National Tsing Hua UniversityInventors: Jwo-Huei Jou, Tsung-Han Li, Saulius Grigalevi{hacek over (c)}ius, Gintarė Kru{hacek over (c)}aitė
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Publication number: 20160028013Abstract: The present invention provides a carrier transport material formed by completing a reaction process of at least one aromatic compound and at least one polycyclic aromatic hydrocarbons (PAHs), wherein a cross linking reaction can be activated in the molecular compound through heating or ultraviolet irradiation because the molecular compound has at least one cross-linkable functional group. Therefore, when the carrier transport material is applied in an OLED, the carrier transport material would not be dissolved by the solvent included in the next coated material because the carrier transport material has been cured after the cross linking reaction is carried out. Moreover, because the carrier transport material would simultaneously perform an electron confining functionality when being used as a hole transport layer, the device efficiency of the OLED having the carrier transport material is obviously enhanced during the high-brightness operation especially.Type: ApplicationFiled: July 25, 2014Publication date: January 28, 2016Inventors: Jwo-Huei Jou, Tsung-Han Li, SAULIUS GRIGALEVICIUS, GINTARÉ KRUCAITÉ