Patents by Inventor Tsung-Han Ou

Tsung-Han Ou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240097444
    Abstract: Embodiments of the present invention provide a hybrid system and method for distributed virtual power plants integrated intelligent net zero. In this method, a cyber physical agent (CPA) is utilized to collect a carbon emission information and an energy management information, and then an artificial intelligence (AI) optimization model of an intelligent central dispatch platform is utilized to obtain a power dispatch manner of the distributed virtual power plants based on the carbon emission information and the energy management information, such that the power dispatch manner of the distributed virtual power plants meets the requirements of enterprise economic benefits and net zero carbon emissions at the same time.
    Type: Application
    Filed: November 1, 2022
    Publication date: March 21, 2024
    Inventors: Ting-Chia OU, Hao TIENG, Fan-Tien CHENG, Tsung-Han TSAI, Yu-Yong LI
  • Publication number: 20240095755
    Abstract: A hybrid method for green intelligent manufacturing (GiM) combines the carbon reduction and the energy saving into the intelligent manufacturing based Industry 4.1 cloud platform. GiM assists companies to achieve the goal of net zero transition and help them advance to Industry 4.2 as soon as possible by simultaneously taking carbon footprint and energy issues into account. GiM collects large volumes of essential data (including carbon footprint) via cyber physical agents (CPAs), and sends them to two critical services of carbon management and intelligent energy management system (iEMS) deployed on the cloud platform. The two critical services optimize the energy dispatch schedule by strictly following the requirements of energy saving, carbon reduction, and net zero. Then, the state of zero defects of intelligent manufacturing achieved in Industry 4.1 can be upgraded to net zero of GiM in Industry 4.2.
    Type: Application
    Filed: November 1, 2022
    Publication date: March 21, 2024
    Inventors: Hao TIENG, Fan-Tien CHENG, Ting-Chia OU, Tsung-Han TSAI, Yu-Yong LI
  • Patent number: 11170926
    Abstract: An isolation coupling structure for transmitting a feedback signal between a secondary side and a primary side of a voltage conversion device includes a first dielectric layer including a first face and a second face opposite to the first face, a first coupling coil disposed on the first face enclosing to form an inner region; a second coupling coil configured to couple with the first coupling coil. The second coupling coil includes a first coil portion and a second coil portion, where the first coil portion is disposed on the second face, the second coil portion is disposed on the first face and located inside the inner region. The second coil portion is isolated from the first coupling coil, and the first coil portion and the second coil portion are electrically connected. The technical effect is that it can realize the electrical isolation and the coupling with low cost and small package size.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: November 9, 2021
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Jung-Pei Cheng, Hsiang-Chung Chang, Yu-Ming Chen, Chieh-Wen Cheng, Tsung-Han Ou, Lih-Ming Doong
  • Publication number: 20190172621
    Abstract: An isolation coupling structure for transmitting a feedback signal between a secondary side and a primary side of a voltage conversion device includes a first dielectric layer including a first face and a second face opposite to the first face, a first coupling coil disposed on the first face enclosing to form an inner region; a second coupling coil configured to couple with the first coupling coil. The second coupling coil includes a first coil portion and a second coil portion, where the first coil portion is disposed on the second face, the second coil portion is disposed on the first face and located inside the inner region. The second coil portion is isolated from the first coupling coil, and the first coil portion and the second coil portion are electrically connected. The technical effect is that it can realize the electrical isolation and the coupling with low cost and small package size.
    Type: Application
    Filed: February 2, 2018
    Publication date: June 6, 2019
    Applicant: Alpha and Omega Semiconductor (Cayman) Ltd.
    Inventors: Jung-Pei Cheng, Hsiang-Chung Chang, Yu-Ming Chen, Chieh-Wen Cheng, Tsung-Han Ou, Lih-Ming Doong