Abstract: A backside metallized compound semiconductor device includes a compound semiconductor wafer and a metal layered structure. The compound semiconductor wafer includes a substrate having opposite front and back surfaces, and a ground pad structure formed on the front surface. The substrate is formed with a via extending from the back surface to the front surface to expose a side wall of the substrate and a portion of the ground pad structure. The metal layered structure is disposed on the back surface, and covers the side wall and the portion of the ground pad structure. The metal layered structure includes an adhesion layer, a seed layer, a gold layer, and an electroplated copper layer that are formed on the back surface in such order. The method for manufacturing the backside metallized compound semiconductor device is also disclosed.

Abstract: A cutting and clamping device includes an electrical control box. A base board is mounted atop the electrical control box and includes slide rails and a slide block. A supply mechanism is mounted to the base board for supplying an un-processed part strip. A conveyance mechanism is mounted to the slide block and has one end adjacent to the supply mechanism. A forwarding mechanism is mounted on the conveyance mechanism and includes a sharp tip, which is releasably insertable into positioning holes defined in the part strip. A cutting mechanism is mounted to the slide block and is connected to an opposite end of the conveyance mechanism. The cutting mechanism includes a cutting blade assembly and defines a cutting zone into which the cutting blade assembly is extendable. A clamping and retaining mechanism includes a first clamp assembly, a second clamp assembly, and a retaining assembly.

Abstract: A flexible printed circuit (FPC) connector assembling fixture is provided for assembling an FPC connector. The assembling fixture includes a base that is set horizontally. A lower slidable carriage is slidably coupled to the base. Upper and lower molds are respectively and rotatably coupled to an upper slidable carriage and the lower slidable carriage. A terminal fitting mechanism and a cover mounting mechanism are respectively mounted to the upper and lower molds. Guide posts are mounted to the base. The upper mold is slidably coupled to the base with the guide posts. The lower mold forms an accommodation chamber. The cover mounting mechanism includes a push rod and first and second slide channels. The second slide channel is in communication with the accommodation chamber and the first slide channel. The push rod is received in and slidably coupled to the second slide channel.

Abstract: An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism, a second soldering mechanism, and a control system. The vehicle is conveyed by the conveyor mechanism for carrying a workpiece. The first part assembling mechanism and the first soldering mechanism assemble and solder a first part to the primary workpiece carried by the vehicle. The turn-over mechanism turns the vehicle that is conveyed by the conveyor mechanism and carries the primary workpiece having the first part assembled thereto by a predetermined angle. The second part assembling mechanism and the second soldering mechanism assemble and solder and position a second part to the primary workpiece. The control system is electrically connected to and thus controls the first part and second part assembling mechanisms, the first and second soldering mechanisms, and the turn-over mechanism.

Abstract: An automatic soldering system includes a conveyance mechanism, a vehicle, a first part assembling mechanism, a first soldering mechanism, a turn-over mechanism, a second part assembling mechanism, a second soldering mechanism, and a control system. The vehicle is conveyed by the conveyor mechanism for carrying a workpiece. The first part assembling mechanism and the first soldering mechanism assemble and solder a first part to the primary workpiece carried by the vehicle. The turn-over mechanism turns the vehicle that is conveyed by the conveyor mechanism and carries the primary workpiece having the first part assembled thereto by a predetermined angle. The second part assembling mechanism and the second soldering mechanism assemble and solder and position a second part to the primary workpiece. The control system is electrically connected to and thus controls the first part and second part assembling mechanisms, the first and second soldering mechanisms, and the turn-over mechanism.