Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

Abstract: A semiconductor die package includes a high dielectric constant (high-k) dielectric layer over a device region of a first semiconductor die that is bonded with a second semiconductor die in a wafer on wafer (WoW) configuration. A through silicon via (TSV) structure may be formed through the device region. The high-k dielectric layer has an intrinsic negative charge polarity that provides a coupling voltage to modify the electric potential in the device region. In particular, the electron carriers in high-k dielectric layer attracts hole charge carriers in device region, which suppresses trap-assist tunnels that result from surface defects formed during etching of the recess for the TSV structure. Accordingly, the high-k dielectric layer described herein reduces the likelihood of (and/or the magnitude of) current leakage in semiconductor devices that are included in the device region of the first semiconductor die.

Abstract: Disclosed is a method for forming a crystalline protective polysilicon layer which does not create defective voids during subsequent processes so as to provide effective protection to devices underneath. In one embodiment, a method for forming a semiconductor device, includes: depositing a protective coating on a first polysilicon layer; forming an epitaxial layer on the protective coating; and depositing a second polysilicon layer over the epitaxial layer, wherein the protective coating comprises a third polysilicon layer, wherein the third polysilicon layer is deposited at a first temperature in a range of 600-700 degree Celsius, and wherein the third polysilicon layer in the protect coating is configured to protect the first polysilicon layer when the second polysilicon layer is etched.

Abstract: The present invention relates to an internet multimedia system. The internet multimedia system includes a remote server comprising a backend application program, wherein the backend application program is built as a web-based platform, accessed by a browser and provides a program playlist comprising a plurality of arranged uniform resource locators; and a local device connected with the remote server through an internet and comprising a frontend application program and the browser for providing a user to operate the backend application program through the browser, wherein the frontend application program installs and executes on the local device and accesses the program playlist through the backend application program.

Abstract: A power management device and method are provided. The power management device for a flip electrical device, which has a lid part and a main part, includes: a sensing unit, configured to detect whether the lid part and the main part are overlapped, and generate a notification signal when the lid part and the main part are overlapped; an operation unit, configured to detect whether the flip electrical device is connected to an external display device according to the notification signal, and generate a detecting result, and when a defined condition is conformed, the operation unit is operated in an operating mode and transmits image data to the external display device, wherein the defined condition includes a set function being enabled, and the detecting result is that the flip electrical device is connected to the external display device.

Abstract: A method of controlling screen brightness of an electronic device includes detecting the remaining capacity of a battery installed on an electronic device, and controlling screen brightness of the electronic device according to the remaining capacity of the battery. Power consumption of the electronic device can be reduced according to the remaining capacity of the battery; therefore, battery run time of the electronic device can be increased.