Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A porous film microfluidic device includes a sample well, a porous film support structure, including a first, second, and third port, wherein the first port is connected to the sample well, a porous film is formed over the bottom of the porous film support structure, and a glass fiber film is formed between the porous film support structure and the porous film, a waste tank connected to the second port of the porous film support structure, wherein a water absorption element is disposed in the waste tank, a buffer solution tank connected to the third port of the porous film support structure and sealed by a sealing film, and a COC plastic prism disposed over the bottom of the porous film support structure. The COC plastic prism includes a metal film in contact with the porous film and a metal oxide layer formed over the COC plastic prism.

Abstract: A porous film microfluidic device includes a sample well, a porous film support structure, including a first, second, and third port, wherein the first port is connected to the sample well, a porous film is formed over the bottom of the porous film support structure, and a glass fiber film is formed between the porous film support structure and the porous film, a waste tank connected to the second port of the porous film support structure, wherein a water absorption element is disposed in the waste tank, a buffer solution tank connected to the third port of the porous film support structure and sealed by a sealing film, and a COC plastic prism disposed over the bottom of the porous film support structure. The COC plastic prism includes a metal film in contact with the porous film and a metal oxide layer formed over the COC plastic prism.

Abstract: An optical waveguide SPR sensor is adapted for differential measurement. The optical waveguide SPR sensor includes a base, a bottom layer, and at least one set of optical waveguide layers. The set of the optical waveguide layers includes a measuring optical waveguide channel and a reference optical waveguide channel. The measuring optical waveguide channel includes an SPR sensing film layer. The measuring optical waveguide channel and the reference optical waveguide channel are independently configured and substantially parallel one to another. The bottom layer has a refractive index higher than a refractive index of the optical waveguide layer.

Abstract: An optical waveguide SPR sensor is adapted for differential measurement. The optical waveguide SPR sensor includes a base, a bottom layer, and at least one set of optical waveguide layers. The set of the optical waveguide layers includes a measuring optical waveguide channel and a reference optical waveguide channel. The measuring optical waveguide channel includes an SPR sensing film layer. The measuring optical waveguide channel and the reference optical waveguide channel are independently configured and substantially parallel one to another. The bottom layer has a refractive index higher than a refractive index of the optical waveguide layer.