Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: A gas detection purification device is disclosed and includes a main body, a purification unit, a gas guider, a gas detection module and a controlling-driving module. The main body includes an inlet, an outlet, an external socket and a gas-flow channel disposed between the inlet and the outlet. The purification unit is disposed in the gas-flow channel for filtering gas introduced through the gas-flow channel. The gas guider is disposed in the gas channel and located at a side of the purification unit. The gas is inhaled through the inlet, flows through the purification unit and is discharged out through the outlet. The gas detection module is plugged into or detached from the external socket. The controlling driving module is disposed within the main body and electrically connected to the gas guider to control the operation of the gas guider in an enabled state and a disabled state.

Abstract: A lamp device includes a shell and a light-emitting module. The shell has two guiding fastener members opposite to each other. The light-emitting module includes a carrier board body, fastening members, light-emitting assemblies, and a light-permeable shield module. One side of the carrier board body has two opposite connecting members. The carrier board body is connected with the two guiding fastener members through the connecting members to move relative to the shell along the guiding fastener members. The carrier board body has fastening holes cooperating with the fastening members so that the carrier board body and the guiding fastener members are fastened to each other. The light-emitting assemblies and the light-permeable shield module are fixedly disposed on one side of the carrier board body. The light-permeable shield module does not protrude from the ends of two side walls of the shell that are away from a top wall.

Abstract: The present application belongs to field of integrated circuit and discloses an electrostatic discharge protection circuit comprising a first N-type transistor and a second N-type transistor. The first N-type transistor comprises a first gate terminal coupled to a ground terminal; a first electrode terminal coupled to the first gate terminal; and a second electrode terminal. The second N-type transistor comprises a second gate terminal coupled to a metal pad; a third electrode terminal coupled to the second gate terminal; a fourth electrode terminal, coupled to the second electrode terminal; and a first deep N well, disposed under the third electrode terminal and the fourth electrode terminal. The ESD protection circuits provided by the embodiments of the present application have advantages of small circuit area and good ESD protection.

Abstract: A lamp device includes a shell and a light-emitting module. The shell has two guiding fastener members opposite to each other. The light-emitting module includes a carrier board body, fastening members, light-emitting assemblies, and a light-permeable shield module. One side of the carrier board body has two opposite connecting members. The carrier board body is connected with the two guiding fastener members through the connecting members to move relative to the shell along the guiding fastener members. The carrier board body has fastening holes cooperating with the fastening members so that the carrier board body and the guiding fastener members are fastened to each other. The light-emitting assemblies and the light-permeable shield module are fixedly disposed on one side of the carrier board body. The light-permeable shield module does not protrude from the ends of two side walls of the shell that are away from a top wall.

Abstract: The present application provides an electrostatic discharge protection circuit including a first N-type transistor, a second N-type transistor and a high-voltage tracing circuit. The high-voltage tracing circuit includes a first input terminal, a second input terminal and an output terminal. The first input terminal is coupled to the metal pad to receive a metal pad voltage. The second input terminal receives a supply voltage. The output terminal is coupled to the second N-type transistor and configured to output a high-voltage tracing voltage, wherein the high-voltage tracing voltage is larger than or equal to the metal pad voltage.

Abstract: The present application belongs to field of integrated circuit and discloses an electrostatic discharge protection circuit comprising a first N-type transistor and a second N-type transistor. The first N-type transistor comprises a first gate terminal coupled to a ground terminal; a first electrode terminal coupled to the first gate terminal; and a second electrode terminal. The second N-type transistor comprises a second gate terminal coupled to a metal pad; a third electrode terminal coupled to the second gate terminal; a fourth electrode terminal, coupled to the second electrode terminal; and a first deep N well, disposed under the third electrode terminal and the fourth electrode terminal. The ESD protection circuits provided by the embodiments of the present application have advantages of small circuit area and good ESD protection.

Abstract: The present application provides an electrostatic discharge protection circuit including a first N-type transistor, a second N-type transistor and a high-voltage tracing circuit. The high-voltage tracing circuit includes a first input terminal, a second input terminal and an output terminal. The first input terminal is coupled to the metal pad to receive a metal pad voltage. The second input terminal receives a supply voltage. The output terminal is coupled to the second N-type transistor and configured to output a high-voltage tracing voltage, wherein the high-voltage tracing voltage is larger than or equal to the metal pad voltage.

Abstract: A lamp having the thermal sensing elements disposed at optimal positions includes a heat sink, a light-emitting module and a power supply module. The heat sink includes a plurality of heat dissipating fins, and a heat dissipating channel formed between each two of the plurality of heat dissipating fins, therefore forms an accommodating space. The power supply module is disposed in the accommodating space. The power supply module includes a conductive base and a controlling module. The power source module and thermal sensitive elements are disposed at the lamp cold zone. First thermal sensing elements of the controlling module are disposed at the lamp heat zone to sense the first operating temperature. A processing unit of the control module lowers the output power of the power source module to the light-emitting module when the first operating temperature is greater than or equal to a first critical operating temperature.

Abstract: A heat dissipating device for lightings includes a light source module, a heat sink, and a converter. The heat sink has a substrate and a plurality of heat dissipating fins extending outward from the substrate. A plurality of channels is formed between the heat dissipating fins. Insides of the channels respectively have a port open to the center of the heat sink. Thereby, the channels of the heat sink can effectively direct the airflow into the center of the heat sink, enhancing the heat dissipating effect of the heat sink.

Abstract: A heat dissipating device for lightings includes a light source module, a heat sink, and a converter. The heat sink has a substrate and a plurality of heat dissipating fins extending outward from the substrate. A plurality of channels is formed between the heat dissipating fins. Insides of the channels respectively have a port open to the center of the heat sink. Thereby, the channels of the heat sink can effectively direct the airflow into the center of the heat sink, enhancing the heat dissipating effect of the heat sink.

Abstract: A heat dissipating device for lightings includes a light source module, a heat sink, and a converter. The heat sink has a substrate and a plurality of heat dissipating fins extending outward from the substrate. A plurality of channels is formed between the heat dissipating fins. Insides of the channels respectively have a port open to the centre of the heat sink. Thereby, the channels of the heat sink can effectively direct the airflow into the centre of the heat sink, enhancing the heat dissipating effect of the heat sink.

Abstract: A photovoltaic cell structure includes a substrate, a metal layer, a p-type semiconductor layer, an n-type semiconductor layer, a transparent conductive layer and a high resistivity layer. The metal layer is formed on the substrate. The p-type semiconductor layer is formed on the metal layer and may include a compound of copper indium gallium selenium sulfur (CIGSS), copper indium gallium selenium (CIGS), copper indium sulfur (CIS), copper indium selenium (CIS) or a compound of at least two of copper, selenium or sulfur. The n-type semiconductor layer exhibits photo catalyst behavior that can increase carrier mobility by receiving light, and is formed on the p-type semiconductor layer, thereby forming a p-n junction. The transparent conductive layer is formed on the n-type semiconductor layer. The high resistivity layer is formed between the metal layer and the transparent conductive layer.

Abstract: A heat dissipating device for lightings includes a light source module, a heat sink, and a converter. The heat sink has a substrate and a plurality of heat dissipating fins extending outward from the substrate. A plurality of channels is formed between the heat dissipating fins. Insides of the channels respectively have a port open to the centre of the heat sink. Thereby, the channels of the heat sink can effectively direct the airflow into the centre of the heat sink, enhancing the heat dissipating effect of the heat sink.

Abstract: A method of stopping a bleeding from a fistula situated on a limb of a patient for hemodialysis, includes: providing a tourniquet band having a blood-stopping protrusion projecting therefrom; encircling the limb of the patient with the tourniquet band to cover the fistula and pressing the fistula with the blood-stopping protrusion to stop the bleeding; connecting a sensor to the tourniquet band to sense a blood flow in the fistula and to generate a signal representative of the blood flow; and electrically connecting a notifying device to the sensor and using the notifying device to produce a notifying signal in response to the signal transmitted by the sensor.

Abstract: An LED lamp includes a heat dissipation apparatus, an LED module, a bulb and a reflector. The heat dissipation apparatus includes a first heat sink, a second heat sink and a heat conductor positioned between the first heat sink and the second heat sink. The LED module includes a plurality of LEDs mounted on the heat conductor. The bulb is seated on the first heat sink and the reflector is seated on the second heat sink. The reflector and the bulb together form a housing for receiving the LED module and the heat conductor therein. Heat pipes are used to thermally connect the heat conductor and the first and second heat sinks.

Abstract: An LED lamp includes a lamp holder, a heat sink, a plurality of LED modules, a cover, an envelope and a sealing cushion. The lamp holder has a connecting portion at a bottom thereof adapted for engaging with a lamp socket to fix the LED lamp in position. The heat sink is disposed on the lamp holder. The LED modules are attached to a circumference of the heat sink. The cover is coupled to a top of the heat sink. The envelope encloses the heat sink and the LED modules therein and has a lower end engaging with the lamp holder and an upper end engaging with the cover. The sealing cushion is provided between at least one of the combinations of the lamp holder and the envelope, and of the cover and the envelope to prevent an entry of foreign matter.

Abstract: An LED lamp includes a heat sink (10), a plurality of heat pipes (20) mounted on outer sidewalls (120) of the heat sink, and a plurality of LED modules (30) attached on the outer sidewalls of the heat sink with a portion of each LED module contacting a corresponding heat pipe directly. A plurality of fins (14) extend inwardly from an inner wall of the heat sink in a manner such that a through hole (16) is enclosed by the fins, thereby providing an airflow passage axially through the heat sink. By the use of the heat pipes, heat generated by the LED modules can be transferred to the heat sink evenly, whereby the heat can be dispersed to ambient air efficiently and rapidly.

Abstract: A liquid cooling device (10) includes a heat sink (12), a reservoir (14) distant from the heat sink, a duct (16) connecting with the reservoir, a flexible tube (18) connected to the duct and the heat sink, and a heat-transfer member (19) in the liquid cooling device. The liquid cooling device is filled with liquid therein. The heat-transfer member is a heat pipe including an evaporating segment (192) fixed to the heat sink and a condensing segment (194) extending freely in the reservoir.

Abstract: An LED lamp includes a lamp holder, a heat sink, a plurality of LED modules, a cover, an envelope and a sealing cushion. The lamp holder has a connecting portion at a bottom thereof adapted for engaging with a lamp socket to fix the LED lamp in position. The heat sink is disposed on the lamp holder. The LED modules are attached to a circumference of the heat sink. The cover is coupled to a top of the heat sink. The envelope encloses the heat sink and the LED modules therein and has a lower end engaging with the lamp holder and an upper end engaging with the cover. The sealing cushion is provided between at least one of the combinations of the lamp holder and the envelope, and of the cover and the envelope to prevent an entry of foreign matter.