Abstract: A VLSI-compatible process for the manufacturing of a monolithic high-density electronic head in the form of a single composite IC chip for reading and/or writing multiple tracks of magnetically recordable information. The VLSI-compatible process comprises the steps of fabricating a digital signal process circuit as well as other desired circuit components on a substrate, then fabricating a plurality of read and/or write elements on the same substrate using a thin film technique. Because the silicon-based materials, which are used to replace the conventional magneto-resistant elements, show very little magneto-resistance effect at room temperature, a magnetically sensitive layer is provided which comprises a double-drain polycrystalline thin-films transistor (DTFT) to provide the required sensitivity.