Abstract: An electrode structure of rechargeable battery includes a battery tab stack, an electrode lead, a welding protective layer and a welding seam. The battery tab stack is formed by extension of a plurality of electrode sheets. The electrode lead is joined to one side of the battery tab stack. The welding protective layer is joined to another side of the battery tab stack opposite to the electrode lead. The welding seam extends from the welding protective layer to the electrode lead through the battery tab stack.

Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a first gate electrode disposed on the substrate and located in a first region of the semiconductor device. The semiconductor device also includes a first sidewall structure covering the first gate electrode. The semiconductor device further includes a protective layer disposed between the first gate electrode and the first sidewall structure. In addition, the semiconductor device includes a second gate electrode disposed on the substrate and located in a second region of the semiconductor device. The semiconductor device also includes a second sidewall structure covering a lateral surface of the second gate electrode.

Abstract: A file vulnerability detection method includes: translating a binary file into an intermediate file; analyzing the intermediate file to obtain multiple functions to be tested; establishing function characteristic data of each of the functions to be tested; and comparing correlations between the function characteristic data of each of the functions to be tested and at least one pair of characteristic data with vulnerability of at least one vulnerability function and characteristic data without vulnerability of the at least one vulnerability function in a vulnerability database based on a characteristic model to determine whether each of the functions to be tested corresponding to each function characteristic data has a vulnerability, wherein the characteristic model has information representing multiple back-end binary files generated by multiple back-end platforms, wherein the characteristic data with vulnerability has the vulnerability, and the characteristic data without vulnerability does not have the vuln

Abstract: A file vulnerability detection method includes: translating a binary file into an intermediate file; analyzing the intermediate file to obtain multiple functions to be tested; establishing function characteristic data of each of the functions to be tested; and comparing correlations between the function characteristic data of each of the functions to be tested and at least one pair of characteristic data with vulnerability of at least one vulnerability function and characteristic data without vulnerability of the at least one vulnerability function in a vulnerability database based on a characteristic model to determine whether each of the functions to be tested corresponding to each function characteristic data has a vulnerability, wherein the characteristic model has information representing multiple back-end binary files generated by multiple back-end platforms, wherein the characteristic data with vulnerability has the vulnerability, and the characteristic data without vulnerability does not have the vuln

Abstract: A system for producing test data produces fuzzing data at least according to first test data which is used for testing at least one first device and second test data which is used for testing a second device. Then, the system transmits the fuzzing data to the second device so as to test the second device.

Abstract: A system for producing test data produces fuzzing data at least according to first test data which is used for testing at least one first device and second test data which is used for testing a second device. Then, the system transmits the fuzzing data to the second device so as to test the second device.

Abstract: A compact bandpass filter within a multilayered low temperature co-fired ceramic (LTCC) substrate is provided. Each resonator comprises an inductor and a capacitor connected in parallel. A top ceramic substrate comprises a top conductive plate to form a first RF ground plane. A bottom ceramic substrate comprises a bottom conductive plate to form a second RF ground plane. A first ceramic substrate is between the top and bottom ceramic substrates. All inductors of the resonators are serpentine conductive traces on the first ceramic substrate. A second ceramic substrate is between the first and bottom ceramic substrates, having a plurality of conductive plates to form a plurality of capacitors that transmit RF signal from an input node of the bandpass filter to an output node of the bandpass filter. The resonators are located between the too and bottom conductive plates.

Abstract: A multilayer diplexer has a first I/O terminal, a second I/O terminal, an antenna terminal, a high-pass filter coupled between the antenna terminal and the second I/O terminal, and a low-pass filter coupled between the antenna terminal and the first I/O terminal. The high-pass filter has a first capacitor and a second capacitor connected in serial coupled between the antenna terminal and the second I/O terminal, a fourth capacitor coupled between the antenna terminal and the second I/O terminal, and a first inductor coupled between a connection node of the first and second capacitors and a reference ground. The low-pass filter has a second inductor coupled between the antenna terminal and the first I/O terminal, and a third and fifth capacitor connected in parallel coupled between the antenna terminal and the first I/O terminal.

Abstract: A die structure of a package is provided. The die structure of the package includes a carrier and a die. The die includes a first portion and a second portion. The top surface of the first portion is an active surface. The second portion is configured below the first portion. A first width of the first portion is smaller than a second width of the second portion. And the second portion of the die is adhered to the carrier.

Abstract: A compact bandpass filter within a multilayered low temperature co-fired ceramic (LTCC) substrate is provided. Each resonator comprises an inductor and a capacitor connected in parallel. A top ceramic substrate comprises a top conductive plate to form a first RF ground plane. A bottom ceramic substrate comprises a bottom conductive plate to form a second RF ground plane. A first ceramic substrate is between the top and bottom ceramic substrates. All inductors of the resonators are serpentine conductive traces on the first ceramic substrate. A second ceramic substrate is between the first and bottom ceramic substrates, having a plurality of conductive plates to form a plurality of capacitors that transmit RF signal from an input node of the bandpass filter to an output node of the bandpass filter. The resonators are located between the too and bottom conductive plates.