Patents by Inventor Tsung-Yi Chao

Tsung-Yi Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION
    Publication number: 20120208929
    Abstract: A resin composition for LED encapsulation is provided. The resin composition includes an epoxy resin, a curing agent and a stress adjusting agent. The resin composition of the present invention improves reliability of LED products and meets requirements in industry.
    Type: Application
    Filed: February 13, 2012
    Publication date: August 16, 2012
    Applicant: EVERLIGHT USA, INC.
    Inventors: Der-Gun Chou, Wen-Jeng Lee, Ta-Ming Liu, Tsung-Yi Chao
  • Silicone containing encapsulant
    Patent number: 8138276
    Abstract: The present invention relates to a silicone containing encapsulant composition. One embodiment of the encapsulant composition comprises (a) 30˜60 weight % of an epoxy resin; (b) 30˜60 weight % of an acid anhydride curing agent; (c) 0.1˜30 weight % of a Carbinol function silicone resin which can form a homogeneous mixture with (a) and (b) described above; and (d) 0.1˜5 weight % of a reactive UV absorber or HALS; and reactive anti-oxidant and/or phosphor containing flame retardant. The encapsulant composition can be used for a solid state light emitting device to achieve low internal stress and better -anti-yellowing performance.
    Type: Grant
    Filed: December 3, 2009
    Date of Patent: March 20, 2012
    Assignee: Everlight USA, Inc.
    Inventors: Tsung-Yi Chao, Wen-Jeng Lee, Der-Gun Chou, Yen-Cheng Li, Meng-Huang Yan
  • Silicone containing encapsulant
    Publication number: 20110054076
    Abstract: The present invention relates to a silicone containing encapsulant composition. One embodiment of the encapsulant composition comprises (a) 30˜60 weight % of an epoxy resin; (b) 30˜60 weight % of an acid anhydride curing agent; (c) 0.1˜30 weight % of a Carbinol function silicone resin which can form a homogeneous mixture with (a) and (b) described above; and (d) 0.1˜5 weight % of a reactive UV absorber or HALS; and reactive anti-oxidant and/or phosphor containing flame retardant. The encapsulant composition can be used for a solid state light emitting device to achieve low internal stress and better-anti-yellowing performance.
    Type: Application
    Filed: December 3, 2009
    Publication date: March 3, 2011
    Applicant: Everlight USA, Inc.
    Inventors: Tsung-Yi Chao, Wen-Jeng Lee, Der-Gun Chou, Yen-Cheng Li, Meng-Huang Yan