Abstract: A transparent electronic device includes an organic film, an amorphous transparent oxycarbide layer, and a matrix layer. The organic film includes a polymer containing carboxyl groups (—COOH). The amorphous transparent oxycarbide layer is disposed on the organic film and consists of a metal element, carbon element, oxygen element and an additional element. The metal element is selected from molybdenum (Mo), indium (In), tin (Sn), zinc (Zn), cadmium (Cd) and a combination thereof. An atomic number percentage of the additional element is equal to or greater than 0%, and is less than the least of an atomic number percentage of the metal element, an atomic number percentage of the oxygen element and an atomic number percentage of the carbon element. The matrix layer is disposed on the amorphous transparent oxycarbide layer. A manufacturing method of a transparent electronic device is also provided.

Abstract: A display device, including a flexible substrate, multiple lighting units, and multiple signal lines, is provided. The lighting units and the signal lines are located on the flexible substrate, and the signal lines are respectively electrically connected to the lighting units. Each signal line includes multiple first conductive patterns, at least one second conductive pattern, and at least one third conductive pattern. The first conductive patterns are located on the flexible substrate. The second conductive pattern is located on the first conductive patterns, and two ends of each second conductive pattern are respectively connected to two first conductive patterns. In a stretched state, the two first conductive patterns twist the commonly connected second conductive pattern. The third conductive pattern is superimposed on the second conductive pattern.

Abstract: A display apparatus, including a display panel and a flexible circuit board, is provided. The display panel has a first side and a second side adjacent to each other. The flexible circuit board includes a first part and a second part connected to each other. The first part is electrically bonded to the first side of the display panel. The second part is electrically bonded to the second side of the display panel. The first part of the flexible circuit board is bent along a first bending axis. The second part of the flexible circuit board is bent along a second bending axis. The flexible circuit board is provided with an opening, and an intersection of the first bending axis and the second bending axis overlaps with the opening. A method of fabricating the display apparatus is also provided.

Abstract: A device array substrate is provided and includes a flexible base, a pixel island, and a connection line. The pixel island is disposed on the flexible base, and at least one edge of the pixel island is provided with at least one opening. The connection line enters the pixel island via the opening. A display device is also provided and includes the device array substrate.

Abstract: A transparent electronic device includes an organic film, an amorphous transparent oxycarbide layer, and a matrix layer. The organic film includes a polymer containing carboxyl groups (—COOH). The amorphous transparent oxycarbide layer is disposed on the organic film and consists of a metal element, carbon element, oxygen element and an additional element. The metal element is selected from molybdenum (Mo), indium (In), tin (Sn), zinc (Zn), cadmium (Cd) and a combination thereof. An atomic number percentage of the additional element is equal to or greater than 0%, and is less than the least of an atomic number percentage of the metal element, an atomic number percentage of the oxygen element and an atomic number percentage of the carbon element. The matrix layer is disposed on the amorphous transparent oxycarbide layer. A manufacturing method of a transparent electronic device is also provided.

Abstract: A stretchable pixel array substrate includes a base, pixel structures, and a wiring. The base has first regions and a second region. The pixel structures are respectively disposed on the first regions of the base. The wiring is disposed on the second region of the base. Curved segments of the wiring include a first curved segment and a second curved segment. One of the pixel structures is disposed on one of the first regions. The first curved segment is disposed between the one of the pixel structures and the second curved segment. A distance A exists between a first curved portion and a second curved portion of the first curved segment in a first direction, a distance B exists between a first curved portion and a second curved portion of the second curved segment in the first direction, and A>B.

Abstract: A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.

Abstract: A transparent electronic device includes an organic film, an amorphous transparent oxycarbide layer, and a matrix layer. The organic film includes a polymer containing carboxyl groups (—COOH). The amorphous transparent oxycarbide layer is disposed on the organic film and consists of a metal element, carbon element, oxygen element and an additional element. The metal element is selected from molybdenum (Mo), indium (In), tin (Sn), zinc (Zn), cadmium (Cd) and a combination thereof. An atomic number percentage of the additional element is equal to or greater than 0%, and is less than the least of an atomic number percentage of the metal element, an atomic number percentage of the oxygen element and an atomic number percentage of the carbon element. The matrix layer is disposed on the amorphous transparent oxycarbide layer. A manufacturing method of a transparent electronic device is also provided.

Abstract: A display device includes a display medium layer, an active component array layer, a support layer, and a first adhesive layer. The display medium layer has a light-emitting surface. The active component array layer is disposed on a side of the display medium layer away from the light-emitting surface. The support layer is disposed on a side of the active component array layer away from the display medium layer. The first adhesive layer is connected between the active component array layer and the support layer, in which the active component array layer is directly connected to the first adhesive layer. The first adhesive layer has a Young's modulus greater than 10 GPa.

Abstract: A stress sensing assembly includes: a stretchable substrate and at least one stress sensing line. The stress sensing line is disposed over the stretchable substrate and includes: rigid segments and flexible conductive segments. The rigid segments are separated from each other. Each of the flexible conductive segments is disposed between two adjacent rigid segments of the rigid segments and directly contacts the sidewalls of the two adjacent rigid segments of the rigid segments, and the Young's modulus of one of the flexible conductive segments is smaller than the Young's modulus of one of the rigid segments. A display device including stress sensing assembly is also disclosed herein.

Abstract: A flexible device array substrate includes: a substrate, a metal-containing layer, and an electronic component layer. The metal-containing layer is disposed on the substrate. The metal-containing layer includes: a first layer and a second layer. The first layer is located on a side close to the substrate, and the first layer contains a first metal oxide to form a peeling interface in the first layer. The second layer is located on a side away from the substrate, and the second layer contains a second metal oxide. The oxidation number of the metal in the second metal oxide is smaller than the oxidation number of the metal in the first metal oxide. The electronic component layer is disposed above the metal-containing layer. A method of manufacturing the flexible device array substrate is also provided.

Abstract: A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.

Abstract: A display device, including a flexible substrate, multiple lighting units, and multiple signal lines, is provided. The lighting units and the signal lines are located on the flexible substrate, and the signal lines are respectively electrically connected to the lighting units. Each signal line includes multiple first conductive patterns, at least one second conductive pattern, and at least one third conductive pattern. The first conductive patterns are located on the flexible substrate. The second conductive pattern is located on the first conductive patterns, and two ends of each second conductive pattern are respectively connected to two first conductive patterns. In a stretched state, the two first conductive patterns twist the commonly connected second conductive pattern. The third conductive pattern is superimposed on the second conductive pattern.

Abstract: A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.

Abstract: A display device includes: a substrate, a plurality of pixel islands, and a plurality of traces. The substrate is stretchable. The plurality of pixel islands are disposed over the substrate. The plurality of traces respectively connect two adjacent pixel islands of the plurality of pixel islands, and each of the traces extends in a first main direction and then extends in a second main direction through a turning angle.

Abstract: A stress sensing assembly includes: a stretchable substrate and at least one stress sensing line. The stress sensing line is disposed over the stretchable substrate and includes: rigid segments and flexible conductive segments. The rigid segments are separated from each other. Each of the flexible conductive segments is disposed between two adjacent rigid segments of the rigid segments and directly contacts the sidewalls of the two adjacent rigid segments of the rigid segments, and the Young's modulus of one of the flexible conductive segments is smaller than the Young's modulus of one of the rigid segments. A display device including stress sensing assembly is also disclosed herein.

Abstract: A display device includes a display medium layer, an active component array layer, a support layer, and a first adhesive layer. The display medium layer has a light-emitting surface. The active component array layer is disposed on a side of the display medium layer away from the light-emitting surface. The support layer is disposed on a side of the active component array layer away from the display medium layer. The first adhesive layer is connected between the active component array layer and the support layer, in which the active component array layer is directly connected to the first adhesive layer. The first adhesive layer has a Young's modulus greater than 10 GPa.

Abstract: A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.

Abstract: A display panel including a first array substrate, a first pad, and a second pad is provided. The first array substrate includes a first substrate, a first active element, a first display element, and a second display element. The first active element is disposed on the top surface of the first substrate. The first display element and the second display element are disposed on the top surface of the first substrate. The first display element is electrically connected to the first active element. The first pad and the second pad are disposed on the bottom surface of the first substrate. The first active element is electrically connected to the first pad. Each of the first pad and the second pad includes an embedded part and a protruded part. The embedded part is located in the first substrate. The protruded part is protruded from the bottom surface of the first substrate.

Abstract: A display apparatus includes a substrate, a first circuit layer, a first adhesive layer, a second circuit layer, a first conductive element and a display element layer. The first circuit layer is disposed on the substrate. The first adhesive layer is disposed on the first circuit layer. The second circuit layer is disposed on the first adhesive layer. The first conductive element is disposed on the second circuit layer and is electrically connected to the second circuit layer. The first adhesive layer has a first via, and the first conductive element is electrically connected to the first circuit layer through the first via of the first adhesive layer. The display element layer is disposed on the second circuit layer and is electrically connected to the second circuit layer.