Patents by Inventor Tsung-Yu Hung
Tsung-Yu Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240182141Abstract: A multihull module is provided. The multihull module includes multiple power floats, an actuation interface controller, and a vehicle controller. The power floats are disposed on a vehicle. The actuation interface controller is coupled to the power floats, and is configured to control the power floats. The vehicle controller is coupled to the actuation interface controller, and is configured to provide a control signal to the actuation interface controller. The actuation interface controller controls the power floats according to the control signal.Type: ApplicationFiled: December 6, 2022Publication date: June 6, 2024Applicant: Metal Industries Research & Development CentreInventors: Kuang-Shine Yang, Chao Chieh Hsu, Ping-Hua Su, Tsung-Yi Lan, Chia-Yu Hung
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Patent number: 11918435Abstract: A method for producing an adaptive element for dental implantation includes: creating a 3D virtual model including a crown part and a root part; obtaining a boundary curve between the crown part and the root part; defining a boundary plane on the root part perpendicular to a vertical axis of the 3D virtual model and spaced apart from the boundary curve; projecting the boundary curve on the boundary plane in a direction parallel to the vertical axis; generating a tubular model having a predetermined thickness based on the boundary curve, a virtual surface connected from the boundary curve to the cutting plane, and the cutting plane; and producing the adaptive element according to the tubular model.Type: GrantFiled: May 17, 2021Date of Patent: March 5, 2024Inventors: Hsin-Yu Kuo, Tsung-Fu Hung, Po-Jan Kuo
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Patent number: 11742248Abstract: A method includes etching a hybrid substrate to form a recess in the hybrid substrate, in which the hybrid substrate includes a first semiconductor layer, a dielectric layer over the first semiconductor layer, and a second semiconductor layer over the first semiconductor layer, in which after the etching, a top surface of the first semiconductor layer is exposed to the recess; forming a spacer on a sidewall of the recess, in which the spacer is slanted at a first angle relative to a top surface of the first semiconductor layer; reshaping the spacer such that the a first sidewall of the reshaped spacer is slanted at a second angle relative to the top surface of the first semiconductor layer, in which the second angle is greater than the first angle; and performing a first epitaxy process to grow an epitaxy semiconductor layer in the recess after reshaping the spacer.Type: GrantFiled: November 13, 2020Date of Patent: August 29, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Pei-Wei Lee, Tsung-Yu Hung, Pang-Yen Tsai, Yasutoshi Okuno
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Patent number: 11715738Abstract: A semiconductor device includes a substrate, a first semiconductor fin and a gate stack. The first semiconductor fin is over the substrate and includes a first germanium-containing layer and a second germanium-containing layer over the first germanium-containing layer. The first germanium-containing layer has a germanium atomic percentage higher than a germanium atomic percentage of the second germanium-containing layer. The gate stack is across the first semiconductor fin.Type: GrantFiled: July 27, 2022Date of Patent: August 1, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tsung-Yu Hung, Pei-Wei Lee, Pang-Yen Tsai
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Patent number: 11600577Abstract: A semiconductor device includes a substrate and a semiconductor layer. The substrate includes a planar portion and a plurality of pillars on a periphery of the planar portion. The pillars are shaped as rectangular columns, and corners of two of the pillars at the same side of the planar portion are aligned in a horizontal direction or a direction perpendicular to the horizontal direction. The semiconductor layer is disposed over the planar portion and between the pillars.Type: GrantFiled: October 13, 2020Date of Patent: March 7, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Pei-Wei Lee, Pang-Yen Tsai, Tsung-Yu Hung
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Publication number: 20220367525Abstract: A semiconductor device includes a substrate, a first semiconductor fin and a gate stack. The first semiconductor fin is over the substrate and includes a first germanium-containing layer and a second germanium-containing layer over the first germanium-containing layer. The first germanium-containing layer has a germanium atomic percentage higher than a germanium atomic percentage of the second germanium-containing layer. The gate stack is across the first semiconductor fin.Type: ApplicationFiled: July 27, 2022Publication date: November 17, 2022Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tsung-Yu HUNG, Pei-Wei LEE, Pang-Yen TSAI
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Patent number: 11417684Abstract: A semiconductor device includes a substrate, a first semiconductor fin and a gate stack. The first semiconductor fin is over the substrate and includes a first germanium-containing layer and a second germanium-containing layer over the first germanium-containing layer. The first germanium-containing layer has a germanium atomic percentage higher than a germanium atomic percentage of the second germanium-containing layer. The gate stack is across the first semiconductor fin.Type: GrantFiled: December 11, 2020Date of Patent: August 16, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tsung-Yu Hung, Pei-Wei Lee, Pang-Yen Tsai
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Publication number: 20210159756Abstract: A motor comprises a housing having a space, a stator including a spool casing arrayed in the space, a rotor containing an axle and a magnet located inside the spool casing, the axle penetrating the magnet and having two ends protruding out of the housing, wherein the axle has two ends respectively allocated with an end-shield bearing integrating with the spool casing and an bottom-plate bearing detachably mounting on the bottom side of the housing in order to improve the concentricity of the motor.Type: ApplicationFiled: April 23, 2020Publication date: May 27, 2021Inventors: CHIA-WEI LIN, TSUNG-YU HUNG
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Publication number: 20210098499Abstract: A semiconductor device includes a substrate, a first semiconductor fin and a gate stack. The first semiconductor fin is over the substrate and includes a first germanium-containing layer and a second germanium-containing layer over the first germanium-containing layer. The first germanium-containing layer has a germanium atomic percentage higher than a germanium atomic percentage of the second germanium-containing layer. The gate stack is across the first semiconductor fin.Type: ApplicationFiled: December 11, 2020Publication date: April 1, 2021Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tsung-Yu HUNG, Pei-Wei LEE, Pang-Yen TSAI
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Publication number: 20210082773Abstract: A method includes etching a hybrid substrate to form a recess in the hybrid substrate, in which the hybrid substrate includes a first semiconductor layer, a dielectric layer over the first semiconductor layer, and a second semiconductor layer over the first semiconductor layer, in which after the etching, a top surface of the first semiconductor layer is exposed to the recess; forming a spacer on a sidewall of the recess, in which the spacer is slanted at a first angle relative to a top surface of the first semiconductor layer; reshaping the spacer such that the a first sidewall of the reshaped spacer is slanted at a second angle relative to the top surface of the first semiconductor layer, in which the second angle is greater than the first angle; and performing a first epitaxy process to grow an epitaxy semiconductor layer in the recess after reshaping the spacer.Type: ApplicationFiled: November 13, 2020Publication date: March 18, 2021Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Pei-Wei Lee, Tsung-Yu Hung, Pang-Yen Tsai, Yasutoshi Okuno
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Publication number: 20210043454Abstract: A semiconductor device includes a substrate and a semiconductor layer. The substrate includes a planar portion and a plurality of pillars on a periphery of the planar portion. The pillars are shaped as rectangular columns, and corners of two of the pillars at the same side of the planar portion are aligned in a horizontal direction or a direction perpendicular to the horizontal direction. The semiconductor layer is disposed over the planar portion and between the pillars.Type: ApplicationFiled: October 13, 2020Publication date: February 11, 2021Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Pei-Wei Lee, Pang-Yen Tsai, Tsung-Yu Hung
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Patent number: 10872906Abstract: A semiconductor device includes a substrate, a first semiconductor fin and a gate stack. The first semiconductor fin is over the substrate and includes a first germanium-containing layer and a second germanium-containing layer over the first germanium-containing layer. The first germanium-containing layer has a germanium atomic percentage higher than a germanium atomic percentage of the second germanium-containing layer. The gate stack is across the first semiconductor fin.Type: GrantFiled: March 13, 2019Date of Patent: December 22, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tsung-Yu Hung, Pei-Wei Lee, Pang-Yen Tsai
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Patent number: 10840152Abstract: A method includes etching a hybrid substrate to form a recess in the hybrid substrate, in which the hybrid substrate includes a first semiconductor layer, a dielectric layer over the first semiconductor layer, and a second semiconductor layer over the first semiconductor layer, in which after the etching, a top surface of the first semiconductor layer is exposed to the recess; forming a spacer on a sidewall of the recess, in which the spacer is slanted at a first angle relative to a top surface of the first semiconductor layer; reshaping the spacer such that the a first sidewall of the reshaped spacer is slanted at a second angle relative to the top surface of the first semiconductor layer, in which the second angle is greater than the first angle; and performing a first epitaxy process to grow an epitaxy semiconductor layer in the recess after reshaping the spacer.Type: GrantFiled: January 23, 2019Date of Patent: November 17, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Pei-Wei Lee, Tsung-Yu Hung, Pang-Yen Tsai, Yasutoshi Okuno
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Patent number: 10811255Abstract: Methods of forming semiconductor devices are provided. One of the methods includes following steps. A plurality of hard mask patterns is formed around a region of a substrate, wherein an imaginary connecting line is formed between corners of two of the plurality of hard mask patterns at the same side of the region, and the imaginary connecting line is substantially parallel to or perpendicular to a horizontal direction. A semiconductor layer is formed on the substrate by a selective epitaxial growth process.Type: GrantFiled: February 26, 2019Date of Patent: October 20, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Pei-Wei Lee, Pang-Yen Tsai, Tsung-Yu Hung
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Publication number: 20200135768Abstract: A semiconductor device includes a substrate, a first semiconductor fin and a gate stack. The first semiconductor fin is over the substrate and includes a first germanium-containing layer and a second germanium-containing layer over the first germanium-containing layer. The first germanium-containing layer has a germanium atomic percentage higher than a germanium atomic percentage of the second germanium-containing layer. The gate stack is across the first semiconductor fin.Type: ApplicationFiled: March 13, 2019Publication date: April 30, 2020Inventors: Tsung-Yu HUNG, Pei-Wei LEE, Pang-Yen TSAI
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Publication number: 20200135463Abstract: Methods of forming semiconductor devices are provided. One of the methods includes following steps. A plurality of hard mask patterns is formed around a region of a substrate, wherein an imaginary connecting line is formed between corners of two of the plurality of hard mask patterns at the same side of the region, and the imaginary connecting line is substantially parallel to or perpendicular to a horizontal direction. A semiconductor layer is formed on the substrate by a selective epitaxial growth process.Type: ApplicationFiled: February 26, 2019Publication date: April 30, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Pei-Wei Lee, Pang-Yen Tsai, Tsung-Yu Hung
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Publication number: 20200105615Abstract: A method includes etching a hybrid substrate to form a recess in the hybrid substrate, in which the hybrid substrate includes a first semiconductor layer, a dielectric layer over the first semiconductor layer, and a second semiconductor layer over the first semiconductor layer, in which after the etching, a top surface of the first semiconductor layer is exposed to the recess; forming a spacer on a sidewall of the recess, in which the spacer is slanted at a first angle relative to a top surface of the first semiconductor layer; reshaping the spacer such that the a first sidewall of the reshaped spacer is slanted at a second angle relative to the top surface of the first semiconductor layer, in which the second angle is greater than the first angle; and performing a first epitaxy process to grow an epitaxy semiconductor layer in the recess after reshaping the spacer.Type: ApplicationFiled: January 23, 2019Publication date: April 2, 2020Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Pei-Wei LEE, Tsung-Yu HUNG, Pang-Yen TSAI, Yasutoshi OKUNO
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Publication number: 20150357505Abstract: The present invention is an optical proximity sensor and manufacturing method thereof. The optical proximity sensor has an optical sensing unit, an illuminating unit, multiple transparent gels and a package. The package encapsulates the optical sensing unit and the illuminating unit. The transparent gels are respectively formed on top surfaces of the optical sensing unit and the illuminating unit. The transparent gels respectively have a convex part and a recess formed in the convex part. The package has through holes communicating with the recesses of the transparent gels to form openings. In a step of injecting encapsulant gel, because the transparent gels are still plastic, the protrusions can closely attach to the transparent gels. The encapsulant gel is prevented from forming above the sensing part and the illuminating part.Type: ApplicationFiled: August 18, 2015Publication date: December 10, 2015Inventors: Yi-Hua Chang, Sue-Ping Lin, Chun-Chi Chen, Tsung-Yu Hung
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Patent number: 9140600Abstract: The present invention is an optical proximity sensor and manufacturing method thereof. The optical proximity sensor has an optical sensing unit, an illuminating unit, multiple transparent gels and a package. The package encapsulates the optical sensing unit and the illuminating unit. The transparent gels are respectively formed on top surfaces of the optical sensing unit and the illuminating unit. The transparent gels respectively have a convex part and a recess formed in the convex part. The package has through holes communicating with the recesses of the transparent gels to form openings. In a step of injecting encapsulant gel, because the transparent gels are still plastic, the protrusions can closely attach to the transparent gels. The encapsulant gel is prevented from forming above the sensing part and the illuminating part.Type: GrantFiled: February 18, 2013Date of Patent: September 22, 2015Assignees: TAIWAN IC PACKAGING CORPORATION, uPI semiconductor corp.Inventors: Yi-Hua Chang, Sue-Ping Lin, Chun-Chi Chen, Tsung-Yu Hung
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Publication number: 20130292553Abstract: The present invention is an optical proximity sensor and manufacturing method thereof. The optical proximity sensor has an optical sensing unit, an illuminating unit, multiple transparent gels and a package. The package encapsulates the optical sensing unit and the illuminating unit. The transparent gels are respectively formed on top surfaces of the optical sensing unit and the illuminating unit. The transparent gels respectively have a convex part and a recess formed in the convex part. The package has through holes communicating with the recesses of the transparent gels to form openings. In a step of injecting encapsulant gel, because the transparent gels are still plastic, the protrusions can closely attach to the transparent gels. The encapsulant gel is prevented from forming above the sensing part and the illuminating part.Type: ApplicationFiled: February 18, 2013Publication date: November 7, 2013Inventors: Yi-Hua Chang, Sue-Ping Lin, Chun-Chi Chen, Tsung-Yu Hung