Patents by Inventor Tsutomu Asai
Tsutomu Asai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11993073Abstract: A printing apparatus that includes a holding unit configured to hold a roll sheet performs supplying the sheet by rotating the roll sheet held by the holding unit; nipping and conveying the supplied sheet; performing printing on the conveyed sheet; detecting occurrence of a print medium jam of the sheet; and, if the printing apparatus has detected a print medium jam of the sheet, performing a control process of supplying the sheet in a state in which the conveying is stopped.Type: GrantFiled: January 31, 2023Date of Patent: May 28, 2024Assignee: Canon Kabushiki KaishaInventors: Yoshiaki Suzuki, Hiromasa Yoneyama, Ryohei Maruyama, Itaru Wada, Tomohito Abe, Tsutomu Obata, Noriyuki Aoki, Yasuyuki Asai
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Patent number: 10728467Abstract: An audio/video output device includes a first output component for video and audio output, a second output component for audio output, a video memory and a controller that determines whether an external device connected to the second output component supports video input, and outputs predetermined video signal stored in the video memory from the second output component to display a message screen on the external device connected to the second output component in response to determining that the external device connected to the second output component supports the video input.Type: GrantFiled: August 30, 2019Date of Patent: July 28, 2020Assignee: FUNAI ELECTRIC CO., LTD.Inventor: Tsutomu Asai
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Publication number: 20190387183Abstract: An audio/video output device includes a first output component for video and audio output, a second output component for audio output, a video memory and a controller that determines whether an external device connected to the second output component supports video input, and outputs predetermined video signal stored in the video memory from the second output component to display a message screen on the external device connected to the second output component in response to determining that the external device connected to the second output component supports the video input.Type: ApplicationFiled: August 30, 2019Publication date: December 19, 2019Inventor: Tsutomu ASAI
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Patent number: 10440289Abstract: An audio/video output device includes a first output component for video and audio output, a second output component for audio output, a video memory and a controller. The video memory stores video signal. The controller allocates at least part of an area of the video memory to the second output component in response to determining that an external device connected to the second output component supports video input.Type: GrantFiled: May 23, 2018Date of Patent: October 8, 2019Assignee: FUNAI ELECTRIC CO., LTD.Inventor: Tsutomu Asai
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Publication number: 20180376077Abstract: An audio/video output device includes a first output component for video and audio output, a second output component for audio output, a video memory and a controller. The video memory stores video signal. The controller allocates at least part of an area of the video memory to the second output component in response to determining that an external device connected to the second output component supports video input.Type: ApplicationFiled: May 23, 2018Publication date: December 27, 2018Inventor: Tsutomu ASAI
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Patent number: 8411549Abstract: A circuit for preventing destruction of a semiconductor laser element of an optical disc device comprises a light-emission-directing circuit part for outputting a light-emission-directing signal for directing the semiconductor laser element to emit light; a voltage-monitoring circuit part for monitoring a light-emitting voltage and, when a judgment is made that the light-emitting voltage is normal, outputting a light-emission-permitting signal for permitting the semiconductor laser element to emit light, the light-emitting voltage being supplied from a power source for the semiconductor laser element to an optical-output-controlling circuit part in order to cause the semiconductor laser element to emit light; and a light-emission-permitting circuit part for using the optical-output-controlling circuit part to cause the semiconductor laser element to emit light only when the light-emission-directing signal and the light-emission-permitting signal are inputted.Type: GrantFiled: April 18, 2012Date of Patent: April 2, 2013Assignee: Funai Electric Co., Ltd.Inventor: Tsutomu Asai
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Publication number: 20120300605Abstract: A circuit for preventing destruction of a semiconductor laser element of an optical disc device comprises a light-emission-directing circuit part for outputting a light-emission-directing signal for directing the semiconductor laser element to emit light; a voltage-monitoring circuit part for monitoring a light-emitting voltage and, when a judgment is made that the light-emitting voltage is normal, outputting a light-emission-permitting signal for permitting the semiconductor laser element to emit light, the light-emitting voltage being supplied from a power source for the semiconductor laser element to an optical-output-controlling circuit part in order to cause the semiconductor laser element to emit light; and a light-emission-permitting circuit part for using the optical-output-controlling circuit part to cause the semiconductor laser element to emit light only when the light-emission-directing signal and the light-emission-permitting signal are inputted.Type: ApplicationFiled: April 18, 2012Publication date: November 29, 2012Inventor: Tsutomu ASAI
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Patent number: 6831129Abstract: An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: a. a high polymer having cross-linkable 5 to 30 parts by weight functional groups in the molecule, and a cross-linking agent therefor b. an epoxy resin that is liquid at 5 to 30 parts by weight room temperature c.Type: GrantFiled: May 24, 2002Date of Patent: December 14, 2004Assignee: Mitsui Mining & Smelting Co. Ltd.Inventors: Tetsuro Sato, Tsutomu Asai, Toshifumi Matsushima
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Patent number: 6716530Abstract: The present invention provides a resin applied-copper foil, which is free of halogen elements, having high flame retardancy, excellent water resistance, heat resistance, and good peeling strength between a base material and copper foil. To provide the a resin compound used for fabricating an interlayer dielectric of a printed wiring board, the resin compound comprises an epoxy-based resin which includes: an epoxy resin curing agent having 5 to 25% by weight of nitrogen; and maleimide compounds having thermosetting properties, and the resin compound further has composition which is free of halogen elements.Type: GrantFiled: November 30, 2001Date of Patent: April 6, 2004Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Tetsuro Sato, Tsutomu Asai
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Patent number: 6652962Abstract: The invention provides a resin-coated composite foil characterized in that an organic insulating layer is disposed on an ultra-thin copper foil is disposed on a supporting metal layer through an intermediate organic release layer. The resin-coated composite foil is free from the peeling or blistering between the supporting metal foil and the ultra-thin copper foil during the production of a copper clad laminate.Type: GrantFiled: May 27, 1999Date of Patent: November 25, 2003Assignee: Mitsui Mining & Smelting Co. Ltd.Inventors: Tetsuro Sato, Tsutomu Asai, Kenichiro Iwakiri
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Publication number: 20030087101Abstract: An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: 1 a. a high polymer having cross-linkable 5 to 30 parts by weight functional groups in the molecule, and a cross-linking agent therefor b. an epoxy resin that is liquid at 5 to 30 parts by weight room temperature c.Type: ApplicationFiled: May 24, 2002Publication date: May 8, 2003Inventors: Tetsuro Sato, Tsutomu Asai, Toshifumi Matsushima
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Publication number: 20020106516Abstract: The present invention provides a resin applied-copper foil, which is free of halogen elements, having high flame retardancy, excellent water resistance, heat resistance, and good peeling strength between a base material and copper foil. To provide the a resin compound used for fabricating an interlayer dielectric of a printed wiring board, the resin compound comprises an epoxy-based resin which includes: an epoxy resin curing agent having 5 to 25% by weight of nitrogen; and maleimide compounds having thermosetting properties, and the resin compound furthrt has composition which is free of halogen elements.Type: ApplicationFiled: November 30, 2001Publication date: August 8, 2002Applicant: Mitsui Mining & Smelting Co., Ltd.Inventors: Tetsuro Sato, Tsutomu Asai
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Patent number: 6240636Abstract: In a process producing a multi-layer printed wiring board, an inner core having at least one wiring pattern on its surface and an outer layer of copper foil are laminated with an organic insulating layer interposed therebetween, a via hole is formed using a laser beam, and the outer copper foil and the inner wiring patterns are electrically connected to each other by depositing copper. The process is characterized in that the outer layer of copper foil has a thickness of no more than one-fifth of the thickness of the inner wiring pattern, but will not exceed 7 &mgr;m, preferably 4 &mgr;m. The hole is formed in both the copper foil and the insulating layer simultaneously by irradiating with a laser beam on the outer layer of copper foil.Type: GrantFiled: March 30, 1999Date of Patent: June 5, 2001Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Tsutomu Asai, Fujio Kuwako, Shinichi Obata
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Patent number: 6194056Abstract: A high tensile strength copper foil having a matte side roughness Rz of 2.5 &mgr;m or less and a tensile strength of 40,000 Kgf/mm2 after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominently (111) orientation.Type: GrantFiled: July 9, 1999Date of Patent: February 27, 2001Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Hisao Sakai, Toshiko Yokota, Tsutomu Asai, Susumu Takahashi, Mitsuo Suzuki, Makoto Dobashi, Yasuji Hara
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Patent number: 6187416Abstract: There are provided a resin composition for copper-clad laminates which comprises the following ingredients: (a) an epoxy resin mixture comprising an epoxy resin and a hardener therefor, (b) a maleimide compound, and (c) at least one solvent-soluble aromatic polymer having at least one functional group polymerizable with the epoxy resin or the maleimide compound, and also provided a resin-coated copper foil, a multilayered copper-clad laminate and a multilayered printed circuit board each using the resin composition.Type: GrantFiled: November 5, 1998Date of Patent: February 13, 2001Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Tetsurou Satoh, Tsutomu Asai
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Patent number: 5958209Abstract: A high tensile strength copper foil having a matte side roughness Rz of 2.5 .mu.m or less and a tensile strength of 40,000 Kgf/mm.sup.2 after heating one hour at 180.degree. C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominantly (111) orientation.Type: GrantFiled: May 13, 1997Date of Patent: September 28, 1999Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Hisao Sakai, Toshiko Yokota, Tsutomu Asai, Susumu Takahashi, Mitsuo Suzuki, Makoto Dobashi, Yasuji Hara
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Patent number: 5309041Abstract: A step motor comprising two sets of annularly arranged electromagnets and which are disposed in left and right frame bodies respectively in bilateral symmetry, a wobble disc of magnetic body arranged between the sets of electromagnets, a supporting shaft which is pivotally coupled to the center of the light surface of the wobble disc and fixedly coupled to a bearing portion at the center of the right frame body, an output shaft which is fixedly coupled to the center of the left surface of the wobble disc by way of a universal joint and rotatably supported by a bearing portion at the center of the left frame body, a crown gear fixedly arranged on the magnetically permeable armatures of the right set of electromagnets and a crown gear fixedly arranged on the right surface of the wobble disc at the outer circumferential portion thereof which confronts the crown gear on the right set of electromagnets and has teeth different in number from those of the crown gear.Type: GrantFiled: May 4, 1993Date of Patent: May 3, 1994Assignees: Nihon Riken Kabushiki Kaisha, Teruo Kawai, Keiichiro Asaoka, Tsutomu AsaiInventors: Teruo Kawai, Tsutomu Asai