Patents by Inventor Tsutomu Asai

Tsutomu Asai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11993073
    Abstract: A printing apparatus that includes a holding unit configured to hold a roll sheet performs supplying the sheet by rotating the roll sheet held by the holding unit; nipping and conveying the supplied sheet; performing printing on the conveyed sheet; detecting occurrence of a print medium jam of the sheet; and, if the printing apparatus has detected a print medium jam of the sheet, performing a control process of supplying the sheet in a state in which the conveying is stopped.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: May 28, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yoshiaki Suzuki, Hiromasa Yoneyama, Ryohei Maruyama, Itaru Wada, Tomohito Abe, Tsutomu Obata, Noriyuki Aoki, Yasuyuki Asai
  • Patent number: 10728467
    Abstract: An audio/video output device includes a first output component for video and audio output, a second output component for audio output, a video memory and a controller that determines whether an external device connected to the second output component supports video input, and outputs predetermined video signal stored in the video memory from the second output component to display a message screen on the external device connected to the second output component in response to determining that the external device connected to the second output component supports the video input.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: July 28, 2020
    Assignee: FUNAI ELECTRIC CO., LTD.
    Inventor: Tsutomu Asai
  • Publication number: 20190387183
    Abstract: An audio/video output device includes a first output component for video and audio output, a second output component for audio output, a video memory and a controller that determines whether an external device connected to the second output component supports video input, and outputs predetermined video signal stored in the video memory from the second output component to display a message screen on the external device connected to the second output component in response to determining that the external device connected to the second output component supports the video input.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Inventor: Tsutomu ASAI
  • Patent number: 10440289
    Abstract: An audio/video output device includes a first output component for video and audio output, a second output component for audio output, a video memory and a controller. The video memory stores video signal. The controller allocates at least part of an area of the video memory to the second output component in response to determining that an external device connected to the second output component supports video input.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: October 8, 2019
    Assignee: FUNAI ELECTRIC CO., LTD.
    Inventor: Tsutomu Asai
  • Publication number: 20180376077
    Abstract: An audio/video output device includes a first output component for video and audio output, a second output component for audio output, a video memory and a controller. The video memory stores video signal. The controller allocates at least part of an area of the video memory to the second output component in response to determining that an external device connected to the second output component supports video input.
    Type: Application
    Filed: May 23, 2018
    Publication date: December 27, 2018
    Inventor: Tsutomu ASAI
  • Patent number: 8411549
    Abstract: A circuit for preventing destruction of a semiconductor laser element of an optical disc device comprises a light-emission-directing circuit part for outputting a light-emission-directing signal for directing the semiconductor laser element to emit light; a voltage-monitoring circuit part for monitoring a light-emitting voltage and, when a judgment is made that the light-emitting voltage is normal, outputting a light-emission-permitting signal for permitting the semiconductor laser element to emit light, the light-emitting voltage being supplied from a power source for the semiconductor laser element to an optical-output-controlling circuit part in order to cause the semiconductor laser element to emit light; and a light-emission-permitting circuit part for using the optical-output-controlling circuit part to cause the semiconductor laser element to emit light only when the light-emission-directing signal and the light-emission-permitting signal are inputted.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: April 2, 2013
    Assignee: Funai Electric Co., Ltd.
    Inventor: Tsutomu Asai
  • Publication number: 20120300605
    Abstract: A circuit for preventing destruction of a semiconductor laser element of an optical disc device comprises a light-emission-directing circuit part for outputting a light-emission-directing signal for directing the semiconductor laser element to emit light; a voltage-monitoring circuit part for monitoring a light-emitting voltage and, when a judgment is made that the light-emitting voltage is normal, outputting a light-emission-permitting signal for permitting the semiconductor laser element to emit light, the light-emitting voltage being supplied from a power source for the semiconductor laser element to an optical-output-controlling circuit part in order to cause the semiconductor laser element to emit light; and a light-emission-permitting circuit part for using the optical-output-controlling circuit part to cause the semiconductor laser element to emit light only when the light-emission-directing signal and the light-emission-permitting signal are inputted.
    Type: Application
    Filed: April 18, 2012
    Publication date: November 29, 2012
    Inventor: Tsutomu ASAI
  • Patent number: 6831129
    Abstract: An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: a. a high polymer having cross-linkable  5 to 30 parts by weight functional groups in the molecule, and a cross-linking agent therefor b. an epoxy resin that is liquid at  5 to 30 parts by weight room temperature c.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: December 14, 2004
    Assignee: Mitsui Mining & Smelting Co. Ltd.
    Inventors: Tetsuro Sato, Tsutomu Asai, Toshifumi Matsushima
  • Patent number: 6716530
    Abstract: The present invention provides a resin applied-copper foil, which is free of halogen elements, having high flame retardancy, excellent water resistance, heat resistance, and good peeling strength between a base material and copper foil. To provide the a resin compound used for fabricating an interlayer dielectric of a printed wiring board, the resin compound comprises an epoxy-based resin which includes: an epoxy resin curing agent having 5 to 25% by weight of nitrogen; and maleimide compounds having thermosetting properties, and the resin compound further has composition which is free of halogen elements.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: April 6, 2004
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tetsuro Sato, Tsutomu Asai
  • Patent number: 6652962
    Abstract: The invention provides a resin-coated composite foil characterized in that an organic insulating layer is disposed on an ultra-thin copper foil is disposed on a supporting metal layer through an intermediate organic release layer. The resin-coated composite foil is free from the peeling or blistering between the supporting metal foil and the ultra-thin copper foil during the production of a copper clad laminate.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: November 25, 2003
    Assignee: Mitsui Mining & Smelting Co. Ltd.
    Inventors: Tetsuro Sato, Tsutomu Asai, Kenichiro Iwakiri
  • Publication number: 20030087101
    Abstract: An object of the present invention is to provide a resin-coated copper foil for manufacturing printed wiring boards that excel in total balance of properties of flame retardation, resin flow, water resistance, and peeling strength. The resin-coated copper foil comprises a resin layer on one side of a copper foil, and is characterized in that the resin layer comprises a resin composition having the following composition: 1 a. a high polymer having cross-linkable  5 to 30 parts by weight functional groups in the molecule, and a cross-linking agent therefor b. an epoxy resin that is liquid at  5 to 30 parts by weight room temperature c.
    Type: Application
    Filed: May 24, 2002
    Publication date: May 8, 2003
    Inventors: Tetsuro Sato, Tsutomu Asai, Toshifumi Matsushima
  • Publication number: 20020106516
    Abstract: The present invention provides a resin applied-copper foil, which is free of halogen elements, having high flame retardancy, excellent water resistance, heat resistance, and good peeling strength between a base material and copper foil. To provide the a resin compound used for fabricating an interlayer dielectric of a printed wiring board, the resin compound comprises an epoxy-based resin which includes: an epoxy resin curing agent having 5 to 25% by weight of nitrogen; and maleimide compounds having thermosetting properties, and the resin compound furthrt has composition which is free of halogen elements.
    Type: Application
    Filed: November 30, 2001
    Publication date: August 8, 2002
    Applicant: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tetsuro Sato, Tsutomu Asai
  • Patent number: 6240636
    Abstract: In a process producing a multi-layer printed wiring board, an inner core having at least one wiring pattern on its surface and an outer layer of copper foil are laminated with an organic insulating layer interposed therebetween, a via hole is formed using a laser beam, and the outer copper foil and the inner wiring patterns are electrically connected to each other by depositing copper. The process is characterized in that the outer layer of copper foil has a thickness of no more than one-fifth of the thickness of the inner wiring pattern, but will not exceed 7 &mgr;m, preferably 4 &mgr;m. The hole is formed in both the copper foil and the insulating layer simultaneously by irradiating with a laser beam on the outer layer of copper foil.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: June 5, 2001
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tsutomu Asai, Fujio Kuwako, Shinichi Obata
  • Patent number: 6194056
    Abstract: A high tensile strength copper foil having a matte side roughness Rz of 2.5 &mgr;m or less and a tensile strength of 40,000 Kgf/mm2 after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominently (111) orientation.
    Type: Grant
    Filed: July 9, 1999
    Date of Patent: February 27, 2001
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Hisao Sakai, Toshiko Yokota, Tsutomu Asai, Susumu Takahashi, Mitsuo Suzuki, Makoto Dobashi, Yasuji Hara
  • Patent number: 6187416
    Abstract: There are provided a resin composition for copper-clad laminates which comprises the following ingredients: (a) an epoxy resin mixture comprising an epoxy resin and a hardener therefor, (b) a maleimide compound, and (c) at least one solvent-soluble aromatic polymer having at least one functional group polymerizable with the epoxy resin or the maleimide compound, and also provided a resin-coated copper foil, a multilayered copper-clad laminate and a multilayered printed circuit board each using the resin composition.
    Type: Grant
    Filed: November 5, 1998
    Date of Patent: February 13, 2001
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tetsurou Satoh, Tsutomu Asai
  • Patent number: 5958209
    Abstract: A high tensile strength copper foil having a matte side roughness Rz of 2.5 .mu.m or less and a tensile strength of 40,000 Kgf/mm.sup.2 after heating one hour at 180.degree. C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominantly (111) orientation.
    Type: Grant
    Filed: May 13, 1997
    Date of Patent: September 28, 1999
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Hisao Sakai, Toshiko Yokota, Tsutomu Asai, Susumu Takahashi, Mitsuo Suzuki, Makoto Dobashi, Yasuji Hara
  • Patent number: 5309041
    Abstract: A step motor comprising two sets of annularly arranged electromagnets and which are disposed in left and right frame bodies respectively in bilateral symmetry, a wobble disc of magnetic body arranged between the sets of electromagnets, a supporting shaft which is pivotally coupled to the center of the light surface of the wobble disc and fixedly coupled to a bearing portion at the center of the right frame body, an output shaft which is fixedly coupled to the center of the left surface of the wobble disc by way of a universal joint and rotatably supported by a bearing portion at the center of the left frame body, a crown gear fixedly arranged on the magnetically permeable armatures of the right set of electromagnets and a crown gear fixedly arranged on the right surface of the wobble disc at the outer circumferential portion thereof which confronts the crown gear on the right set of electromagnets and has teeth different in number from those of the crown gear.
    Type: Grant
    Filed: May 4, 1993
    Date of Patent: May 3, 1994
    Assignees: Nihon Riken Kabushiki Kaisha, Teruo Kawai, Keiichiro Asaoka, Tsutomu Asai
    Inventors: Teruo Kawai, Tsutomu Asai