Abstract: An electronic component mounting method is disclosed. The method includes the following steps: applying a paste remaining on a stamping pin to the bottom wall of at least one reservoir; forming the paste retained in the at least one reservoir to a predetermined film thickness by a clearance regulation section; causing the paste formed into a film to adhere to the stamping pin; stamping the paste to a substrate; and mounting the electronic components held by a mounting head to the substrate on which the paste has been stamped.

Abstract: A chip mounting system in which a whole system can be compact including a transfer stage and a tool holding member between a chip feeding section and a substrate holding section. In the chip mounting system, a transfer stage is disposed between a chip feeding stage and a substrate holding stage. A pick-up head and a mounting head are provided movably in a Y-axis direction in which the chip feeding stage and the substrate holding stage are aligned. A movable table which is movable in an X-axis direction, which intersects the Y-axis direction at right angles, is provided in a overwrapping movable region of the chip feeding stage and the substrate holding stage. The transfer stage and a tool holding member, which holds at least one of replacement tools for a pick-up tool and a mounting tool, are provided on the movable table.

Abstract: A tools holding member 63 which holds replacement tools 23a, 34a, 44a for a pick-up head 22, a mounting head 33 and a stamping head 44 which are provided so as to move freely in a Y-axis direction in which a components supply stage 3 and a substrate holding stage 4 are aligned is provided on an overlapping area R of a moving area R1 over which the pick-up head 22 can move, a moving area R2 over which the mounting head 33 can move and a moving area R3 over which the stamping head 43 can move which lies on a moving table 15 which is provided in an area R0 lying between the components supply stage 3 and the substrate holding stage 4 so as to move freely in an X-axis direction which is at right angles to a Y-axis.

Abstract: A paste supply unit that is located in a side opposed to an electronic parts supply table 6 with a mounting table 8 sandwiched between them to supply a paste to a board 24 includes a transfer head 5 that transfers the paste to the board 24 and an dispense head 4 that draws an image by discharging the paste to the board 24, and either the transfer head 5 or the dispense head 4 is selected to supply the paste depending on the kind of an electronic parts.

Abstract: A tools holding member 63 which holds replacement tools 23a, 34a, 44a for a pick-up head 22, a mounting head 33 and a stamping head 44 which are provided so as to move freely in a Y-axis direction in which a components supply stage 3 and a substrate holding stage 4 are aligned is provided on an overlapping area R of a moving area R1 over which the pick-up head 22 can move, a moving area R2 over which the mounting head 33 can move and a moving area R3 over which the stamping head 43 can move which lies on a moving table 15 which is provided in an area R0 lying between the components supply stage 3 and the substrate holding stage 4 so as to move freely in an X-axis direction which is at right angles to a Y-axis.

Abstract: Two concentrically-arranged annular reservoirs 32, 33 are placed at a position spaced away from a substrate 9 along a direction of movement of a stamping head 4, and the stamping head 4 is arranged so as to be able to linearly move between the reservoirs 32, 33 and the substrate 9. Paste is retained in the inner reservoir 32, and the outer reservoir 33 serves as a test-stamping field. The stamping head 4 performs paste stamping operation while moving between a position P1 set on the reservoir 32 and the substrate 9. A position P2 where test-stamping is performed is set on the reservoir 33 along a traffic line of the stamping head 4.

Abstract: To provide a chip mounting system in which a whole system can be made compact in size irrespective of the fact that a transfer stage and a tool holding member are installed between a chip feeding section and a substrate holding section. In a chip mounting system 1 in which a transfer stage 16 is disposed between a chip feeding stage 3 and a substrate holding stage 4 and a pick-up head 22 and a mounting head 33 are provided movably in a Y-axis direction in which the chip feeding stage 3 and the substrate holding stage 4 are aligned, a movable table 15 which is movable in an X-axis direction which intersects the Y-axis direction at right angles is provided in a region R0 defined between the chip feeding stage 3 and the substrate holding stage 4, and the transfer stage 16 and a tool holding member 63 which holds at least one of replacement tools 23a, 34a for a pick-up tool 23 and a mounting tool 34 are provided on the movable table 15.

Abstract: A paste supply unit that is located in a side opposed to an electronic parts supply table 6 with a mounting table 8 sandwiched between them to supply a paste to a board 24 includes a transfer head 5 that transfers the paste to the board 24 and an dispense head 4 that draws an image by discharging the paste to the board 24, and either the transfer head 5 or the dispense head 4 is selected to supply the paste depending on the kind of an electronic parts.

Abstract: A paste storage portion 10 is made up of a first storage portion 24 and a second storage portion 25 which are arranged concentrically, and a first transfer position 31 where a transfer head 11 transfers a paste adhesive stored in the first storage portion, a second transfer position 32 where the transfer head 11 transfers a paste adhesive stored in the second storage portion 25 and a substrate transfer position 33 where the transfer head 11 transfers the paste adhesives on to a substrate 8 are made to be situated on the same straight line in a first direction.