Abstract: A drive device is provided to include: a case; a first motor and a second motor having an output shaft extending along a first axial line in the case and a second axial line parallel to the first axial line in the case, respectively; a first output shaft including a first shaft body and roller followers, the roller followers being engaged at a predetermined reduction gear ratio with the rib of the first motor; a second output shaft including a second shaft body and roller followers, the roller followers being engaged at a predetermined reduction gear ratio with the rib of the second motor; a first sealing member located between the case and the outer peripheral surface of the first shaft body; and a second sealing member located between an inner peripheral surface of the first shaft body and an outer peripheral surface of the second shaft body.

Abstract: In the substrate holder, while holding a periphery portion of a semiconductor wafer, some of protruding portions having a grass shape on a pad main body hide beneath the semiconductor wafer, and the others of the protruding portions are exposed outside the semiconductor wafer. Also, the protruding portions hiding beneath the semiconductor wafer contact a rear surface of the semiconductor wafer, and sink the semiconductor wafer to a suitable depth via gravity, thereby holding the semiconductor wafer mainly in a length direction. In addition, some of protruding portions exposed near the periphery portion of the semiconductor wafer contact a side surface of the semiconductor wafer, thereby holding the semiconductor wafer mainly in a width direction.

Abstract: A bypass route is provided in order to transfer a substrate without passing through the atmospheric pressure transfer chamber, that is, a loader module, from a load lock chamber to a storage. In the bypass route, a sub-transfer unit for transferring the processed substrate from the load lock chamber to the storage is provided. The sub-transfer unit transfers the processed substrate from the load lock chamber to the storage, and a main transfer unit of the loader module returns the processed substrate from the storage to a transport container on holding stage.

Abstract: A gate valve apparatus is disclosed. The gate valve apparatus is provided with a valve casing that includes a first valve seat and a second valve seat, and in which an opening portion is formed; and a closure element that includes a sealing member that contacts the first valve seat to seal the opening portion. In addition, the gate valve apparatus is provided with a shutoff member that contacts the second valve seat to thereby be deformed, so that a space between the opening portion and a sealing member is shut off by the shutoff member when the closure element closes the opening portion. The shutoff member is deformed and continues to contact the second valve seat under normal and high temperature environments when the closure element closes the opening portion.

Abstract: A transfer device 17 in a semiconductor processing system includes first and second actuation mechanisms 9A, 9B having first and second support sections movable on first and second vertical planes, respectively, the latter being parallel with each other. First and second movable blocks 18A, 18B are supported on the first and second support sections so that they may be horizontally moved by the first and second actuation mechanisms. Disposed on the first and second movable blocks are first and second handling mechanism 19A, 19B capable of extension and contraction for handling a processing subject substrate W. A control section 20 controls the operation of the first and second actuation mechanisms so that the first and second movable blocks may not interfere with each other.

Abstract: A transfer device can control a posture of a holding table accurately and prevent the holding table from wobbling even when the holding table is moved at a high speed. A first posture holding link 56 and a second posture holding link 57 are provided at the transfer device. One end of the first posture holding link 56 and one end of the second posture holding link 57 are rotatably connected to a connecting shaft 53. Rails 51 and 52 are fastened to a base plate 27 of the holding table 21. Rollers 54 and 55 are connected to the connecting shaft 53 to be rotated about an axis line. The rollers 54 and 55 are in contact with roller driving portions 51a and 52a. When the holding table 21 is moved, the rollers 54 and 55 are rotated on the roller driving portions 51a and 52a.

Abstract: A substrate processing system is provided with: a first transfer unit, which extends from a loader module to a first processing chamber for processing substrates, to transfer the substrates; and a second transfer unit, which is provided below or above the first transfer unit and extends from the loader module to a second processing chamber for processing substrates, to transfer the substrates. The first processing chamber and the second processing chamber do not overlap in the vertical direction, and are disposed at positions separated from each other in a plan view. At the same time, at least a part of the first transfer unit and at least a part of the second transfer unit overlap each other in the vertical direction.

Abstract: Transfer capability is improved without having to extend a longitudinal space of a platform of a cluster tool downward. In a platform PF, a first transfer robot 16L includes a transfer main body 48L that is slidable on a left guide rail 46L, a transfer pedestal 50L that is slidable in an offset direction (X direction), and a slider type transfer arm 52L that is rotatable within a horizontal surface while being movable straight in a direction parallel to a radius of a rotation circle and supports one piece of a semiconductor wafer W. A second transfer robot 16R has the same configuration and operations as the first transfer robot 16L except that an operation or moving direction of each component of the second transfer robot 16R is vertically symmetrical to that of the first transfer robot 16L.

Abstract: In the substrate holder, while holding a periphery portion of a semiconductor wafer, some of protruding portions having a grass shape on a pad main body hide beneath the semiconductor wafer, and the others of the protruding portions are exposed outside the semiconductor wafer. Also, the protruding portions hiding beneath the semiconductor wafer contact a rear surface of the semiconductor wafer, and sink the semiconductor wafer to a suitable depth via gravity, thereby holding the semiconductor wafer mainly in a length direction. In addition, some of protruding portions exposed near the periphery portion of the semiconductor wafer contact a side surface of the semiconductor wafer, thereby holding the semiconductor wafer mainly in a width direction.

Abstract: A transfer device 17 in a semiconductor processing system includes first and second actuation mechanisms 9A, 9B having first and second support sections movable on first and second vertical planes, respectively, the latter being parallel with each other. First and second movable blocks 18A, 18B are supported on the first and second support sections so that they may be horizontally moved by the first and second actuation mechanisms. Disposed on the first and second movable blocks are first and second handling mechanism 19A, 19B capable of extension and contraction for handling a processing subject substrate W. A control section 20 controls the operation of the first and second actuation mechanisms so that the first and second movable blocks may not interfere with each other.

Abstract: There is provided a transfer module capable of enhancing strength of a transfer chamber. An openable/closable cover is provided at the transfer chamber configured to be evacuable to vacuum. A robot is provided in the transfer chamber. The robot has hollow rotation shafts at a part of a device for transferring a processing target object W. A pillar for supporting the cover in a closed state is positioned within the hollow rotation shafts of the robot. Since the pillar supports a load applied to the cover by an atmospheric pressure, a thickness of the cover can be reduced, so that manufacturing cost can be reduced. Further, the robot is not interfered by the pillar when the robot rotates the processing target object W about the rotation shafts or moves the processing target object W in a radial direction.

Abstract: Agate valve apparatus is disclosed. The gate valve apparatus is provided with a valve casing that includes a first valve seat and a second valve seat, and in which an opening portion is formed; and a closure element that includes a sealing member that contacts the first valve seat to seal the opening portion. In addition, the gate valve apparatus is provided with a shutoff member that contacts the second valve seat to thereby be deformed, so that a space between the opening portion and a sealing member is shut off by the shutoff member when the closure element closes the opening portion. The shutoff member is deformed and continues to contact the second valve seat under normal and high temperature environments when the closure element closes the opening portion.

Abstract: To correct any positional misalignment of a substrate manifesting along the horizontal direction by utilizing a substrate transfer device alone without engaging a transfer arm in operation. A substrate transfer device comprises a plurality of support pins disposed at positions set apart from one another around a support shaft of a stage, which support a substrate, e.g., a wafer W, on the bottom surface thereof, a base at which the support pins are mounted, a vertical drive means (Z-direction drive means) for raising/lowering the substrate by driving the support pins up/down via the base and a horizontal drive means (X-direction drive means, Y-direction drive means) for adjusting the position of the substrate along the horizontal direction (X and Y directions) by horizontally driving the support pins via the base.

Abstract: Transfer capability is improved without having to extend a longitudinal space of a platform of a cluster tool downward. In a platform PF, a first transfer robot 16L includes a transfer main body 48L that is slidable on a left guide rail 46L, a transfer pedestal 50L that is slidable in an offset direction (X direction), and a slider type transfer arm 52L that is rotatable within a horizontal surface while being movable straight in a direction parallel to a radius of a rotation circle and supports one piece of a semiconductor wafer W. A second transfer robot 16R has the same configuration and operations as the first transfer robot 16L except that an operation or moving direction of each component of the second transfer robot 16R is vertically symmetrical to that of the first transfer robot 16L.

Abstract: A bypass route is provided in order to transfer a substrate without passing through the normal pressure transfer chamber, that is, a loader module, from a load lock chamber to a storage. In the bypass route, a sub-transfer unit for transferring the processed substrate from the load lock chamber to the storage is provided. The sub-transfer unit transfers the processed substrate from the load lock chamber to the storage, and a main transfer unit of the loader module returns the processed substrate from the storage to a transport container on holding stage.

Abstract: A supporting mechanism (12A) is used for transfer-ring a target substrate (W) in cooperation with a transfer arm (32), in a semiconductor processing system. The supporting mechanism includes first and second holding portions (38A to 38C, 40A to 40C) each configured to be moved up and down and transfer a substrate to and from the transfer arm. The first and second holding portions are configured to be moved relative to each other in a vertical direction without spatially interfering with each other, and support substrates at substantially the same horizontal coordinate position. The supporting mechanism further includes first and second drives (46, 48) configured to move the first and second holding portions up and down, and a controller (68) configured to control the first and second drives. The controller is arranged to control the first and second drives to alternatively support a substrate by the first and second holding portions.

Abstract: A transfer apparatus (20) for a target substrate (W) includes a rotatable rotary base (24). First and second arm mechanisms (26, 28) are attached to the rotary base and configured to bend and stretch. Each of the first and second arm mechanisms has a proximal end arm (26A, 28A), an intermediate arm (26B, 28B), and a pick (26C, 28C) which are pivotally coupled to each other sequentially from the rotary base. The picks are disposed to support the target substrate. A link mechanism (30) is coupled to the proximal end arms of the first and second arm mechanisms to drive the first and second arm mechanisms. A first driving source (32) is disposed to rotatably drive the rotary base. A second driving source (34) is disposed to drive the link mechanism so as to bend or stretch the first and second arm mechanisms.

Abstract: A disclosed vacuum processing apparatus comprises a preliminary vacuum chamber whose inner pressure is switchable between a normal pressure and a reduced pressure, wherein a substrate is transferred to or from the preliminary vacuum chamber; plural vacuum processing chambers, wherein corresponding processes are carried out with respect to the substrate; a vacuum transfer chamber to which the preliminary vacuum chamber and the plural vacuum processing chambers are connected, the vacuum transfer chamber including a substrate transfer mechanism that transfers the substrate between the preliminary vacuum chamber and the plural vacuum processing chambers, and a concave portion formed in a bottom portion or a ceiling portion of the vacuum transfer chamber; an auxiliary module, wherein a predetermined process is carried out with respect to the substrate transfer mechanism; and an elevation mechanism that moves the auxiliary module between a first position where the auxiliary module is accommodated in the concave por

Abstract: Processing chambers (3A-3F) for applying a process to a substrate W housed therein are provided at a periphery of a conveying chamber 2. A conveying case (4) houses the substrate (W) in a state isolated from an outside atmosphere. The conveyance case (4) has a gate valve (30) and a transfer mechanism (22). A conveying mechanism (5) supports the conveyance case 4, and carries the conveyance case (4) to a position for conveying in/conveying out a substrate. The number of processing chambers connectable to a conveying chamber is not limited, and conveyance to the processing chamber can be executed while maintaining a predetermined ambience for an atmosphere of a substrate that is to be processed.