Patents by Inventor Tsutomu Ieki

Tsutomu Ieki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10033217
    Abstract: A wireless power receiver device includes a sheet-like electrode sheet section and a power receiver section. The electrode sheet section includes a power receiver side active electrode and a power receiver side passive electrode that are substantially coplanar and formed into sheet-like shapes; lead lines that are coplanar with both the electrodes, extended from the respective electrodes, and formed into sheet-like shapes; and an insulation sheet that covers both the electrodes and both the lead lines from both sides thereof. The power receiver section includes a step-down unit that steps down an alternating-current voltage induced between end portions of the lead lines; a power receiver module that rectifies and smoothes the alternating-current voltage that is stepped down by the step-down unit; and a connector for outputting an output voltage of the power receiver module.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: July 24, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Shinji Goma, Kazuya Kato, Tsutomu Ieki
  • Patent number: 9948202
    Abstract: A circuit module equipped with a primary coil of a step-down transformer formed by primary coils of a plurality of transformer elements connected in series with each other and a secondary coil formed by secondary coils of the transformer elements connected in series with each other, includes a printed substrate on which the transformer elements are mounted in a lengthwise direction, a connection terminal coupled to a first end of the primary coil of the step-down transformer and connection terminals coupled to the secondary coil of the step-down transformer, the connection terminals are positioned such that the transformer elements are interposed therebetween. As a result, provided are a transformer module that reduces the effect of a high-voltage portion on a low-voltage portion by securing a distance between the high-voltage portion and the low-voltage portion, and a power reception device and a power transmission device equipped with the transformer module.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: April 17, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hironobu Takahashi, Tsutomu Ieki, Fumikiyo Kawahara
  • Patent number: 9806764
    Abstract: An active electrode and a passive electrode provided in a power transmitting apparatus 10 are connected to an inductor provided on the secondary side of a transformer generating an AC voltage and are respectively coupled to an active electrode and a passive electrode of a power receiving apparatus through electric fields. A ground electrode of the power transmitting apparatus faces the active electrode and the passive electrode and a ground electrode of the power receiving apparatus faces the active electrode and the passive electrode. A plurality of openings are formed in such a manner as to form a lattice in each of the ground electrodes.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: October 31, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hironobu Takahashi, Tsutomu Ieki
  • Patent number: 9461507
    Abstract: A power transmitting apparatus includes an active electrode, a passive electrode, a voltage generating circuit that applies a voltage between the active electrode and the passive electrode, and a reference potential electrode connected to a reference potential. A power receiving apparatus includes an active electrode, a passive electrode, a secondary battery connected between the active electrode and the passive electrode, and a reference potential electrode connected to a reference potential. Power is transmitted from the power transmitting apparatus to the power receiving apparatus as a result of the respective electrodes facing each other and being capacitively coupled to each other when the power receiving apparatus is mounted to the power transmitting apparatus.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: October 4, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hironobu Takahashi, Keiichi Ichikawa, Tsutomu Ieki
  • Patent number: 9460320
    Abstract: In a transceiver, on a top surface of a rectangular plate-shaped substrate, transmission radiating elements and receiving radiating elements are provided. The transmission radiating elements extend in the horizontal or lateral direction from the center of the substrate. The receiving radiating elements extend in the vertical or longitudinal direction from the center of the substrate. Inductors included in a matching feeding element are individually electromagnetically coupled to transmission-side feeding points that are inner end portions of the transmission radiating elements and receiving-side feeding points that are inner end portions of the receiving radiating elements. A transmission signal is transmitted with a wave polarized in the horizontal or lateral direction, and a signal having a vertical or longitudinal polarization direction is received.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: October 4, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tsutomu Ieki, Ken Sakai, Noboru Kato, Koji Shiroki
  • Patent number: 9378452
    Abstract: A radio IC device includes a flexible dielectric base, a radiation element that is a metal film or a metal foil wrapped around the dielectric base, and a radio IC element mounted on the radiation element. The radiation element includes, in a portion other than a portion where the radio IC element is disposed, a bonded portion that is bonded to the dielectric element and a non-bonded portion that is not bonded to the dielectric element. The radio IC element is arranged to be directly opposed to the dielectric element with the portion of the radiation element where the radio IC element is disposed not bonded to the dielectric base.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: June 28, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuya Dokai, Tsutomu Ieki
  • Publication number: 20150372540
    Abstract: A power transmission device includes a power-transmission-side active electrode and a power-transmission-side passive electrode. A power reception device includes a power-reception-side active electrode and a power-reception-side passive electrode. The power transmission device and the power reception device can be shifted along an X axis up to a maximum shift distance from a standard arrangement where electrode centers of the power-transmission-side active electrode and the power-reception-side active electrode oppose and are superposed with each other while maintaining the opposition surface area between the power-transmission-side active electrode and the power-reception-side active electrode.
    Type: Application
    Filed: June 24, 2015
    Publication date: December 24, 2015
    Inventors: HIRONOBU TAKAHASHI, Tsutomu Ieki
  • Publication number: 20150222130
    Abstract: A wireless power receiver device includes a sheet-like electrode sheet section and a power receiver section. The electrode sheet section includes a power receiver side active electrode and a power receiver side passive electrode that are substantially coplanar and formed into sheet-like shapes; lead lines that are coplanar with both the electrodes, extended from the respective electrodes, and formed into sheet-like shapes; and an insulation sheet that covers both the electrodes and both the lead lines from both sides thereof. The power receiver section includes a step-down unit that steps down an alternating-current voltage induced between end portions of the lead lines; a power receiver module that rectifies and smoothes the alternating-current voltage that is stepped down by the step-down unit; and a connector for outputting an output voltage of the power receiver module.
    Type: Application
    Filed: February 26, 2015
    Publication date: August 6, 2015
    Inventors: Shinji GOMA, Kazuya KATO, Tsutomu IEKI
  • Patent number: 8933859
    Abstract: An antenna device includes an antenna element and an impedance conversion circuit connected to the antenna element. The impedance conversion circuit is inserted between the antenna element and a feeding circuit, and includes a first series circuit where a first coil conductor and a second coil conductor are connected in series, and a second series circuit where a third coil conductor and a fourth coil conductor are connected in series. The first and second coil conductors define a closed magnetic circuit through which a closed loop of a first magnetic flux passes, and the third and fourth coil conductors define a closed magnetic circuit through which a closed loop of a second magnetic flux passes. Consequently, the antenna device performs impedance matching with the feeding circuit in a wide frequency band.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: January 13, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Tsutomu Ieki
  • Publication number: 20140354084
    Abstract: An active electrode and a passive electrode provided in a power transmitting apparatus 10 are connected to an inductor provided on the secondary side of a transformer generating an AC voltage and are respectively coupled to an active electrode and a passive electrode of a power receiving apparatus through electric fields. A ground electrode of the power transmitting apparatus faces the active electrode and the passive electrode and a ground electrode of the power receiving apparatus faces the active electrode and the passive electrode. A plurality of openings are formed in such a manner as to form a lattice in each of the ground electrodes.
    Type: Application
    Filed: August 20, 2014
    Publication date: December 4, 2014
    Inventors: Hironobu Takahashi, Tsutomu Ieki
  • Publication number: 20140306552
    Abstract: A power transmission system is provided which is able to perform stable data communication with high communication sensitivity even when data communication and power transmission are performed at the same time. At least a third coupling electrode pair of first to third coupling electrode pairs is a reference electrode pair connected to a reference potential, one end of a first communication portion is connected to a reference potential of a power transmitting apparatus, and one end of a second communication portion is connected to a reference potential of a power receiving apparatus. Another end of the first communication portion is connected to either one of a power transmitting apparatus-side first or second coupling electrode, and another end of the second communication portion is connected to either one of a power receiving apparatus-side first or second coupling electrode.
    Type: Application
    Filed: June 26, 2014
    Publication date: October 16, 2014
    Inventors: Shinji Goma, Tsutomu Ieki
  • Publication number: 20140175907
    Abstract: A power transmitting apparatus includes an active electrode, a passive electrode, a voltage generating circuit that applies a voltage between the active electrode and the passive electrode, and a reference potential electrode connected to a reference potential. A power receiving apparatus includes an active electrode, a passive electrode, a secondary battery connected between the active electrode and the passive electrode, and a reference potential electrode connected to a reference potential. Power is transmitted from the power transmitting apparatus to the power receiving apparatus as a result of the respective electrodes facing each other and being capacitively coupled to each other when the power receiving apparatus is mounted to the power transmitting apparatus.
    Type: Application
    Filed: February 25, 2014
    Publication date: June 26, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Hironobu Takahashi, Keiichi Ichikawa, Tsutomu Ieki
  • Publication number: 20140078014
    Abstract: An antenna device includes an antenna element and an impedance conversion circuit connected to the antenna element. The impedance conversion circuit is inserted between the antenna element and a feeding circuit, and includes a first series circuit where a first coil conductor and a second coil conductor are connected in series, and a second series circuit where a third coil conductor and a fourth coil conductor are connected in series. The first and second coil conductors define a closed magnetic circuit through which a closed loop of a first magnetic flux passes, and the third and fourth coil conductors define a closed magnetic circuit through which a closed loop of a second magnetic flux passes. Consequently, the antenna device performs impedance matching with the feeding circuit in a wide frequency band.
    Type: Application
    Filed: November 21, 2013
    Publication date: March 20, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru KATO, Tsutomu IEKI
  • Publication number: 20140061319
    Abstract: A radio IC device includes a flexible dielectric base, a radiation element that is a metal film or a metal foil wrapped around the dielectric base, and a radio IC element mounted on the radiation element. The radiation element includes, in a portion other than a portion where the radio IC element is disposed, a bonded portion that is bonded to the dielectric element and a non-bonded portion that is not bonded to the dielectric element. The radio IC element is arranged to be directly opposed to the dielectric element with the portion of the radiation element where the radio IC element is disposed not bonded to the dielectric base.
    Type: Application
    Filed: November 13, 2013
    Publication date: March 6, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuya DOKAI, Tsutomu IEKI
  • Publication number: 20120190310
    Abstract: In a transceiver, on a top surface of a rectangular plate-shaped substrate, transmission radiating elements and receiving radiating elements are provided. The transmission radiating elements extend in the horizontal or lateral direction from the center of the substrate. The receiving radiating elements extend in the vertical or longitudinal direction from the center of the substrate. Inductors included in a matching feeding element are individually electromagnetically coupled to transmission-side feeding points that are inner end portions of the transmission radiating elements and receiving-side feeding points that are inner end portions of the receiving radiating elements. A transmission signal is transmitted with a wave polarized in the horizontal or lateral direction, and a signal having a vertical or longitudinal polarization direction is received.
    Type: Application
    Filed: April 3, 2012
    Publication date: July 26, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Tsutomu IEKI, Ken SAKAI, Noboru KATO, Koji SHIROKI
  • Patent number: 8072769
    Abstract: A component-embedded module includes a module substrate having wiring electrodes on the upper surface thereof, first circuit components mounted on the wiring electrodes, a sub-module disposed on an area on which no wiring electrodes are provided, and an insulating resin layer provided on substantially the entire upper surface of the module substrate such that the insulating resin layer covers at least a portion of the first circuit components and sub-module. The second circuit components including an integrated circuit element are mounted on the sub-module or embedded therein. Via conductors are provided through the module substrate from the lower surface thereof and are directly coupled to terminal electrodes on the lower surface of the sub-module. By using a substrate having a wiring greater accuracy than that of the module substrate, a reliable component-embedded module is obtained.
    Type: Grant
    Filed: October 15, 2009
    Date of Patent: December 6, 2011
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Tsutomu Ieki, Kazuyuki Yuda
  • Patent number: 7885081
    Abstract: A component incorporating module includes an insulation resin layer, a plurality of lands arranged to mount components and wiring patterns connected to the plurality of lands, which are arranged along a first main surface of the resin layer, and circuit components connected to the lands to mount components. The circuit components are embedded in the resin layer. The plurality of lands have thicknesses that are greater than those of the wiring patterns adjacent to the corresponding lands.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: February 8, 2011
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Makoto Kawagishi, Tsutomu Ieki, Tadashi Kani, Satoru Noda
  • Publication number: 20100027225
    Abstract: A component-embedded module includes a module substrate having wiring electrodes on the upper surface thereof, first circuit components mounted on the wiring electrodes, a sub-module disposed on an area on which no wiring electrodes are provided, and an insulating resin layer provided on substantially the entire upper surface of the module substrate such that the insulating resin layer covers at least a portion of the first circuit components and sub-module. The second circuit components including an integrated circuit element are mounted on the sub-module or embedded therein. Via conductors are provided through the module substrate from the lower surface thereof and are directly coupled to terminal electrodes on the lower surface of the sub-module. By using a substrate having a wiring greater accuracy than that of the module substrate, a reliable component-embedded module is obtained.
    Type: Application
    Filed: October 15, 2009
    Publication date: February 4, 2010
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kazuyuki YUDA, Tsutomu IEKI
  • Patent number: 7488903
    Abstract: A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: February 10, 2009
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Makoto Kawagishi, Tsutomu Ieki
  • Publication number: 20080210462
    Abstract: A module substrate defined by an aggregate substrate is prepared, and circuit components are mounted on the module substrate. An insulating resin layer is formed on substantially the entire top surface of the module substrate such that the circuit components are disposed in the insulating resin layer, and a top-surface-shielding layer is formed on the top surface of the insulating resin layer. First through holes are formed in the module substrate and the insulating resin layer at locations corresponding to portions of boundary lines of small substrates so as to extend in a thickness direction of the module substrate and the insulating resin layer. First electrode films are formed on the inner surfaces of the first through holes so as to be connected to the first shielding layer, and the first through holes are filled with a filling material.
    Type: Application
    Filed: April 22, 2008
    Publication date: September 4, 2008
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Makoto Kawagishi, Tsutomu Ieki