Abstract: A resin protrusion forming method includes: forming on a substrate a thermal curing resin layer that is in an uncured state; forming a protrusion by pressing a forming mold against the thermal curing resin layer; forming a retaining member that retains a side face of the protrusion; and heating the substrate on which the protrusion and the retaining member have been formed.

Abstract: According to an aspect of an embodiment, a method for producing a magnetic head includes forming a plating base layer on a substrate; forming a magnetic layer including an enlarged portion and a narrowed portion extending therefrom on the plating base layer by plating; forming a resist pattern on the magnetic layer and the plating base layer, the resist pattern corresponding to the shape of the magnetic layer and entirely covering the magnetic layer with a margin such that the margin around the narrowed portion is larger than that around the enlarged portion; and patterning the plating base layer by etching with the resist pattern used as a mask. The method further includes forming an insulating layer over the magnetic layer and the plating base layer; and forming an auxiliary magnetic layer on the insulating layer so that the auxiliary magnetic layer is magnetically connected to the magnetic layer.

Abstract: A method for manufacturing a magnetic head device that includes a soft magnetic layer includes the steps of forming a plating base layer in the soft magnetic layer through sputtering, and applying, during the forming step, a magnetic field in a direction parallel to an orientation fringe of a wafer in which the magnetic head device is formed.