Abstract: A die packing device including die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of to die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers.

Abstract: A conveyor apparatus for conveying, for instance, dies, comprising: an X-axis moving block movable in an X-axis direction that is a lead frame conveying direction, a Y-axis moving block installed on the X-axis moving block and moved in a Y-axis direction that is perpendicular to the X-axis direction, a nozzle holder installed on the Y-axis moving block so as to be movable upward and downward, a Z-axis guide rail installed on the X-axis moving block and has an inclined part that rises from a die pick-up position side toward a die bonding position side, a Z-axis moving plate moved upward and downward along the Z-axis guide rail and is connected to the nozzle holder, and a suction chucking nozzle that holds the dies by vacuum suction and is installed so as to be moved upward and downward on the nozzle holder and together with the nozzle holder.

Abstract: A die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of the die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers.

Abstract: A die pickup method and apparatus that uses a tape peeling stage which supports a portion of an adhesive tape that corresponds to a die to be picked up, and a suction holding stage in which suction holding holes that, with vacuum suction, holds areas of the adhesive tape that surround the die to be picked up, thus separating the die from the adhesive tape by forming an air layer between the die and the adhesive tape, and then picking up the die. The air layer is formed, with the die being held via vacuum suction by a suction nozzle provided above the suction holding stage, by raising the tape peeling stage and then by moving the tape peeling stage horizontally in a direction away from the die.

Abstract: A method and apparatus for processing semiconductor pellets that are bonded on a wafer substrate that is comprised of a base plate, a heat-shrinkable adhesive agent and a radiation-curable adhesive agent. Prior to supplying the wafer substrate to a pellet pickup section, the adhesive strength of the radiation-curable adhesive agent is weakened by irradiating the wafer substrate with, for instance, ultraviolet light, then a heat treatment is performed by a heater so as to cause heat shrinkage of the heat-shrinkable adhesive agent and to reduce the bonded area between the radiation-curable adhesive agent and the semiconductor pellets. Afterward, the wafer substrate is supplied to the pellet pickup section, and the semiconductor pellets on the wafer substrate are picked up by a suction-chucking nozzle.

Abstract: A multi-chip bonding method and apparatus, in which a first wafer ring which has electronic components of a first type is held by a holding device; substrates are fed out to a conveying device from the first storing section; the electronic components of the first type on the holding device are successively bonded to the substrates; the substrates with the electronic components of the first type bonded is accommodated in the second storing section; the first wafer ring held by the holding device is exchanged for a second wafer ring which has electronic components of a second type; the substrates accommodated in the second storing section is fed out to the conveying device; the electronic components of the second type are successively bonded to the substrates; and the substrates with the electronic components of the second type bonded is accommodated in the first storing section.

Abstract: A die holding mechanism comprising a connecting wire receiving shaft which is movable up and down, a pair of die holding levers which have die holding sections for holding the die and are installed so that these levers are free to open and close, and opening-and-closing levers that open and close the die holding levers. A die formed with connecting wires on its upper surface is pushed up by a die push-up device and the wires of the die come into contact with the connecting wire receiving shaft of the die holding mechanism. When the connecting wire receiving shaft is raised by a given amount by the upward movement of the die, the die holding levers are closed so that the die holding sections of the die holding levers are positioned beneath the undersurface of the die. Afterward, the push-up needles of the die push-up device are lowered, resulting in that the die is held by the die holding levers.

Abstract: A method for manufacturing semiconductor devices comprising a step in which an adhesive layer used to bond dies cut out of a wafer to another member is formed on the front surface of the wafer that has desired integrated circuits, and a step in which a thin film conversion treatment is performed from the back surface side on the wafer in which recessed grooves used for separation of dies have been formed from the front surface side and on which the adhesive layer has been formed, until the recessed grooves are exposed.

Abstract: A conveyor apparatus for conveying, for instance, dies, comprising: an X-axis moving block movable in an X-axis direction that is a lead frame conveying direction, a Y-axis moving block installed on the X-axis moving block and moved in a Y-axis direction that is perpendicular to the X-axis direction, a nozzle holder installed on the Y-axis moving block so as to be movable upward and downward, a Z-axis guide rail installed on the X-axis moving block and has an inclined part that rises from a die pick-up position side toward a die bonding position side, a Z-axis moving plate moved upward and downward along the Z-axis guide rail and is connected to the nozzle holder, and a suction chucking nozzle that holds the dies by vacuum suction and is installed so as to be moved upward and downward on the nozzle holder and together with the nozzle holder.

Abstract: A multi-chip bonding method and apparatus, in which a first wafer ring which has electronic components of a first type is held by a holding device; substrates are fed out to a conveying device from the first storing section; the electronic components of the first type on the holding device are successively bonded to the substrates; the substrates with the electronic components of the first type bonded is accommodated in the second storing section; the first wafer ring held by the holding device is exchanged for a second wafer ring which has electronic components of a second type; the substrates accommodated in the second storing section is fed out to the conveying device; the electronic components of the second type are successively bonded to the substrates; and the substrates with the electronic components of the second type bonded is accommodated in the first storing section.

Abstract: The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.

Abstract: A manufacturing apparatus has a clean air supply means provided integrally with a part thereof for supplying clean air toward at least an area in which a workpiece exists, and an air discharge means disposed so as to face the clean air supply means across the workpiece and adapted to discharge the air to the outside of the apparatus. It is therefore possible for clean air to be constantly supplied to the workpiece area under positive pressure. Thus, there is no risk of dust generated not only inside but also outside the apparatus being moved to the vicinity of the workpiece. Accordingly, it is possible to prevent adhesion of dust to the surface of the workpiece by the apparatus alone and also possible to install the apparatus as desired.

Abstract: A method of bonding an insulated and coated wire which has an insulated coating on the outside of an electrically conductive wire is disclosed which consists in connecting one end of said insulated and coated wire to the anode side of an arc power source and connecting a discharge torch to the cathode side of said arc power source with an arc discharge performed between the tip of said insulated and coated wire and the discharge torch to form a ball at said end, and said ball being positioned with respect to the bonding pad of an electrically conductive electrode and bonding being performed with a specified pressure applied to said ball.

Abstract: A manufacturing apparatus has a clean air supply means provided integrally with a part thereof for supplying clean air toward at least an area in which a workpiece exists, and an air discharge means disposed so as to face the clean air supply means across the workpiece and adapted to discharge the air to the outside of the apparatus. It is therefore possible for clean air to be constantly supplied to the workpiece area under positive pressure. Thus, there is no risk of dust generated not only inside but also outside the apparatus being moved to the vicinity of the workpiece. Accordingly, it is possible to prevent adhesion of dust to the surface of the workpiece by the apparatus alone and also possible to install the apparatus as desired.

Abstract: The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes.Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically.

Abstract: The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes.Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically.

Abstract: An electronic device having an indicator element and a plurality of other electronic parts for electrically driving the indicator element compactly assembled one another, which includes, as fundamental structure, lead conductors for electrically connecting the indicator element and the electronic parts to one another, and resin member completely embedding the lead conductors except the electrical contact portions between each electronic part and the lead conductors and having sections for receiving the electronic parts. This invention may be applied to the module for an electronic wrist watch using the LCD indicator element to thereby enable easy and compact assembly of the indicator element and the other electronic parts into the module.

Abstract: An electronic device having an indicator element and a plurality of other electronic parts for electrically driving the indicator element compactly assembled one another, which includes, as fundamental structure, lead conductors for electrically connecting the indicator element and the electronic parts to one another, and resin member completely embedding the lead conductors except the electrical contact portions between each electronic part and the lead conductors and having sections for receiving the electronic parts. This invention may be applied to the module for an electronic wrist watch using the LCD indicator element to thereby enable easy and compact assembly of the indicator element and the other electronic parts into the module.

Abstract: A method for segmenting a plate-like material, particularly a semiconductor wafer on which a plurality of elements are formed in regular arrangement, is provided. Segmentation is performed while flowing a fluid over the entire surface of the plate-like material to wash the surface thereof.