Patents by Inventor Tsutomu Ohkawa

Tsutomu Ohkawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060253776
    Abstract: A file creating section of an editing terminal (200) of an information processing system recognizes module information associated with placement module information of template information and generates a web file in which module details information of the associated module information is embedded in a coordinate position corresponding to a placement coordinate position of the template information. Therefore, the web file can be easily created using the module information having been prepared in advance.
    Type: Application
    Filed: April 11, 2006
    Publication date: November 9, 2006
    Applicants: PIONEER CORPORATION, INCREMENT P CORPORATION
    Inventor: Tsutomu Ohkawa
  • Publication number: 20060253396
    Abstract: A public key generated in a shop terminal (300) by making a pair with a private key is transmitted to a server (200) with a created web file and stored in the server. When request information for requesting performance of commerce and commerce details information are set and input in the terminal (400) according to the web file, the shop terminal (300) recognizes that the server (200) has made an order request, and requests a download processing of the commerce details information. The server (200) encrypts the commerce details information into first encryption information with a common key, encrypts the first encryption information and the common key into second encryption information with a public key and transmits the second encryption information to the shop terminal (300).
    Type: Application
    Filed: April 11, 2006
    Publication date: November 9, 2006
    Applicants: PIONEER CORPORATION, INCREMENT P CORPORATION
    Inventor: Tsutomu Ohkawa
  • Patent number: 4128598
    Abstract: Thermosetting resin compounds produced by polymerizing together bismaleimide expressed by the general structural formula: ##STR1## where: R.sub.1 is hydrogen or alkyl group,R.sub.2 is --O--, --CH.sub.2 --, --SO.sub.2 -- or --S--S--, andR.sub.3 is hydrogen, alkyl group or chlorine;Aminophenol expressed by the general structural formula: ##STR2## where R.sub.4 is hydrogen, halogens or alkyl group; A SPECIFIED EPOXY COMPOUND; AND IMIDAZOLE WHICH IS EXPRESSED BY THE GENERAL STRUCTURAL FORMULA: ##STR3## where R.sub.7 to R.sub.10 are hydrogen or alkyl group and R.sub.7 and R.sub.8 may be benzyl or phenyl, and which may be added, if necessary.
    Type: Grant
    Filed: June 24, 1977
    Date of Patent: December 5, 1978
    Assignee: Toshiba Chemical Products Co. Ltd.
    Inventors: Kiyoji Makino, Tsutomu Ohkawa