Abstract: A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 ?m to 10 ?m. A high-frequency device is also provided.

Abstract: A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 ?m to 10 ?m. A high-frequency device is also provided.

Abstract: A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 ?m to 10 ?m. A high-frequency device is also provided.

Abstract: A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 ?m to 10 ?m. A high-frequency device is also provided.

Abstract: An apparatus for automatically analyzing a trace substance capable of automatic analysis of a trace substance in a short time with high accuracy is provided. This apparatus comprises (a) samplers for making samples each containing a desired substance at different sampling points, (b) concentrators for concentrating the substance contained in the samples to thereby produce concentrated samples, (c) a quantitative analyzer for analyzing quantitatively the substance contained in the concentrated samples, and (d) a controller for controlling the samplers, the concentrators and the analyzer to cause automatically operations of the samplers, the concentrators, and the analyzer repeatedly at specific intervals of time. Each of the concentrators receives alternatively the samples from at least two of the samplers. The analyzer receives alternatively the concentrated samples from the concentrators.

Abstract: An apparatus for automatically analyzing a trace substance capable of automatic analysis of a trace substance in a short time with high accuracy is provided. This apparatus comprises (a) samplers for making samples each containing a desired substance at different sampling points, (b) concentrators for concentrating the substance contained in the samples to thereby produce concentrated samples, (c) a quantitative analyzer for analyzing quantitatively the substance contained in the concentrated samples, and (d) a controller for controlling the samplers, the concentrators and the analyzer to cause automatically operations of the samplers, the concentrators, and the analyzer repeatedly at specific intervals of time. Each of the concentrators receives alternatively the samples from at least two ones of the samplers. The analyzer receives alternatively the concentrated samples from the concentrators.

Abstract: A district heat supply plant controller for efficiently and flexibly obtaining operation plans of a district heat supply plant includes a plant operation planning device responsive to a predicted thermal load value for a current day predicted by a thermal load prediction device to determine an operation plan of the district heat supply plant. The plant operation planning device has a genetic algorithm executing device applying genetic algorithms onto an individual having rows of genes representing ON/OFF states in each time unit by 1/0 for each of the heat source devices. In the plant operation planning device, a mathematical programming executing device 4 uses an operation plan obtained by the genetic algorithm executing device 3 as its initial value to determine the operation plan of the district heat supply plant 20.