Patents by Inventor Tsutomu Uchimi

Tsutomu Uchimi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroconductive paste composition and printed wiring board
    Patent number: 7416687
    Abstract: There is provided an electroconductive paste composition that can form a coating film having satisfactory thickness by single coating work. The electroconductive paste composition can form bumps having satisfactory height even by a smaller number of times of coating than that in the prior art technique. The electroconductive paste composition comprises a phenolic resin, a melamine resin, an electroconductive powder, a solvent, and a bump forming aid comprising a monohydric alcohol having a terminal methoxy group and having at least one ether bond. The electroconductive paste composition can be used in a printed wiring board.
    Type: Grant
    Filed: March 30, 2007
    Date of Patent: August 26, 2008
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Tsutomu Uchimi, Masayuki Nagashima, Masaru Kobayashi, Hiroyuki Shirogane
  • ELECTROCONDUCTIVE PASTE COMPOSITION AND PRINTED WIRING BOARD
    Publication number: 20070228336
    Abstract: There is provided an electroconductive paste composition that can form a coating film having satisfactory thickness by single coating work. The electroconductive paste composition can form bumps having satisfactory height even by a smaller number of times of coating than that in the prior art technique. The electroconductive paste composition comprises a phenolic resin, a melamine resin, an electroconductive powder, a solvent, and a bump forming aid comprising a monohydric alcohol having a terminal methoxy group and having at least one ether bond. The electroconductive paste composition can be used in a printed wiring board.
    Type: Application
    Filed: March 30, 2007
    Publication date: October 4, 2007
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Tsutomu UCHIMI, Masayuki Nagashima, Masaru Kobayashi, Hiroyuki Shirogane