Patents by Inventor Tsutomu Zama

Tsutomu Zama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing multilayer printed wiring board
    Patent number: 5826330
    Abstract: In a method of manufacturing a multilayer printed wiring board including an internal wiring circuit formed on a board, an insulating resin layer formed on the internal wiring circuit, a blind hole formed in the insulating resin layer and communicating with the internal wiring circuit, and a conductive portion formed on an inner wall of the blind hole and connected to the internal wiring circuit, the blind hole is formed by using a short-pulse CO.sub.2 laser.
    Type: Grant
    Filed: December 18, 1996
    Date of Patent: October 27, 1998
    Assignee: Hitachi AIC Inc.
    Inventors: Satoshi Isoda, Yasuhiro Iwasaki, Kenshirou Fukuzato, Tsutomu Zama, Koichi Noguchi, Toshiro Okamura, Hiroyoshi Yokoyama, Youiti Matuda