Abstract: A mounting-related device includes an articulated robot that is disposed in a movable space formed between a first conveyance section and a second conveyance section, holds, and moves a processing target object such that a posture of a mounting surface can be changed, and the first conveyance section and the second conveyance section include a rail attachment section that can attach and detach a pair of rail devices bridged between the first conveyance section and the second conveyance section for moving a board when conveying the board.

Abstract: A component supply device including a stage on which electronic components are scattered; a contacting section at a height so as to contact the electronic components on the stage; a slide device to relatively slide the stage and the contacting section; a dropping opening to allow the electronic components scattered on the stage caught by the contacting section to drop in accordance with the relative movement of the stage and the contacting section by the slide device; and a wall at a side opposite to a side of the dropping opening at which the electronic components scattered on the stage drop. The contacting section is provided to extend in a direction perpendicular to a sliding direction by the slide device, and at least a portion of the contacting section is inclined with respect to a straight direction along the sliding direction and an upper surface of the stage.

Abstract: Transfer material supply units for supplying a transfer material to a transfer table and spreading the transfer material is set in a component mounting machine, and transfer pins for transferring the transfer material to a mounting surface of a three-dimensional board are held by at least one mounting head of the component mounting machine to be exchangeable with a suction nozzle for picking up a circuit component. The lower end of the transfer pin is immersed in the transfer material on the transfer table to attach the transfer material to the lower end of the transfer pin by moving the mounting head holding the transfer pin to a position above the transfer table to lower and raise the transfer pin, and then the transfer material attached to the lower end of the transfer pin is transferred to the mounting surface.

Abstract: A mounting-related device includes an articulated robot that is disposed in a movable space formed between a first conveyance section and a second conveyance section, holds, and moves a processing target object such that a posture of a mounting surface can be changed, and the first conveyance section and the second conveyance section include a rail attachment section that can attach and detach a pair of rail devices bridged between the first conveyance section and the second conveyance section for moving a board when conveying the board.

Abstract: A conveyance device used in a mounting system including a mounting-related device for applying a viscous liquid to and/or arranging a member on a processing target. This conveyance device uses a pallet having a pallet-side attachment section that holds a processing target. In addition, the conveyance device includes having a robot-side attachment section arranged at a distal end section of the conveyance robot for mounting the pallet-side attachment section and the conveyance robot is configured to convey the pallet in a mounted state between a loading position and a discharge position.

Abstract: A loose component supply device including: component support member 150 configured to support multiple components in a scattered state; component collection container 180 configured to collect the components supported on the component support member via an opening in the component collection container; and a container oscillating device configured to scatter the components collected inside the component collection container onto the component support surface by swinging the component collection container such that the opening of the collection container faces the component support member. By this, because components are scattered on the component support member directly form the component collection container, the cycle time is shortened, thereby improving practicality of a component supply device.

Abstract: A loose component supply device including: component support member 150 configured to support multiple components in a scattered state; component collection container 180 configured to collect the components supported on the component support member via an opening in the component collection container; and a container oscillating device configured to scatter the components collected inside the component collection container onto the component support surface by swinging the component collection container such that the opening of the collection container faces the component support member. By this, because components are scattered on the component support member directly form the component collection container, the cycle time is shortened, thereby improving practicality of a component supply device.

Abstract: A component supply device including a stage on which electronic components are scattered; a contacting section at a height so as to contact the electronic components on the stage; a slide device to relatively slide the stage and the contacting section; a dropping opening to allow the electronic components scattered on the stage caught by the contacting section to drop in accordance with the relative movement of the stage and the contacting section by the slide device; and a wall at a side opposite to a side of the dropping opening at which the electronic components scattered on the stage drop. The contacting section is provided to extend in a direction perpendicular to a sliding direction by the slide device, and at least a portion of the contacting section is inclined with respect to a straight direction along the sliding direction and an upper surface of the stage.

Abstract: A conveyance device used in a mounting system including a mounting-related device for applying a viscous liquid to and/or arranging a member on a processing target. This conveyance device uses a pallet having a pallet-side attachment section that holds a processing target. In addition, the conveyance device includes having a robot-side attachment section arranged at a distal end section of the conveyance robot for mounting the pallet-side attachment section and the conveyance robot is configured to convey the pallet in a mounted state between a loading position and a discharge position.

Abstract: A chuck main body type and claw type deciding table and a pusher type deciding table are memorized in advance, information related to a leaded component such as component size, lead pitch, lead diameter, and component form is acquired, a combination of the chuck main body type and the claw type is searched from the chuck main body type and claw type deciding table using the acquired component size, lead pitch, lead diameter, and the like as search terms, the pusher is searched from the pusher type deciding table using the acquired component form or the like as a search term, and the search results are displayed. By this, it is possible to automatically select a tool made from a combination of multiple configuration members.

Abstract: The movement time of a board is shortened in an electronic component mounting device that performs heating and component mounting. Heating and component mounting are performed as a board is moved in the direction of arrow A; the board is moved by an in-conveyor device in the heating region, and by a shuttle device on rails in the component mounting region. When comparing chains with rails, the friction generated between the board is smaller with chains, thus the movement speed of the in-conveyor is faster. This means, compared to a case in which the board is moved by the rails and shuttle device in both the heating region and the component mounting region, the movement time of the board is shorter. Also, because there are no chains below the rails, the movable range of a flow tank is larger, and the component mountable region is larger.

Abstract: A component inserting machine includes a gripping device which grips leads of an insert component which is supplied to a component supplying section using a pair of clamp members, X and Y robots which move the gripping device, a lead imaging device which images the leads which are gripped by the clamp members, and a control section which detects lead positions from an image containing the leads which are imaged by the lead imaging device and inserts the leads which are gripped by one of the clamp members into the insertion holes by moving the gripping device using the X and Y robots based on the lead positions.

Abstract: Maintenance of a flow tank is facilitated. A sub-module is provided adjacent to a main module. A board is introduced in the sub-module, and is heated by a heater that is at a heating position, is moved to the main module, solder is applied by a flow tank in parallel with insertion of a component by a component insertion device, and thereby the component is mounted. If a maintenance condition is established, introduction of boards is stopped, the heater is moved to a standby position, and the flow tank is moved to a maintenance position of the sub-module. Maintenance is performed on the flow tank and since the component insertion device is not present above the flow tank, it is possible to facilitate inspection, removal, and the like of the flow tank.

Abstract: A chuck main body type and claw type deciding table and a pusher type deciding table are memorized in advance, information related to a leaded component such as component size, lead pitch, lead diameter, and component form is acquired, a combination of the chuck main body type and the claw type is searched from the chuck main body type and claw type deciding table using the acquired component size, lead pitch, lead diameter, and the like as search terms, the pusher is searched from the pusher type deciding table using the acquired component form or the like as a search term, and the search results are displayed. By this, it is possible to automatically select a tool made from a combination of multiple configuration members.

Abstract: A soldering apparatus, that moves a jet nozzle while ensuring that molten solder does not spill to the outside of the jet nozzle, is provided. The soldering apparatus includes a solder tank storing the molten solder, a jetting mechanism including the jet nozzle and a pump, which pumps the molten solder stored in the solder tank, an XY-direction moving mechanism that moves the solder tank, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank.

Abstract: Maintenance of a flow tank is facilitated. A sub-module is provided adjacent to a main module. A board is introduced in the sub-module, and is heated by a heater that is at a heating position, is moved to the main module, solder is applied by a flow tank in parallel with insertion of a component by a component insertion device, and thereby the component is mounted. If a maintenance condition is established, introduction of boards is stopped, the heater is moved to a standby position, and the flow tank is moved to a maintenance position of the sub-module. Maintenance is performed on the flow tank and since the component insertion device is not present above the flow tank, it is possible to facilitate inspection, removal, and the like of the flow tank.

Abstract: The movement time of a board is shortened in an electronic component mounting device that performs heating and component mounting. Heating and component mounting are performed as a board is moved in the direction of arrow A; the board is moved by an in-conveyor device in the heating region, and by a shuttle device on rails in the component mounting region. When comparing chains with rails, the friction generated between the board is smaller with chains, thus the movement speed of the in-conveyor is faster. This means, compared to a case in which the board is moved by the rails and shuttle device in both the heating region and the component mounting region, the movement time of the board is shorter. Also, because there are no chains below the rails, the movable range of a flow tank is larger, and the component mountable region is larger.

Abstract: A component inserting machine includes a gripping device which grips leads of an insert component which is supplied to a component supplying section using a pair of clamp members, X and Y robots which move the gripping device, a lead imaging device which images the leads which are gripped by the clamp members, and a control section which detects lead positions from an image containing the leads which are imaged by the lead imaging device and inserts the leads which are gripped by one of the clamp members into the insertion holes by moving the gripping device using the X and Y robots based on the lead positions.

Abstract: In a component mounting method and apparatus capable of mounting components on a board having a non-planar component mounting surface, a board holding table in a board holding device is turned based on board holding device information and board information to direct a normal line to a mounting portion on the non-planar component mounting surface in the vertical direction. Thus, after being picked up and moved by a component loading device onto the normal line to the mounting portion, a component can be mounted through a movement of the component loading device in the vertical direction only. Further, compensation amounts for the position of the mounting portion are calculated based on a turn amount, the board holding device information and the board information, and a compensated mounting position is calculated from the compensation amounts and the board information accurately in the horizontal and vertical directions.

Abstract: In a component mounting method and apparatus capable of mounting components on a board having a non-planar component mounting surface, a board holding table in a board holding device is turned based on board holding device information and board information to direct a normal line to a mounting portion on the non-planar component mounting surface in the vertical direction. Thus, after being picked up and moved by a component loading device onto the normal line to the mounting portion, a component can be mounted through a movement of the component loading device in the vertical direction only. Further, compensation amounts for the position of the mounting portion are calculated based on a turn amount, the board holding device information and the board information, and a compensated mounting position is calculated from the compensation amounts and the board information accurately in the horizontal and vertical directions.