Abstract: An alignment device includes an image pickup optical system for picking up an image of a first reference mark disposed on a mask and an image of a second reference mark disposed on a photosensitive substrate through an image pickup optical system, a memory for storing information associated with the imaging characteristics of the image pickup optical system, and a correction system for correcting the positions of the first and second reference marks, detected using image information from the image pickup system, on the basis of the information associated with the imaging characteristics of the image pickup optical system.

Abstract: Disclosed is a projection exposure method for transferring a pattern formed on a mask onto a photosensitive substrate through a projection optical system. A light beam having a first wavelength for exposure is radiated through the projection optical system onto a first mark area including a fiducial mark on a fiducial plate installed on a substrate stage, reflected light from the first mark area is detected to obtain a position of the fiducial mark. A light beam having a second wavelength to which the photosensitive substrate is not photosensitive is radiated through the projection optical system onto the first mark area, reflected light from the first mark area is detected to obtain a position of the fiducial mark. A positional discrepancy of the fiducial mark caused by the difference in wavelength between the first and second wavelengths is previously calculated on the basis of results of the detection.

Abstract: A pair of reference plates is so arranged as to have a predetermined positional relationship on a carriage that integrally holds a mask and a photosensitive substrate such that the mask and the photosensitive substrate oppose each other on two sides of a projecting optical system. By periodically detecting the positional relationship between the reference plates in the optical axis direction, a variation with time occurring in the detection characteristics of position detecting devices is detected. Both stable image formation characteristics and a high throughput are realized by correcting a driving signal to be supplied to a driving device in accordance with the detected variation.

Abstract: A scanning exposure apparatus is arranged to illuminate a mask, to project an image of the mask through a projection optical system onto a photosensitive substrate, and to move the mask and the photosensitive substrate relative to the projection optical system, thereby effecting exposure of an entire surface of the mask on the photosensitive substrate, and the exposure apparatus comprises a position detector which detects a relative positional relation between the mask and the photosensitive substrate; a memory which stores positional information obtained by the position detector; a position correcting device which corrects the relative positional relation between the mask and the photosensitive substrate, based on the positional information read out from the memory device; and a controller which makes the position detector detect the relative positional relation between the mask and the photosensitive substrate while the mask and the photosensitive substrate are carried past a projection region of the projec

Abstract: An exposure apparatus, having an illumination optical system for radiating a light beam from a light source to a pattern area of a mask for transferring the image of the pattern area onto a photosensitive substrate by the light beam passing through the mask, is provided with plural sets of a first reference mark and a second reference mark arranged on the mask and the photosensitive substrate at positions corresponding to each other, and a light-shielding device for shielding the light beams radiated toward the second reference marks, whereby it is possible to re-use the second reference marks in a post-process by preventing the first reference marks on the mask from being superposed on the second reference marks on the photosensitive substrate or from being transferred onto a part near the second reference marks.

Abstract: In a scanning type exposure apparatus for exposing an entire surface of a pattern region on a mask to a substrate by scanning the mask and the substrate with respect to a projection optical system in a predetermined direction with a speed ratio in accordance with a magnification of the projection optical system, there are provided a plurality of illumination optical systems for illuminating respective areas of the pattern region on the mask with respective light fluxes from respective light source; a plurality of projection optical systems arranged so as to correspond to the respective illumination optical systems, the projection optical systems projecting respective images of the areas illuminated by the respective illumination optical systems onto respective projection areas on the substrate; a memory device for obtaining and storing a change of shape of the substrate; a magnification changing device for changing a magnification of at least one of the projection optical systems in accordance with the change

Abstract: This invention relates to an exposure apparatus for synchronously scanning a mask and a photosensitive substrate with respect to a plurality of projection optical systems, thereby properly transferring an entire pattern area on the mask onto the photosensitive substrate. A plurality of sets of mask-side reference marks and substrate-side reference marks are arranged at positions corresponding to each other on the mask surface and the photosensitive substrate surface and at least at two positions conjugate with the plurality of projection optical systems. The displacement amount between an image of a mask-side reference mark or a substrate-side reference mark formed on the corresponding substrate-side reference mark or mask-side reference mark through the projection optical system and the position of the substrate-side reference mark and the mask-side reference mark is measured. The imaging characteristics of the plurality of projection optical systems are corrected in accordance with the displacement amount.