Patents by Inventor Tsuyoshi SAKITA

Tsuyoshi SAKITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10433423
    Abstract: A method of this invention is for manufacturing a circuit board in which terminal fittings and electronic components are provided on a first surface of a main substrate that has the first surface and a second surface, a sub substrate that has a first surface and a second surface is arranged on the second surface side of the main substrate, and the sub substrate and the main substrate are connected by relay terminals. The main substrate and the sub substrate are formed in advance in a state of being connected in the same plane. During the method, the main and sub substrate are initially physical connected, at which time electrical components are attached to at least the main substrate. After physically separating the main and sub substrates, they are electrically connected.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: October 1, 2019
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Tsuyoshi Sakita
  • Publication number: 20190045631
    Abstract: A method of this invention is for manufacturing a circuit board in which terminal fittings and electronic components are provided on a first surface of a main substrate that has the first surface and a second surface, a sub substrate that has a first surface and a second surface is arranged on the second surface side of the main substrate, and the sub substrate and the main substrate are connected by relay terminals. The main substrate and the sub substrate are formed in advance in a state of being connected in the same plane. During the method, the main and sub substrate are initially physical connected, at which time electrical components are attached to at least the main substrate. After physically separating the main and sub substrates, they are electrically connected.
    Type: Application
    Filed: March 14, 2017
    Publication date: February 7, 2019
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Tsuyoshi SAKITA
  • Patent number: 9373897
    Abstract: A printed circuit board with a terminal having a novel structure that enables terminals to stand on their own on the printed circuit board without using a seat, while reducing or eliminating damage to through-hole plating or an inner layer circuit. A printed circuit board with a terminal includes a terminal having soldering sections that are inserted, without being press-fitted, into through-holes of a printed circuit board and are fixed by soldering. The terminal has a fixation leg and the printed circuit board has a press-fit hole, the terminal is positioned and retained on the printed circuit board by the fixation leg of the terminal being press-fitted into the press-fit hole of the printed circuit board, and an inner circumferential surfaces of the through-holes are provided with plating, whereas an inner circumferential surface of the press-fit hole is not provided with the plating.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: June 21, 2016
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Tsuyoshi Sakita, Katsuya Ito
  • Publication number: 20150270625
    Abstract: A printed circuit board with a terminal having a novel structure that enables terminals to stand on their own on the printed circuit board without using a seat, while reducing or eliminating damage to through-hole plating or an inner layer circuit. A printed circuit board with a terminal includes a terminal having soldering sections that are inserted, without being press-fitted, into through-holes of a printed circuit board and are fixed by soldering. The terminal has a fixation leg and the printed circuit board has a press-fit hole, the terminal is positioned and retained on the printed circuit board by the fixation leg of the terminal being press-fitted into the press-fit hole of the printed circuit board, and an inner circumferential surfaces of the through-holes are provided with plating, whereas an inner circumferential surface of the press-fit hole is not provided with the plating.
    Type: Application
    Filed: March 13, 2015
    Publication date: September 24, 2015
    Inventors: Tsuyoshi SAKITA, Katsuya ITO
  • Patent number: 8824164
    Abstract: The present invention provides a laminate printed board having a novel structure that is able to ensure alignment accuracy of the interboard terminals soldered to one printed board and that is also able to achieve a simplification of the process of soldering the interboard terminals. Through-hole lines in which a plurality of through-holes extend in lines are formed on a first printed board. Additionally, a press-fitting fastener hole is formed within the through-hole lines and a first end of an interboard terminal is press-fitted and fastened to the press-fitting fastener hole. Additionally, first ends of others of the interboard terminals are inserted through and flow soldered to through-holes on the first printed board.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: September 2, 2014
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Tsuyoshi Sakita
  • Publication number: 20130050971
    Abstract: The present invention provides a laminate printed board having a novel structure that is able to ensure alignment accuracy of the interboard terminals soldered to one printed board and that is also able to achieve a simplification of the process of soldering the interboard terminals. Through-hole lines in which a plurality of through-holes extend in lines are formed on a first printed board. Additionally, a press-fitting fastener hole is formed within the through-hole lines and a first end of an interboard terminal is press-fitted and fastened to the press-fitting fastener hole. Additionally, first ends of others of the interboard terminals are inserted through and flow soldered to through-holes on the first printed board.
    Type: Application
    Filed: July 17, 2012
    Publication date: February 28, 2013
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.,
    Inventor: Tsuyoshi SAKITA