Patents by Inventor Tsuyoshi Tamogami
Tsuyoshi Tamogami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11485883Abstract: Disclosed is an aqueous bonding composition comprising: (A) a modified saccharide which is a product of (a) a saccharide and (b) a radical initiator. The composition further preferably comprises a structure based on (c) an amine. The composition further preferably comprises (B) an inorganic acid salt. The formaldehyde-free aqueous bonding composition can contribute to an improvement in mechanical properties such as strength and elastic modulus of a molded article, compared to a formaldehyde-containing phenol resin composition.Type: GrantFiled: November 25, 2019Date of Patent: November 1, 2022Assignee: HENKEL AG & CO., KGaAInventors: Tsuyoshi Tamogami, Yoshio Yoshida, Tadashi Hayakawa
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Patent number: 11236257Abstract: The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.Type: GrantFiled: June 20, 2018Date of Patent: February 1, 2022Assignee: Henkel AG & Co. KGaAInventors: Kenji Matsuda, Ai Takamori, Tsuyoshi Tamogami
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Publication number: 20200199416Abstract: Disclosed is an aqueous bonding composition comprising: (A) a modified saccharide which is a product of (a) a saccharide and (b) a radical initiator. The composition further preferably comprises a structure based on (c) an amine. The composition further preferably comprises (B) an inorganic acid salt. The formaldehyde-free aqueous bonding composition can contribute to an improvement in mechanical properties such as strength and elastic modulus of a molded article, compared to a formaldehyde-containing phenol resin composition.Type: ApplicationFiled: November 25, 2019Publication date: June 25, 2020Inventors: Tsuyoshi TAMOGAMI, Yoshio Yoshida, Tadashi Hayakawa
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Patent number: 10611049Abstract: Disclosed is an aqueous bonding composition comprising: (A) a saccharide; (B) a water-soluble synthetic resin; and (C) an inorganic acid ammonium salt, wherein the inorganic acid ammonium salt (C) comprises at least one selected from ammonium dihydrogen phosphate and ammonium chloride. The water-soluble synthetic resin (B) preferably comprises a polyvinyl alcohol-based compound. A wood-based material obtainable by using the aqueous bonding composition is also disclosed. The aqueous bonding composition is useful for improving performances such as bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength of a wood-based material in a balanced manner while the composition is capable of bonding at a comparatively low temperature and each component of the composition is excellent in compatibility.Type: GrantFiled: September 13, 2018Date of Patent: April 7, 2020Assignee: HENKEL AG & CO. KGAAInventors: Tsuyoshi Tamogami, Yoshio Yoshida
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Publication number: 20190009427Abstract: Disclosed is an aqueous bonding composition comprising: (A) a saccharide; (B) a water-soluble synthetic resin; and (C) an inorganic acid ammonium salt, wherein the inorganic acid ammonium salt (C) comprises at least one selected from ammonium dihydrogen phosphate and ammonium chloride. The water-soluble synthetic resin (B) preferably comprises a polyvinyl alcohol-based compound. A wood-based material obtainable by using the aqueous bonding composition is also disclosed. The aqueous bonding composition is useful for improving performances such as bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength of a wood-based material in a balanced manner while the composition is capable of bonding at a comparatively low temperature and each component of the composition is excellent in compatibility.Type: ApplicationFiled: September 13, 2018Publication date: January 10, 2019Inventors: Tsuyoshi TAMOGAMI, Yoshio Yoshida
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Publication number: 20180305588Abstract: Disclosed is an aqueous bonding composition comprising: (A) a sugar syrup; (B) an inorganic acid ammonium salt; and (C) a metal salt. The sugar syrup (A) preferably comprises at least one selected from waste molasses, ice molasses, and crude saccharide. The metal salt (C) preferably comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is excellent in balance among performances such as bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength while being capable of bonding at a comparatively low temperature, and is particularly useful to produce a wood-based material. Further, disclosed is a wood-based material obtainable by using the composition.Type: ApplicationFiled: June 18, 2018Publication date: October 25, 2018Inventors: Tsuyoshi TAMOGAMI, Yoshio YOSHIDA
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Publication number: 20180298254Abstract: The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.Type: ApplicationFiled: June 20, 2018Publication date: October 18, 2018Inventors: Kenji Matsuda, Ai Takamori, Tsuyoshi Tamogami
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Publication number: 20150376480Abstract: The present invention provides a moisture-curable hot melt adhesive comprising an alicyclic urethane prepolymer having isocyanate group(s) at the ends, wherein the alicyclic urethane prepolymer comprises a chemical structure derived from a polycarbonate polyol, and at least one of the isocyanate group(s) at the ends is combined with a chemical structure derived from an aromatic ring. The moisture-curable hot melt adhesive is excellent in adhesion property (initial adhesion property and adhesion property after aging), light resistance (light-resisting adhesive force, yellowing and fading), and curing property (heat resistance).Type: ApplicationFiled: August 20, 2015Publication date: December 31, 2015Inventors: Tsuyoshi Tamogami, Tadashi Hayakawa
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Publication number: 20140272425Abstract: A moisture-curable hot melt adhesive which is excellent in light resistance and durability against high temperature and high humidity. The moisture-curable hot melt adhesive includes a urethane prepolymer having an isocyanate group at the end and an acrylic based polymer, wherein the urethane prepolymer contains chemical structures derived from a polycarbonate polyol and a non-crystalline polyesterpolyol. The moisture-curable hot melt adhesive can be used to produce an automobile interior material since no deterioration occurs even under sunlight, or under severe high temperature and high humidity conditions in the summer season.Type: ApplicationFiled: June 2, 2014Publication date: September 18, 2014Inventor: Tsuyoshi Tamogami
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Publication number: 20130345354Abstract: A moisture-curable hot melt adhesive including a urethane prepolymer having an isocyanate group at the end, and an acrylic polymer (A) having an alicyclic structure, wherein the urethane prepolymer has a chemical structure derived from a crystalline polyesterpolyol. The moisture-curable hot melt adhesive is excellent in initial adhesive strength and excellent in heat resistance. The acrylic polymer (A) may be a chemical structure derived from at least one of (meth)acrylic acid derivatives selected from cyclohexyl (meth)acrylate and isobornyl (meth)acrylate.Type: ApplicationFiled: March 12, 2013Publication date: December 26, 2013Applicant: Henkel AG & Co. KGaAInventors: Tsuyoshi Tamogami, Yoshio Yoshida
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Patent number: 8324299Abstract: A moisture-curable hot-melt adhesive having an excellent balance of environmental friendliness, compatibility of ingredients, early-stage adhesive strength, heat resistance after moisture curing, tack free time, etc. and a method of manufacture for this hot-melt adhesive. A moisture-curable hot-melt adhesive which contains a urethane polymer that has a terminal isocyanate group and a moisture-curable hot-melt adhesive that contains urethane modified resin, has a residual percentage of isocyanate compound of 5 wt. % or less, and has a heat-resistant softening temperature after moisture curing of 60° C. or higher, has an excellent balance of the aforementioned. Urethane modified resin can be obtained by reacting a resin derivative that has a hydroxyl group with an isocyanate compound, and a moisture-curable hot-melt adhesive can be produced by mixing urethane-modified resin, polymer, and isocyanate compound.Type: GrantFiled: May 26, 2011Date of Patent: December 4, 2012Assignee: Henkel CorporationInventors: Hideyuki Yamakoshi, Tsuyoshi Tamogami
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Publication number: 20120283370Abstract: The present invention provides a method for producing a moisture-curable hot melt adhesive. This moisture-curable hot melt adhesive is environmentally friendly, is compatible with the components therein, has high initial adhesion strength, has long open time and has high heat resistance after moisture curing. The moisture-curable hot melt adhesive comprises a (A) urethane prepolymer having an isocyanate group at the terminus, comprising, a (A) urethane-modified rosin, and a (B) copolymer of ethylene and a (meth)acrylic acid derivative, wherein the urethane prepolymer is obtained by the reaction of polyol with an isocyanate compound.Type: ApplicationFiled: May 30, 2012Publication date: November 8, 2012Applicant: Henkel CorporationInventors: Tsuyoshi Tamogami, Yoshio Yoshida
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Publication number: 20110275767Abstract: A moisture-curable hot-melt adhesive having an excellent balance of environmental friendliness, compatibility of ingredients, early-stage adhesive strength, heat resistance after moisture curing, tack free time, etc. and a method of manufacture for this hot-melt adhesive. A moisture-curable hot-melt adhesive which contains a urethane polymer that has a terminal isocyanate group and a moisture-curable hot-melt adhesive that contains urethane modified resin, has a residual percentage of isocyanate compound of 5 wt. % or less, and has a heat-resistant softening temperature after moisture curing of 60° C. or higher, has an excellent balance of the aforementioned. Urethane modified resin can be obtained by reacting a resin derivative that has a hydroxyl group with an isocyanate compound, and a moisture-curable hot-melt adhesive can be produced by mixing urethane-modified resin, polymer, and isocyanate compound.Type: ApplicationFiled: May 26, 2011Publication date: November 10, 2011Applicant: Henkel CorporationInventors: Hideyuki Yamakoshi, Tsuyoshi Tamogami