Patents by Inventor Tsuyoshi Tamogami

Tsuyoshi Tamogami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11485883
    Abstract: Disclosed is an aqueous bonding composition comprising: (A) a modified saccharide which is a product of (a) a saccharide and (b) a radical initiator. The composition further preferably comprises a structure based on (c) an amine. The composition further preferably comprises (B) an inorganic acid salt. The formaldehyde-free aqueous bonding composition can contribute to an improvement in mechanical properties such as strength and elastic modulus of a molded article, compared to a formaldehyde-containing phenol resin composition.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: November 1, 2022
    Assignee: HENKEL AG & CO., KGaA
    Inventors: Tsuyoshi Tamogami, Yoshio Yoshida, Tadashi Hayakawa
  • Patent number: 11236257
    Abstract: The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: February 1, 2022
    Assignee: Henkel AG & Co. KGaA
    Inventors: Kenji Matsuda, Ai Takamori, Tsuyoshi Tamogami
  • Publication number: 20200199416
    Abstract: Disclosed is an aqueous bonding composition comprising: (A) a modified saccharide which is a product of (a) a saccharide and (b) a radical initiator. The composition further preferably comprises a structure based on (c) an amine. The composition further preferably comprises (B) an inorganic acid salt. The formaldehyde-free aqueous bonding composition can contribute to an improvement in mechanical properties such as strength and elastic modulus of a molded article, compared to a formaldehyde-containing phenol resin composition.
    Type: Application
    Filed: November 25, 2019
    Publication date: June 25, 2020
    Inventors: Tsuyoshi TAMOGAMI, Yoshio Yoshida, Tadashi Hayakawa
  • Patent number: 10611049
    Abstract: Disclosed is an aqueous bonding composition comprising: (A) a saccharide; (B) a water-soluble synthetic resin; and (C) an inorganic acid ammonium salt, wherein the inorganic acid ammonium salt (C) comprises at least one selected from ammonium dihydrogen phosphate and ammonium chloride. The water-soluble synthetic resin (B) preferably comprises a polyvinyl alcohol-based compound. A wood-based material obtainable by using the aqueous bonding composition is also disclosed. The aqueous bonding composition is useful for improving performances such as bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength of a wood-based material in a balanced manner while the composition is capable of bonding at a comparatively low temperature and each component of the composition is excellent in compatibility.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: April 7, 2020
    Assignee: HENKEL AG & CO. KGAA
    Inventors: Tsuyoshi Tamogami, Yoshio Yoshida
  • Publication number: 20190009427
    Abstract: Disclosed is an aqueous bonding composition comprising: (A) a saccharide; (B) a water-soluble synthetic resin; and (C) an inorganic acid ammonium salt, wherein the inorganic acid ammonium salt (C) comprises at least one selected from ammonium dihydrogen phosphate and ammonium chloride. The water-soluble synthetic resin (B) preferably comprises a polyvinyl alcohol-based compound. A wood-based material obtainable by using the aqueous bonding composition is also disclosed. The aqueous bonding composition is useful for improving performances such as bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength of a wood-based material in a balanced manner while the composition is capable of bonding at a comparatively low temperature and each component of the composition is excellent in compatibility.
    Type: Application
    Filed: September 13, 2018
    Publication date: January 10, 2019
    Inventors: Tsuyoshi TAMOGAMI, Yoshio Yoshida
  • Publication number: 20180305588
    Abstract: Disclosed is an aqueous bonding composition comprising: (A) a sugar syrup; (B) an inorganic acid ammonium salt; and (C) a metal salt. The sugar syrup (A) preferably comprises at least one selected from waste molasses, ice molasses, and crude saccharide. The metal salt (C) preferably comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is excellent in balance among performances such as bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength while being capable of bonding at a comparatively low temperature, and is particularly useful to produce a wood-based material. Further, disclosed is a wood-based material obtainable by using the composition.
    Type: Application
    Filed: June 18, 2018
    Publication date: October 25, 2018
    Inventors: Tsuyoshi TAMOGAMI, Yoshio YOSHIDA
  • Publication number: 20180298254
    Abstract: The object of the present invention is to provide a moisture-curable hot melt adhesive having high initial adhesive strength, long open time, excellent coating property and reduced stringing property. The present invention relates to a moisture-curable hot melt adhesive comprising (A) a urethane prepolymer having a terminal isocyanate group, (B) a metallocene-based polyolefin having a viscosity of 10,000 mPa·s or less at a temperature of 170° C. and (C) a polyester-polyether copolymer.
    Type: Application
    Filed: June 20, 2018
    Publication date: October 18, 2018
    Inventors: Kenji Matsuda, Ai Takamori, Tsuyoshi Tamogami
  • Publication number: 20150376480
    Abstract: The present invention provides a moisture-curable hot melt adhesive comprising an alicyclic urethane prepolymer having isocyanate group(s) at the ends, wherein the alicyclic urethane prepolymer comprises a chemical structure derived from a polycarbonate polyol, and at least one of the isocyanate group(s) at the ends is combined with a chemical structure derived from an aromatic ring. The moisture-curable hot melt adhesive is excellent in adhesion property (initial adhesion property and adhesion property after aging), light resistance (light-resisting adhesive force, yellowing and fading), and curing property (heat resistance).
    Type: Application
    Filed: August 20, 2015
    Publication date: December 31, 2015
    Inventors: Tsuyoshi Tamogami, Tadashi Hayakawa
  • Publication number: 20140272425
    Abstract: A moisture-curable hot melt adhesive which is excellent in light resistance and durability against high temperature and high humidity. The moisture-curable hot melt adhesive includes a urethane prepolymer having an isocyanate group at the end and an acrylic based polymer, wherein the urethane prepolymer contains chemical structures derived from a polycarbonate polyol and a non-crystalline polyesterpolyol. The moisture-curable hot melt adhesive can be used to produce an automobile interior material since no deterioration occurs even under sunlight, or under severe high temperature and high humidity conditions in the summer season.
    Type: Application
    Filed: June 2, 2014
    Publication date: September 18, 2014
    Inventor: Tsuyoshi Tamogami
  • Publication number: 20130345354
    Abstract: A moisture-curable hot melt adhesive including a urethane prepolymer having an isocyanate group at the end, and an acrylic polymer (A) having an alicyclic structure, wherein the urethane prepolymer has a chemical structure derived from a crystalline polyesterpolyol. The moisture-curable hot melt adhesive is excellent in initial adhesive strength and excellent in heat resistance. The acrylic polymer (A) may be a chemical structure derived from at least one of (meth)acrylic acid derivatives selected from cyclohexyl (meth)acrylate and isobornyl (meth)acrylate.
    Type: Application
    Filed: March 12, 2013
    Publication date: December 26, 2013
    Applicant: Henkel AG & Co. KGaA
    Inventors: Tsuyoshi Tamogami, Yoshio Yoshida
  • Patent number: 8324299
    Abstract: A moisture-curable hot-melt adhesive having an excellent balance of environmental friendliness, compatibility of ingredients, early-stage adhesive strength, heat resistance after moisture curing, tack free time, etc. and a method of manufacture for this hot-melt adhesive. A moisture-curable hot-melt adhesive which contains a urethane polymer that has a terminal isocyanate group and a moisture-curable hot-melt adhesive that contains urethane modified resin, has a residual percentage of isocyanate compound of 5 wt. % or less, and has a heat-resistant softening temperature after moisture curing of 60° C. or higher, has an excellent balance of the aforementioned. Urethane modified resin can be obtained by reacting a resin derivative that has a hydroxyl group with an isocyanate compound, and a moisture-curable hot-melt adhesive can be produced by mixing urethane-modified resin, polymer, and isocyanate compound.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: December 4, 2012
    Assignee: Henkel Corporation
    Inventors: Hideyuki Yamakoshi, Tsuyoshi Tamogami
  • Publication number: 20120283370
    Abstract: The present invention provides a method for producing a moisture-curable hot melt adhesive. This moisture-curable hot melt adhesive is environmentally friendly, is compatible with the components therein, has high initial adhesion strength, has long open time and has high heat resistance after moisture curing. The moisture-curable hot melt adhesive comprises a (A) urethane prepolymer having an isocyanate group at the terminus, comprising, a (A) urethane-modified rosin, and a (B) copolymer of ethylene and a (meth)acrylic acid derivative, wherein the urethane prepolymer is obtained by the reaction of polyol with an isocyanate compound.
    Type: Application
    Filed: May 30, 2012
    Publication date: November 8, 2012
    Applicant: Henkel Corporation
    Inventors: Tsuyoshi Tamogami, Yoshio Yoshida
  • Publication number: 20110275767
    Abstract: A moisture-curable hot-melt adhesive having an excellent balance of environmental friendliness, compatibility of ingredients, early-stage adhesive strength, heat resistance after moisture curing, tack free time, etc. and a method of manufacture for this hot-melt adhesive. A moisture-curable hot-melt adhesive which contains a urethane polymer that has a terminal isocyanate group and a moisture-curable hot-melt adhesive that contains urethane modified resin, has a residual percentage of isocyanate compound of 5 wt. % or less, and has a heat-resistant softening temperature after moisture curing of 60° C. or higher, has an excellent balance of the aforementioned. Urethane modified resin can be obtained by reacting a resin derivative that has a hydroxyl group with an isocyanate compound, and a moisture-curable hot-melt adhesive can be produced by mixing urethane-modified resin, polymer, and isocyanate compound.
    Type: Application
    Filed: May 26, 2011
    Publication date: November 10, 2011
    Applicant: Henkel Corporation
    Inventors: Hideyuki Yamakoshi, Tsuyoshi Tamogami