Abstract: Embodiments described herein generally relate to apparatuses for processing a substrate. In one or more embodiments, a heater support kit includes a heater assembly contains a heater plate having an upper surface and a lower surface, a chuck ring disposed on at least a portion of the upper surface of the heater plate, a heater arm assembly contains a heater arm and supporting the heater assembly, and a heater support plate disposed between the heater plate and the heater arm and in contact with at least a portion of the lower surface of the heater plate.

Abstract: Aspects of the present disclosure relate generally to isolator devices, components thereof, and methods associated therewith for substrate processing chambers. In one implementation, a substrate processing chamber includes an isolator ring disposed between a pedestal and a pumping liner. The isolator ring includes a first surface that faces the pedestal, the first surface being disposed at a gap from an outer circumferential surface of the pedestal. The isolator ring also includes a second surface that faces the pumping liner and a protrusion that protrudes from the first surface of the isolator ring and towards the outer circumferential surface of the pedestal. The protrusion defines a necked portion of the gap between the pedestal and the isolator ring.

Abstract: In one embodiment, at least a processing chamber includes a perforated lid, a gas blocker disposed on the perforated lid, and a substrate support disposed below the perforated lid. The gas blocker includes a gas manifold, a central gas channel formed in the gas manifold, a first gas distribution plate comprising an inner and outer trenches surrounding the central gas channel, a first and second gas channels formed in the gas manifold, the first gas channel is in fluid communication with a first gas source and the inner trench, and the second gas channel is in fluid communication with the first gas source and the outer trench, a second gas distribution plate, a third gas distribution plate disposed below the second gas distribution plate, and a plurality of pass-through channels disposed between the second gas distribution plate and the third gas distribution plate.

Abstract: Exemplary methods of treating a chamber may include delivering a cleaning precursor to a remote plasma unit. The methods may include forming a plasma of the cleaning precursor. The methods may include delivering plasma effluents of the cleaning precursor to a processing region of a semiconductor processing chamber. The processing region may be defined by one or more chamber components. The one or more chamber components may include an oxide coating. The methods may include halting delivery of the plasma effluents. The methods may include treating the oxide coating with a hydrogen-containing material delivered to the processing region subsequent halting delivery of the plasma effluents.

Abstract: Embodiments of the disclosure relate to faceplates for a processing chamber. In one example, a faceplate includes a body having a plurality of apertures formed therethrough. A heating element is disposed within the body, and the heating element circumscribes the plurality of apertures. A support ring is disposed the body. The support ring circumscribes the heating element. The support ring includes a main body and a cantilever extending radially inward from the main body. The cantilever contacts the body of the faceplate.

Abstract: The present disclosure provides an electrical power supply structure comprising a plurality of insulated pipes, each insulated pipe extending longitudinally and configured to carry high amperage electrical power, a barrier support plate comprising one or more openings for receiving the plurality of insulated pipes, the barrier support plate configured for mounting over a hole through a floor of a building, a first support structure extending longitudinally upward from an upper side of the barrier support plate, and a second support structure extending longitudinally downward from a lower side of the barrier support plate through the hole. Each of the first and second support structures comprises a longitudinally extending enclosure having a plurality of transversely extending conductor support members for supporting the plurality of insulated pipes, and the plurality of insulated pipes are grouped by phase.

Abstract: Aspects of the present disclosure relate generally to isolator devices, components thereof, and methods associated therewith for substrate processing chambers. In one implementation, a substrate processing chamber includes an isolator ring disposed between a pedestal and a pumping liner. The isolator ring includes a first surface that faces the pedestal, the first surface being disposed at a gap from an outer circumferential surface of the pedestal. The isolator ring also includes a second surface that faces the pumping liner and a protrusion that protrudes from the first surface of the isolator ring and towards the outer circumferential surface of the pedestal. The protrusion defines a necked portion of the gap between the pedestal and the isolator ring.

Abstract: A first electronic device of a local group of connected electronic devices receives a first voice command including a request for a first operation assigns a first target device from among a local group of connected electronic devices as an in-focus device for performing the first operation, causes the first operation to be performed by the first target device via operation of a server-implemented common network service, receives a second voice command including a request for a second operation and based on a determination that the second voice command does not include an explicit designation of a second target device and a determination that the second operation can be performed by the first target device, assigning the first target device.

Abstract: A method and apparatus for processing a semiconductor is disclosed herein. In one embodiment, a processing system for semiconductor processing is disclosed. The processing chamber includes two transfer chambers, a processing chamber, and a rotation module. The processing chamber is coupled to the transfer chamber. The rotation module is positioned between the transfer chambers. The rotation module is configured to rotate the substrate. The transfer chambers are configured to transfer the substrate between the processing chamber and the transfer chamber. In another embodiment, a method for processing a substrate on the apparatus is disclosed herein.

Abstract: Embodiments described herein relate to ground path systems providing a shorter and symmetrical path for radio frequency (RF) energy to propagate to a ground to reduce generation of the parasitic plasma. The ground path system bifurcates the processing volume of the chamber to form an inner volume that isolates an outer volume of the processing volume.

Abstract: The present disclosure generally relates to an isolation device for use in processing systems. The isolation device includes a body having a flow aperture formed therethrough. In one embodiment, the isolation device is disposed between a remote plasma source and a process chamber. A closure mechanism is pivotally disposed within the body. The closure mechanism can be actuated to enable or disable fluid communication between the remote plasma source and the process chamber. In one embodiment, the closure mechanism includes a shaft and a seal plate coupled to the shaft. A cross-arm is coupled to the shaft opposite the seal plate. The cross-arm is configured to selectively rotate the shaft and the seal plate of the closure mechanism.

Abstract: A method and system for security assessment include a simulator configured to simulate a warping-based backdoor attack and an evaluation module configured to evaluate security and output a warning about a backdoor risk. The simulator, which comprises a warping unit and a backdoor model, is configured to generate a warping field, the warping unit is configured to receive the clean image and the warping field as inputs and output the warped backdoor image and the simulator is configured to train the backdoor model using the warped backdoor image.

Abstract: A first electronic device of a local group of connected electronic devices receives a first voice command including a request for a first operation, assigns a first target device from among a local group of connected electronic devices as an in-focus device for performing the first operation, causes the first operation to be performed by the first target device via operation of a server-implemented common network service, receives a second voice command including a request for a second operation, and based on a determination that the second voice command does not include an explicit designation of a second target device and a determination that the second operation can be performed by the first target device, assigning the first target device as the in-focus device for performing the second operation.

Abstract: Exemplary methods of treating a chamber may include delivering a cleaning precursor to a remote plasma unit. The methods may include forming a plasma of the cleaning precursor. The methods may include delivering plasma effluents of the cleaning precursor to a processing region of a semiconductor processing chamber. The processing region may be defined by one or more chamber components. The one or more chamber components may include an oxide coating. The methods may include halting delivery of the plasma effluents. The methods may include treating the oxide coating with a hydrogen-containing material delivered to the processing region subsequent halting delivery of the plasma effluents.

Abstract: Embodiments described herein relate to a precision dynamic leveling mechanism for repeatedly positioning the pedestal within a process. The precision dynamic leveling mechanism includes bearing assemblies. Bearing assemblies having inner races forced against a pedestal assembly carrier and outer races forced against a guide adaptor provide nominal clearance between the inner races and outer races to allow the inner races and the outer races to slide on each other with minimal or no radial motion.

Abstract: Aspects of the present disclosure relate generally to isolator devices, components thereof, and methods associated therewith for substrate processing chambers. In one implementation, a substrate processing chamber includes an isolator ring disposed between a pedestal and a pumping liner. The isolator ring includes a first surface that faces the pedestal, the first surface being disposed at a gap from an outer circumferential surface of the pedestal. The isolator ring also includes a second surface that faces the pumping liner and a protrusion that protrudes from the first surface of the isolator ring and towards the outer circumferential surface of the pedestal. The protrusion defines a necked portion of the gap between the pedestal and the isolator ring.

Abstract: A gas turbine storage container is composed of a horizontal cylindrical shell with openings at two opposite ends of the cylinder, outside is designed with frames to keep it fixed and has straps to install ropes when hoisting. The inside of the cylindrical shell is pumped with inert gas and contains desiccant. The engine is housed in a mount that can be fixed to the inside of the box, and has wheels to make it possible to move it out of the box. A sensor system that measures the temperature and humidity status inside the cylindrical shell can provide information about the quality of the gas stored in the cylindrical shell in real time without opening.

Abstract: Embodiments of the present disclosure relate to a method, a system, and a non-transitory machine-readable medium for assigning performance defects to software processing components. Provided is a method that receives performance data of a set of performance runs of a software application across a set of software processing components of a file software system, where the performance data comprises multiple labeled performance features that are associated with the set of software processing components; receives, from a software processing component expert, a user-selection of a subset of labeled performance features of the several labeled performance features; and trains a machine learning (ML) model to determine whether one or more of the set of software processing components is associated with performance regressions of the software application, using the subset of labeled performance features of the performance data as training data.

Abstract: The present disclosure relates to a cleaning assemblies, components thereof, and methods associated therewith for substrate processing chambers. In one example, a cleaning assembly for a substrate processing chamber includes a distribution ring. The distribution ring comprises a body with an inlet and an outlet. The outlet is fluidly coupled to an internal volume of the substrate processing chamber via a sidewall of the substrate processing chamber. The cleaning assembly includes a cleaning conduit configured to fluidly couple a gas manifold to the distribution ring for diverting a first portion of cleaning fluid from the gas manifold to the distribution ring.

Abstract: The present disclosure provides an apparatus including a chamber body and a lid defining a volume therein. The apparatus includes a substrate support disposed in the volume opposite the lid. The substrate support includes a support body disposed on a stem, and a ground plate disposed between the support body and the stem. A top flange is coupled to a lower peripheral surface the ground plate and a bottom flange is coupled to a bottom of the chamber body. The bottom flange and the top flange is coupled to one another with a plurality of straps, each of the straps having a first end coupled to the bottom flange and a second end coupled to the top flange.