Abstract: A substrate handling end effector is provided. The substrate handling end effector has a vacuum chuck to support a semiconductor substrate thereon. A vacuum passage and a liquid passage are located in the vacuum chuck. The vacuum passage is adapted to be connected to a vacuum source and the liquid passage is adapted to be connected to a liquid source. The liquid passage is connected to the vacuum passage.

Abstract: A substrate handling end effector is provided. The substrate handling end effector has a vacuum chuck to support a semiconductor substrate thereon. A vacuum passage and a liquid passage are located in the vacuum chuck. The vacuum passage is adapted to be connected to a vacuum source and the liquid passage is adapted to be connected to a liquid source. The liquid passage is connected to the vacuum passage.

Abstract: A substrate transport apparatus comprising a drive section and an articulated arm assembly. The articulated arm assembly is pivotably mounted to the drive section. The arm assembly has a first end connected to the drive section and a second end opposite the first end. An end effector is supported from the second end of the arm assembly. The articulated arm comprises a pair of opposing forearms on opposite sides of an axis of translation of the end effector. The axis of translation extends substantially over a center of the first end of the drive assembly. When the arm assembly is retracted to a home position the second end of the arm assembly is over the center of the first end of the arm assembly. Also, when the arm assembly is retracted to its home position, the opposing forearms are angled relative to the axis of translation at an angle of about 90°.