Patents by Inventor Tuck Boon Chan

Tuck Boon Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11177805
    Abstract: A glitch absorbing buffer reduces glitch power in digital circuits. The glitch absorbing buffer includes a logic element configured to identify a digital logic glitch and a delay circuit configured to selectively delay one input to a logic element. The amount of delay imposed is equivalent to a pulse width of the glitch. A Schmitt trigger may amplify the low pass behavior on the input.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: November 16, 2021
    Assignee: QUALCOMM INCORPORATED
    Inventors: Harshat Pant, Ravindraraj Ramaraju, Luis Filipe Brochado Reis, Tuck Boon Chan, Mayank Sen Sharma
  • Patent number: 9922161
    Abstract: Method for adjusting a layout used in making an integrated circuit includes one or more interconnects in the layout that are susceptible to dielectric breakdown are selected. One or more selected interconnects are adjusted to increase via to wire spacing with respect to at least one via and one wire of the one or more selected interconnects. Preferably, the selecting analyzes signal patterns of interconnects, and estimates the stress ratio based on state probability of routed signal nets in the layout. An annotated layout is provided that describes distances by which one or more via or wire segment edges are to be shifted. Adjustments can include thinning and shifting of wire segments, and rotation of vias.
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: March 20, 2018
    Assignee: The Regents of the University of California
    Inventors: Andrew B. Kahng, Tuck Boon Chan
  • Publication number: 20150379188
    Abstract: Method for adjusting a layout used in making an integrated circuit includes one or more interconnects in the layout that are susceptible to dielectric breakdown are selected. One or more selected interconnects are adjusted to increase via to wire spacing with respect to at least one via and one wire of the one or more selected interconnects. Preferably, the selecting analyzes signal patterns of interconnects, and estimates the stress ratio based on state probability of routed signal nets in the layout. An annotated layout is provided that describes distances by which one or more via or wire segment edges are to be shifted. Adjustments can include thinning and shifting of wire segments, and rotation of vias.
    Type: Application
    Filed: February 20, 2014
    Publication date: December 31, 2015
    Inventors: Andrew B. Kahng, Tuck Boon Chan