Patents by Inventor Tucker Havekost

Tucker Havekost has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10483745
    Abstract: A method for making a downhole electrical feedthrough package where the feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: November 19, 2019
    Assignee: PA&E, Hermetic Solutions Group, LLC
    Inventors: Hua Xia, Nelson Settles, Tucker Havekost, Don Larson
  • Publication number: 20190229515
    Abstract: A method for making a downhole electrical feedthrough package where the feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.
    Type: Application
    Filed: April 3, 2019
    Publication date: July 25, 2019
    Applicant: PA&E, Hermetic Solutions Group, LLC
    Inventors: Hua Xia, Nelson Settles, Tucker Havekost, Don Larson
  • Patent number: 10291008
    Abstract: A downhole electrical feedthrough package and method for making the same. The feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: May 14, 2019
    Assignee: PA&E, HERMETIC SOLUTIONS GROUP, LLC
    Inventors: Hua Xia, Nelson Settles, Tucker Havekost, Don Larson
  • Patent number: 10168371
    Abstract: A system for determining the impact of moisture on a dielectric sealing material may include a testing apparatus having a testing chamber. A dielectric sealing material and a conducting pin may be exposed to the testing chamber. A first electrical lead may be coupled to the conducting pin, and a second electrical lead may be coupled to the dialectic material. An insulation resistance measurement unit may be coupled to both the first electrical lead and the second electrical lead, and the insulation resistance measurement unit may be configured to measure an insulation resistance value between the electrical leads. The insulation resistance measurement unit may measure a first insulation resistance value of the dielectric sealing material in a first environmental condition, and the insulation resistance measurement unit may measure a second insulation resistance value of the dielectric sealing material at a second environmental condition, that is different than the first environmental condition.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: January 1, 2019
    Assignee: PA&E, HERMETIC SOLUTIONS GROUP, LLC
    Inventors: Hua Xia, Tucker Havekost, Daniel Brown, Erich Preissler, Mike Grimm
  • Publication number: 20180331464
    Abstract: A downhole electrical feedthrough package and method for making the same. The feedthrough package may include a metal shell forming a shell conduit. A metal web may be coupled to the metal shell, and the metal web may form a web conduit. A conducting pin may extend through the shell conduit and web conduit. A dielectric seal may electrically isolate the conducting pin from the metal web. The dielectric seal may be formed by a bismuth glass based dielectric sealing material system having at least two of the four components selected from Bi2O3, B2O3, MO, and optionally REO forming a bismuth glass system. MO may be selected from ZnO, BaO, TiO2, and Fe2O3, and their glass making pre-cursors. REO may be selected from CeO2, Y2O3, Sc2O3, Nd2O3, Pr2O3, and lanthanum series oxides. One or more isolators may be disposed within the shell conduit proximate to the dielectric seal and surrounding a portion of the conducting pin.
    Type: Application
    Filed: May 11, 2017
    Publication date: November 15, 2018
    Applicant: Pacific Aerospace & Electronics, Inc.
    Inventors: Hua Xia, Nelson Settles, Tucker Havekost, Don Larson
  • Publication number: 20180284176
    Abstract: A system for determining the impact of moisture on a dielectric sealing material may include a testing apparatus having a testing chamber. A dielectric sealing material and a conducting pin may be exposed to the testing chamber. A first electrical lead may be coupled to the conducting pin, and a second electrical lead may be coupled to the dialectic material. An insulation resistance measurement unit may be coupled to both the first electrical lead and the second electrical lead, and the insulation resistance measurement unit may be configured to measure an insulation resistance value between the electrical leads. The insulation resistance measurement unit may measure a first insulation resistance value of the dielectric sealing material in a first environmental condition, and the insulation resistance measurement unit may measure a second insulation resistance value of the dielectric sealing material at a second environmental condition, that is different than the first environmental condition.
    Type: Application
    Filed: April 4, 2017
    Publication date: October 4, 2018
    Applicant: Pacific Aerospace & Electronics, Inc.
    Inventors: Hua Xia, Tucker Havekost, Daniel Brown, Erich Preissler, Mike Grimm
  • Patent number: 9966169
    Abstract: An integrated downhole electrical feedthrough package may include a metal shell having a metal web conduit disposed within the metal shell. A sealing channel may extend through the metal web conduit. One or more conducting pins may be disposed in the sealing channels. A dielectric seal may also be disposed in the metal web conduit, and the dielectric seal may electrically isolate the one or more conducting pins from the metal web conduit and metal shell. One or more isolators may also be disposed within the metal conduit and each isolator may surround a portion of each conducting pin disposed in the metal conduit. Each isolator may have a high coefficient of thermal expansion material, and a nonpolar surface which may be positioned proximate to a dielectric seal.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: May 8, 2018
    Assignee: PA&E, HERMETIC SOLUTIONS GROUP, LLC
    Inventors: Hua Xia, Nelson Settles, Tucker Havekost, Daniel Brown