Abstract: A switched mode power supply (SMPS) to output a smoothly rising voltage (VOUT) during startup and still operate efficiently during steady state. A smoothly rising VOUT that avoids a negative voltage slope and voltage overshoot may be desirable in some applications. The techniques of this disclosure include an adaptive loading time controlled oscillator (TCO) compensation circuit that adjusts the TCO frequency to linearly regulate the feedback voltage from the half-bridge (VHBFB). The TCO compensation circuit adapts to the startup loading and self-adjusts the regulation speed for the handover point between the TCO and the voltage controlled oscillator (VCO).

Abstract: A switched mode power supply (SMPS) to output a smoothly rising voltage (VOUT) during startup and still operate efficiently during steady state. A smoothly rising VOUT that avoids a negative voltage slope and voltage overshoot may be desirable in some applications. The techniques of this disclosure include an adaptive loading time controlled oscillator (TCO) compensation circuit that adjusts the TCO frequency to linearly regulate the feedback voltage from the half-bridge (VHBFB). The TCO compensation circuit adapts to the startup loading and self-adjusts the regulation speed for the handover point between the TCO and the voltage controlled oscillator (VCO).

Abstract: A package having a plurality of stacked substrates is provided. The package has at least two substrates. One substrate is stacked over the other to construct a three-dimensional circuit structure. Elements are disposed on the respective substrates. At least a conductive column is disposed between the two substrates. A lead-frame is connected to the substrates or the elements. The lead-frame also has a plurality of leads. The two neighboring substrates are electrically connected through the conductive column so that the average signal transmission length is shortened and the signal transmission quality is improved. Furthermore, the conductive column increases the mechanical strength of the package and reduces the degree of warping in the package so that a longer life span can be expected.

Abstract: A package having a plurality of stacked substrates is provided. The package has at least two substrates. One substrate is stacked over the other to construct a three-dimensional circuit structure. Elements are disposed on the respective substrates. At least a conductive column is disposed between the two substrates. A lead-frame is connected to the substrates or the elements. The lead-frame also has a plurality of leads. The two neighboring substrates are electrically connected through the conductive column so that the average signal transmission length is shortened and the signal transmission quality is improved. Furthermore, the conductive column increases the mechanical strength of the package and reduces the degree of warping in the package so that a longer life span can be expected.