Abstract: Bonded wafer device structures, such as a wafer-on-wafer (WoW) structures, and methods of fabricating bonded wafer device structures, including an array of contact pads formed in an interconnect level of at least one wafer of the bonded wafer device structure. The array of contact pads formed in an interconnect level of at least one wafer may have an array pattern that corresponds to an array pattern of contact pads that is subsequently formed over a surface of the bonded wafer structure. The array of contact pads formed in an interconnect level of at least one wafer of the bonded wafer device structure may enable improved testing of individual wafers, including circuit probe testing, prior to the wafer being stacked and bonded to one or more additional wafers to form a bonded wafer structure.

Abstract: A carrier configuration method and system for a distributed antenna system, a processing device, and a chip are provided. The distributed antenna system includes at least one access unit and at least one remote unit. The method includes: acquiring a configuration parameter of a carrier to be transmitted of at least one access unit, the configuration parameter including a mapping relationship between the at least one access unit and the at least one remote unit; and establishing a transmission channel between the at least one access unit and the at least one remote unit according to the mapping relationship.

Abstract: In certain aspects, a first opening extending vertically through a first dielectric deck including a first plurality of interleaved sacrificial layers and dielectric layers above a substrate is formed. A high-k dielectric layer and a channel sacrificial layer free of polysilicon are subsequently formed along a sidewall of the first opening. A second opening extending vertically through a second dielectric deck including a second plurality of interleaved sacrificial layers and dielectric layers on the first dielectric deck is formed to expose the channel sacrificial layer in the first opening. The channel sacrificial layer is removed in the first opening. A memory film and a semiconductor channel are subsequently formed over the high-k dielectric layer along sidewalls of the first and second openings.

Abstract: A semiconductor device includes a first die having a first bonding layer; a second die having a second bonding layer disposed over and bonded to the first bonding layer; a plurality of bonding members, wherein each of the plurality of bonding members extends within the first bonding layer and the second bonding layer, wherein the plurality of bonding members includes a connecting member electrically connected to a first conductive pattern in the first die and a second conductive pattern in the second die, and a dummy member electrically isolated from the first conductive pattern and the second conductive pattern; and an inductor disposed within the first bonding layer and the second bonding layer. A method of manufacturing a semiconductor device includes bonding a first inductive coil of a first die to a second inductive coil of a second die to form an inductor.

Abstract: An example of a shipping fluid for a printhead device includes at least one solvent, at least one additive, at least one surfactant, and water. The solvent includes at least one carbohydrate in an amount of about 10 wt % or more based on the total weight of the shipping fluid. The shipping fluid does not contain a visible colorant, which absorbs light in wavelengths of greater than 400 nm and wavelengths of less than 700 nm. The shipping fluid is free of n-alkyl pyrrolidone.

Abstract: Aspects of the disclosure provide a circuit for peak voltage detection. The circuit includes a diode-based peak detector and a compensation circuit. The diode-based peak detector has a first diode, and is configured to receive a signal for peak voltage detection and generate a first voltage of a stable level indicative of a peak voltage of the signal based on the first diode. The compensation circuit has a second diode. The compensation circuit is configured to receive the first voltage and generate a second voltage of a stable level that is independent of the first diode.

Abstract: Aspects of the disclosure provide a circuit for peak voltage detection. The circuit includes a diode-based peak detector and a compensation circuit. The diode-based peak detector has a first diode, and is configured to receive a signal for peak voltage detection and generate a first voltage of a stable level indicative of a peak voltage of the signal based on the first diode. The compensation circuit has a second diode. The compensation circuit is configured to receive the first voltage and generate a second voltage of a stable level that is independent of the first diode.

Abstract: In one embodiment, a kit for making a display includes a first medium, a support element, and first and second wave generators. The first medium is foldable according to scoring to form a display with a cavity. The element is attachable or attached to a back surface of the folded first medium, to be positioned at least partially within the cavity. The first wave generator is attachable or attached to the back surface, to receive signals from a signal generator and produce mechanical waves that cause the first medium to vibrate and generate audible acoustic waves within a first frequency range. The second wave generator is attachable or attached to the element, to receive signals from the signal generator and produce mechanical waves that cause the element to vibrate and generate audible acoustic waves within a second frequency range, different from the first frequency range.

Abstract: In one embodiment, a kit for making a display includes a first medium, a support element, and first and second wave generators. The first medium is foldable according to scoring to form a display with a cavity. The element is attachable or attached to a back surface of the folded first medium, to be positioned at least partially within the cavity. The first wave generator is attachable or attached to the back surface, to receive signals from a signal generator and produce mechanical waves that cause the first medium to vibrate and generate audible acoustic waves within a first frequency range. The second wave generator is attachable or attached to the element, to receive signals from the signal generator and produce mechanical waves that cause the element to vibrate and generate audible acoustic waves within a second frequency range, different from the first frequency range.

Abstract: A preferred skin tone region is determined within a luminance-chrominance color space for each of a plurality of luminance values. Additional preferred skin tone regions are determined by interpolation in view of the initially determined preferred skin tone regions. An ellipsoid skin-color model is generated in the luminance-chrominance color space based on the preferred skin tone regions. The ellipsoid skin-color is used to detect a skin color pixel in an image and adjust one or more color values for the skin color pixel.