Abstract: A system comprising: a first high voltage unit that is coupled via a high voltage supply cable to a second high voltage unit; a transformer that is configured to magnetically couple the high voltage supply cable to windings of a transformer; and a detection unit that is configured to monitor a windings signal developed in the windings of the transformer to detect a first high voltage unit arc formed within the first high voltage unit and to detect a second high voltage unit arc formed within the second high voltage unit.

Abstract: A system for zapping a wafer, the system includes a pulse generator; a sensor; a first conductive interface; a second conductive interface; a controller; wherein the pulse generator is configured to generate zapping pulses; wherein the first conductive interface is configured to provide the zapping pulses to a first location of a backside insulating layer of a wafer; wherein the sensor is configured to monitor a coupling between the first conductive interface and the second conductive interface to provide a monitoring result; wherein the monitoring occurs while the second conductive interface contacts a second location of the backside insulating layer; and wherein the controller is configured to control a generation of the zapping pulses in response to the monitoring result.

Abstract: A system for zapping a wafer, the system may include a pulse generation unit that is configured to generate (a) first zapping pulses for causing a breakdown in a first location of a backside insulating layer of a wafer, and (b) second zapping pulses for causing a breakdown in a second location of the backside insulating layer of the wafer; a first conductive interface that is configured to convey the first zapping pulses to the first location, while contacting the first location; a second conductive interface that is configured to convey the second zapping pulses to the second location, while contacting the second location; and wherein the first location differs from the second location.

Abstract: A system for zapping a wafer, the system may include a pulse generation unit that is configured to generate (a) first zapping pulses for causing a breakdown in a first location of a backside insulating layer of a wafer, and (b) second zapping pulses for causing a breakdown in a second location of the backside insulating layer of the wafer; a first conductive interface that is configured to convey the first zapping pulses to the first location, while contacting the first location; a second conductive interface that is configured to convey the second zapping pulses to the second location, while contacting the second location; and wherein the first location differs from the second location.

Abstract: A system comprising: a first high voltage unit that is coupled via a high voltage supply cable to a second high voltage unit; a transformer that is configured to magnetically couple the high voltage supply cable to windings of a transformer; and a detection unit that is configured to monitor a windings signal developed in the windings of the transformer to detect a first high voltage unit arc formed within the first high voltage unit and to detect a second high voltage unit arc formed within the second high voltage unit.

Abstract: A system for zapping a wafer, the system includes a pulse generator; a sensor; a first conductive interface; a second conductive interface; a controller; wherein the pulse generator is configured to generate zapping pulses; wherein the first conductive interface is configured to provide the zapping pulses to a first location of a backside insulating layer of a wafer; wherein the sensor is configured to monitor a coupling between the first conductive interface and the second conductive interface to provide a monitoring result; wherein the monitoring occurs while the second conductive interface contacts a second location of the backside insulating layer; and wherein the controller is configured to control a generation of the zapping pulses in response to the monitoring result.

Abstract: A modulator of a charged particle beam system is arranged to generate a modulation signal that is provided to an inductor, which receives the modulation signal and modulates, by inductance, a supply voltage signal for the charged particle beam system. Modulation of the supply voltage signal changes a focal length of a charged particle beam produced by the charged particle beam system.

Abstract: A drinking aid device (10) for a disposable cup (40), the device comprising: a wall assembly (20); a bored lid assembly (30), wherein the top (32) thereof is used as the bottom of the drinking aid device (10); and attaching mechanism (26, 36) of the wall assembly (20) to the bored lid assembly (30) in a sealed manner; thereby allowing drinking the content of the cup (40) from the drinking aid device rather than from the lid assembly; wherein: the wall assembly (20) and the bored lid assembly (30) are separate entities; the wall assembly being designed to allow storing a plurality of entities thereof in an interlaced manner; and the lid assembly being designed to allow storing a plurality of entities thereof in an interlaced manner.

Abstract: A modulator of a charged particle beam system is arranged to generate a modulation signal that is provided to an inductor, which receives the modulation signal and modulates, by inductance, a supply voltage signal for the charged particle beam system. Modulation of the supply voltage signal changes a focal length of a charged particle beam produced by the charged particle beam system.

Abstract: A puzzle-type amusement device comprises a stack of rotatable discs formed with two openings adapted to be aligned with each other; and a ball receivable through one of the openings in the top disc so as to pass through the openings aligned therewith in the intermediate discs to rest against the bottom disc. One opening in each intermediate diswc is bounded at one side by a tapered surface curved about the axis of rotation of the disc so as to constitute an inclined tract permitting the ball, when received in such opening, to be rolled along the inclined track out of the respective opening in the direction towards the top disc. The other opening in each intermediate disc is bounded on all its sides by an untapered surface such that the opening constitutes a trap preventing the ball, when received in such opening, from being rolled out of the opening in the direction towards the top disc.