Patents by Inventor Tuyoshi Itou

Tuyoshi Itou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040131853
    Abstract: A process for manufacturing multilayer pellets having a core-sheath structure with a molding material forming a sheath which covers the outer circumference of another molding material forming a core, which includes (a) supplying the core material and the sheath material to a die extruder having multiple extrusion-forming parts arranged along a circumference, (b) extruding multiple multilayer strands from the extrusion-forming parts by covering around the outer circumference of the core material concentrically with the sheath material, and (c) cutting the extruded multilayer strands to manufacture multilayer pellets.
    Type: Application
    Filed: November 10, 2003
    Publication date: July 8, 2004
    Applicant: Sumika Color Company, Limited
    Inventors: Naohiko Mushiake, Kenji Kodama, Hiroyuki Mori, Sumio Hamada, Tuyoshi Itou, Jun Komai
  • Patent number: 6669986
    Abstract: A process for manufacturing multilayer pellets having a core-sheath structure with a molding material forming a sheath which covers the outer circumference of another molding material forming a core, which includes (a) supplying the core material and the sheath material to a die extruder having multiple extrusion-forming parts arranged along a circumference, (b) extruding multiple multilayer strands from the extrusion-forming parts by covering around the outer circumference of the core material concentrically with the sheath material, and (c) cutting the extruded multilayer strands to manufacture multilayer pellets.
    Type: Grant
    Filed: March 1, 2000
    Date of Patent: December 30, 2003
    Assignee: Sumika Color Company, Limited
    Inventors: Naohiko Mushiake, Kenji Kodama, Hiroyuki Mori, Sumio Hamada, Tuyoshi Itou, Jun Komai