Abstract: A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.

Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a first slot is through a thickness of the substrate, and a second slot is through the thickness of the substrate, where the first slot is parallel to the second slot. In an embodiment, a metal plate is provided on the PCB. In an embodiment the metal plate comprises a first portion over the first surface of the substrate between the first slot and the second slot, a second portion connected to the first portion, wherein the second portion is in the first slot, and a third portion connected to the first portion, wherein the third portion is in the second slot.

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

Abstract: Methods, apparatus, systems, and articles of manufacture to increase rigidity of printed circuit boards are disclosed. An apparatus includes a stack of insulative layers. The stack includes a first face and a second face opposite the first face. The apparatus further includes a plurality of conductive layers. Ones of the conductive layers between adjacent ones of the insulative layers. The apparatus also includes a metal stiffener extending along a perimeter of a first one of the insulative layers. The metal stiffener has a thickness measured in a direction perpendicular to the first face. The thickness is less than a distance between the first and second faces.

Abstract: Circuit apparatus are disclosed. An example circuit apparatus includes a body including a plurality of first traces formed on the body, and a plurality of openings formed through the body and located between respective ones of the first traces. The openings provide airflow to a fan module of an electronic device through the body of the circuit apparatus.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a first side and an opposite second side. A first air mover can be coupled to the first side of the support structure, where a motor of the first air mover is on the support structure and an air mover controller where the air mover controller controls the first air mover through trace in the support structure. In some examples, a second air mover can be located on the second side of the support structure, where a motor of the second air mover is on the second side of the support structure and the second air mover is controlled by the air mover controller through trace in the support structure. The support structure can be a printed circuit board or motherboard.

Abstract: In one embodiment, a system includes a first circuit defining recesses along an edge of the first circuit board, and a second circuit board defining fins extending from at least one outer edge of the second circuit board. The fins of the second circuit board are positioned within the recesses of the second circuit board to connect the circuit boards in a co-planar manner. The fins and recesses may be shaped to provide an interlocking connection of the first and second circuit boards in the co-planar direction.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber that includes ionized fluid and an adjustable polarization layer coupled to the vapor chamber. The adjustable polarization layer can be used to direct a flow of the ionized fluid in the vapor chamber towards one or more heat sources. In some examples, the ionized fluid is ionized water and the adjustable polarization layer is polyester (PET) film that includes a plurality of electrode stripes.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a support structure that includes a radiation shield groove that extends past a surface of the support structure and into the support structure, a radiation source on the substrate, and a radiation shield around the radiation source, where the radiation shield includes a wall secured to the support structure and a groove channel coupling wall that extends past a surface of the support structure and into the radiation shield groove.

Abstract: Electronic devices with moveable display screens are described herein. An example electronic device includes a lid having a first display screen and a base. The lid is moveably coupled to the base. The base includes a housing having a top side and a bottom side, a physical keyboard to be accessed on the top side of the housing, and a second display screen moveable between a first position in which the keyboard is exposed and a second position in which the second display screen covers the keyboard.

Abstract: Fan module interconnect apparatus are disclosed. An example fan module includes a fan and a fan housing to carry the fan. The fan is to rotate in the fan housing. A flange extends from the fan housing and including signal paths to provide an interconnect to electrically couple at least portions of a first electrical circuit and a second electrical circuit of an electronic device.