Abstract: Multiple systems for providing liquid and air cooling for IT components is disclosed. The system includes a first module with at least one dry cooler that supplies liquid cooling to at least one liquid heat exchange device. The system also includes a second module with a first chamber that has a filter that accepts air from an outside source, a second chamber with at least one fan that moves the filtered air to cool one or more IT units resulting in heated air; and a third chamber that exhausts the heated air to the outside. A liquid heat exchange device provides liquid cooling to the one or more IT units.

Abstract: Multiple systems for providing liquid and air cooling for IT components is disclosed. The modular system for cooling Information Technology (IT) includes a first module with at least one dry cooler that supplies liquid cooling to at least one liquid heat exchange device, and a second module with at least one liquid heat exchange device that provides liquid cooling to a facility with one or more IT units. The modular system may also provide cooling liquid to an air to liquid heat exchange device of the facility.

Abstract: Multiple systems and devices for providing liquid and air cooling for IT components is disclosed. The system includes a module comprising at least one dry cooler and at least one liquid heat exchange device. The module includes a primary cooling loop with the at least one dry cooler and the at least one liquid heat exchange device. The system also includes a secondary loop that includes the at least one liquid heat exchange device and one or more IT units in a facility. The system includes a path for air cooling the one or more IT units in the facility that includes at least one air intake from outside the facility that supplies air for cooling the one or more IT units.

Abstract: A computing device includes a bezel and an enclosure. The bezel includes a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat at least a volume of air entering the enclosure.

Abstract: A computing device includes a bezel and an enclosure. The bezel includes an air circulation component and a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat an internal volume of the enclosure.

Abstract: A modular information technology component includes: a modular over-rack component; and an information technology component, in which the modular over-rack component includes a set of information technology component openings, in which the set of information technology component openings enables mounting of the information technology component into the modular over-rack component.

Abstract: A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.

Abstract: A computing device includes a heat dissipation component, a heating or cooling apparatus, and a printed circuit board. The heating or cooling apparatus includes a heating or cooling component and a wire, and the heating or cooling component is affixed to a surface of the heat dissipation component. The printed circuit board includes a printed circuit board component, and the heat dissipation component is affixed to the printed circuit board component and configured to heat or cool the printed circuit board component.

Abstract: A computing device includes a bezel and an enclosure. The bezel includes an air circulation component and a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat an internal volume of the enclosure.

Abstract: An improved method and system for controlling the powering-on of an electronic device when initially the internal temperature is below a safe threshold. The method and system can preheat the electronic device until it is at a safe temperature in which to safely power-on the electronic device. Alternatively or in addition, the method and system can alert a user if the temperature is below a threshold and proceed to power-on when the temperature is above the threshold.

Abstract: Embodiments of the present invention provide a method for powering an electronic device with a battery or other backup power supply when an external power source is removed from the electronic device. The method determines if the ambient temperature of an electronic device is below a threshold and if the ambient temperature is below the threshold adjusting a minimum state of charge of the battery to prolong the life of the battery.

Abstract: A computing device includes a bezel and an enclosure. The bezel includes a heater apparatus. The enclosure includes a plurality of hardware components, and the bezel is affixed to a frontside of the enclosure and configured to heat at least a volume of air entering the enclosure.

Abstract: An improved method and system for heating and cooling an electronic device, when internal temperatures are below safe operating ranges. To do so, the system selectively heats or cools each zone of the electronic device. This may be done by individual heaters and/or cooling system for each separate zones. Alternatively, or in addition too, the system can selectively open and close baffles, causing fresh ambient air to enter and/or recirculate heated air in a device’s enclosure. This keeps sensitive components of the computing device, such as processors and memory from suffering damage, by operating them at temperatures that are either too cold or too warm.